DE60024211D1 - Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung - Google Patents

Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung

Info

Publication number
DE60024211D1
DE60024211D1 DE60024211T DE60024211T DE60024211D1 DE 60024211 D1 DE60024211 D1 DE 60024211D1 DE 60024211 T DE60024211 T DE 60024211T DE 60024211 T DE60024211 T DE 60024211T DE 60024211 D1 DE60024211 D1 DE 60024211D1
Authority
DE
Germany
Prior art keywords
projection apparatus
lithographic projection
avoiding device
collision avoiding
collision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60024211T
Other languages
English (en)
Other versions
DE60024211T2 (de
Inventor
Dr Kwan
De Pasch Engelbertus Anton Van
Andreas Bernardus Gerar Ariens
Schmidt Robert-Han Munnig
Jan Frederik Hoogkamp
Edwin Johan Buis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60024211D1 publication Critical patent/DE60024211D1/de
Publication of DE60024211T2 publication Critical patent/DE60024211T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60024211T 1999-12-21 2000-12-19 Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung Expired - Fee Related DE60024211T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP99310289 1999-12-21
EP99310289 1999-12-21
EP00202955 2000-08-25
EP00202955 2000-08-25

Publications (2)

Publication Number Publication Date
DE60024211D1 true DE60024211D1 (de) 2005-12-29
DE60024211T2 DE60024211T2 (de) 2006-07-20

Family

ID=26072627

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60024211T Expired - Fee Related DE60024211T2 (de) 1999-12-21 2000-12-19 Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung

Country Status (5)

Country Link
US (1) US6498350B2 (de)
JP (2) JP3913468B2 (de)
KR (1) KR100595045B1 (de)
DE (1) DE60024211T2 (de)
TW (1) TWI223734B (de)

