DE69933257D1 - Lithographische Vorrichtung - Google Patents
Lithographische VorrichtungInfo
- Publication number
- DE69933257D1 DE69933257D1 DE69933257T DE69933257T DE69933257D1 DE 69933257 D1 DE69933257 D1 DE 69933257D1 DE 69933257 T DE69933257 T DE 69933257T DE 69933257 T DE69933257 T DE 69933257T DE 69933257 D1 DE69933257 D1 DE 69933257D1
- Authority
- DE
- Germany
- Prior art keywords
- lithographic device
- lithographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/0064—Health, life-saving or fire-fighting equipment
- F21V33/0076—Safety or security signalisation, e.g. smoke or burglar alarms, earthquake detectors; Self-defence devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/06—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for aircraft runways or the like
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Computer Security & Cryptography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98201634 | 1998-05-15 | ||
EP98201634 | 1998-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933257D1 true DE69933257D1 (de) | 2006-11-02 |
DE69933257T2 DE69933257T2 (de) | 2007-04-26 |
Family
ID=8233731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933257T Expired - Lifetime DE69933257T2 (de) | 1998-05-15 | 1999-05-12 | Lithographische Vorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6459472B1 (de) |
JP (1) | JP3626627B2 (de) |
KR (1) | KR100588120B1 (de) |
DE (1) | DE69933257T2 (de) |
TW (1) | TW533336B (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW509823B (en) * | 2000-04-17 | 2002-11-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
TW575771B (en) * | 2000-07-13 | 2004-02-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
TW591342B (en) * | 2000-11-30 | 2004-06-11 | Asml Netherlands Bv | Lithographic projection apparatus and integrated circuit manufacturing method using a lithographic projection apparatus |
US6576912B2 (en) * | 2001-01-03 | 2003-06-10 | Hugo M. Visser | Lithographic projection apparatus equipped with extreme ultraviolet window serving simultaneously as vacuum window |
JP2004519868A (ja) * | 2001-04-17 | 2004-07-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Euvに透明な境界構造 |
JP4235480B2 (ja) * | 2002-09-03 | 2009-03-11 | キヤノン株式会社 | 差動排気システム及び露光装置 |
CN100476585C (zh) * | 2002-12-23 | 2009-04-08 | Asml荷兰有限公司 | 具有可扩展薄片的杂质屏蔽 |
SG10201803122UA (en) | 2003-04-11 | 2018-06-28 | Nikon Corp | Immersion lithography apparatus and device manufacturing method |
TWI474380B (zh) | 2003-05-23 | 2015-02-21 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
US7456932B2 (en) * | 2003-07-25 | 2008-11-25 | Asml Netherlands B.V. | Filter window, lithographic projection apparatus, filter window manufacturing method, device manufacturing method and device manufactured thereby |
JP2005101537A (ja) * | 2003-08-29 | 2005-04-14 | Canon Inc | 露光装置及びそれを用いたデバイスの製造方法 |
US6894765B2 (en) * | 2003-10-14 | 2005-05-17 | Micron Technology, Inc. | Methods and systems for controlling radiation beam characteristics for microlithographic processing |
JPWO2005083759A1 (ja) * | 2004-02-27 | 2007-08-09 | 株式会社ニコン | 露光装置、及び微細パターンを有するデバイスの製造方法 |
US7463336B2 (en) * | 2004-04-14 | 2008-12-09 | Asml Netherlands B.V. | Device manufacturing method and apparatus with applied electric field |
EP2966670B1 (de) | 2004-06-09 | 2017-02-22 | Nikon Corporation | Belichtungsvorrichtung und vorrichtungsherstellungsverfahren |
JP2005353986A (ja) * | 2004-06-14 | 2005-12-22 | Canon Inc | 露光装置 |
US7307263B2 (en) * | 2004-07-14 | 2007-12-11 | Asml Netherlands B.V. | Lithographic apparatus, radiation system, contaminant trap, device manufacturing method, and method for trapping contaminants in a contaminant trap |
US7361911B2 (en) * | 2004-12-09 | 2008-04-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7202934B2 (en) * | 2004-12-20 | 2007-04-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7880860B2 (en) * | 2004-12-20 | 2011-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7414251B2 (en) | 2004-12-28 | 2008-08-19 | Asml Netherlands B.V. | Method for providing an operable filter system for filtering particles out of a beam of radiation, filter system, apparatus and lithographic apparatus comprising the filter system |
US7692169B2 (en) | 2004-12-28 | 2010-04-06 | Asml Netherlands B.V. | Method for filtering particles out of a beam of radiation and filter for a lithographic apparatus |
JP2006269942A (ja) * | 2005-03-25 | 2006-10-05 | Canon Inc | 露光装置及びデバイス製造方法 |
US20070085984A1 (en) * | 2005-10-18 | 2007-04-19 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method and device manufactured thereby |
JP4922638B2 (ja) * | 2005-03-29 | 2012-04-25 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置、シール、デバイス製造方法、コンピュータプログラム、およびデータ記録媒体 |
US7233010B2 (en) * | 2005-05-20 | 2007-06-19 | Asml Netherlands B.V. | Radiation system and lithographic apparatus |
US7397056B2 (en) * | 2005-07-06 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus, contaminant trap, and device manufacturing method |
US20070076292A1 (en) * | 2005-09-27 | 2007-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fully electric field shielding reticle