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US6591160B2 (en) * 2000-12-04 2003-07-08 Asyst Technologies, Inc. Self teaching robot
JP2002280283A (ja) * 2001-03-16 2002-09-27 Canon Inc 基板処理装置
JPWO2003010802A1 (ja) * 2001-07-26 2004-11-18 株式会社ニコン ステージ装置、露光装置及び露光方法、並びにデバイス製造方法
JPWO2003015139A1 (ja) * 2001-08-08 2004-12-02 株式会社ニコン ステージシステム及び露光装置、並びにデバイス製造方法
KR100436213B1 (ko) * 2001-12-17 2004-06-16 미래산업 주식회사 반도체 소자 테스트 핸들러용 소자 정렬장치
DE10212344A1 (de) * 2002-03-15 2003-10-09 Kleo Halbleitertechnik Gmbh Vorrichtung zum Belichten von Substratmaterialien
EP1372038B1 (de) * 2002-06-13 2005-11-23 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
EP1477852A1 (de) * 2003-05-16 2004-11-17 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergestellter Artikel
TWI246114B (en) * 2002-09-24 2005-12-21 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG121844A1 (en) * 2002-12-20 2006-05-26 Asml Netherlands Bv Device manufacturing method
KR101178756B1 (ko) * 2003-04-11 2012-08-31 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법
US7245047B2 (en) * 2003-05-01 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2216685B1 (de) * 2003-06-19 2012-06-27 Nikon Corporation Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
JP2005294468A (ja) * 2004-03-31 2005-10-20 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
US7184128B2 (en) * 2004-06-25 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2006022200A1 (ja) * 2004-08-24 2008-05-08 株式会社ニコン ステージ装置及び露光装置
JP3919782B2 (ja) * 2004-10-08 2007-05-30 キヤノン株式会社 露光装置及びデバイス製造方法
US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101280166B1 (ko) * 2004-11-25 2013-06-28 가부시키가이샤 니콘 이동체 시스템, 노광 장치 및 디바이스 제조 방법
JP4677267B2 (ja) * 2005-04-04 2011-04-27 キヤノン株式会社 平面ステージ装置及び露光装置
US7665981B2 (en) 2005-08-25 2010-02-23 Molecular Imprints, Inc. System to transfer a template transfer body between a motion stage and a docking plate
KR101388345B1 (ko) 2005-09-09 2014-04-22 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
WO2007055237A1 (ja) 2005-11-09 2007-05-18 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
DE102006008080A1 (de) * 2006-02-22 2007-08-30 Kleo Maschinenbau Ag Belichtungsanlage
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
CN100468212C (zh) * 2006-09-22 2009-03-11 上海微电子装备有限公司 双台定位交换系统
KR100781971B1 (ko) * 2006-11-28 2007-12-06 삼성전자주식회사 트윈 스캔 노광설비의 웨이퍼 스테이지 모듈 및 그의제어방법
TWI643035B (zh) 2007-12-28 2018-12-01 日商尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
CN101551599B (zh) * 2009-04-03 2011-07-20 清华大学 一种光刻机硅片台双台交换系统
JP2010261549A (ja) * 2009-05-11 2010-11-18 Sony Corp 制動装置、ステージ移動装置、ワーク処理装置及び制動方法
CN102487030B (zh) * 2010-12-06 2013-12-18 上海微电子装备有限公司 双工件台夹持机构
CN102495529B (zh) * 2011-11-12 2013-09-18 哈尔滨工业大学 一种过梁式双导轨双驱步进扫描双硅片台交换装置与方法
CN102495527B (zh) * 2011-11-12 2013-09-18 哈尔滨工业大学 一种基于单/双驱动步进扫描的双工件台交换装置与方法
WO2013160123A1 (en) * 2012-04-27 2013-10-31 Asml Netherlands B.V. Lithographic apparatus comprising an actuator, and method for protecting such actuator
CN103019045A (zh) * 2012-12-11 2013-04-03 清华大学 一种具有防撞功能的硅片台
US9355767B2 (en) * 2014-09-03 2016-05-31 Uchicago Argonne, Llc Undulator with dynamic compensation of magnetic forces
CN104465944A (zh) * 2014-11-03 2015-03-25 李良学 一种led点胶封装控制系统
CN105807575B (zh) * 2014-12-30 2017-08-25 上海微电子装备有限公司 一种硅片边缘保护装置
CN105487346A (zh) * 2016-01-14 2016-04-13 哈尔滨工业大学 基于电磁阻尼的动磁钢磁浮双工件台矢量圆弧换台方法及装置
CN105425552A (zh) * 2016-01-14 2016-03-23 哈尔滨工业大学 基于平面光栅测量动磁钢气磁结合气浮双工件台矢量圆弧换台方法及装置
US11003095B2 (en) 2016-09-13 2021-05-11 Asml Netherlands B.V. Positioning system and lithographic apparatus
CN108121165B (zh) * 2016-11-29 2020-01-24 上海微电子装备（集团）股份有限公司 粗动台防转装置和粗动台组件
CN110196532B (zh) * 2018-02-27 2021-03-16 上海微电子装备（集团）股份有限公司 光刻机安全快门装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP4029181B2 (ja) * 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置
JPH1198886A (ja) * 1997-09-16 1999-04-09 Canon Inc テーブル駆動装置
JPH11224854A (ja) * 1997-11-22 1999-08-17 Nikon Corp 露光装置及び露光方法、並びにデバイス製造方法
JP2000092889A (ja) * 1998-09-11 2000-03-31 Canon Inc テーブル位置決め装置および該テーブル位置決め装置を用いた半導体露光装置
US6836093B1 (en) * 1999-12-21 2004-12-28 Nikon Corporation Exposure method and apparatus

Also Published As

Publication number Publication date
JP3913468B2 (ja) 2007-05-09
DE60024211T2 (de) 2006-07-20
KR20010067454A (ko) 2001-07-12
JP2001223159A (ja) 2001-08-17
JP4592654B2 (ja) 2010-12-01
US6498350B2 (en) 2002-12-24
TWI223734B (en) 2004-11-11
KR100595045B1 (ko) 2006-07-03
US20010004105A1 (en) 2001-06-21
JP2006319366A (ja) 2006-11-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee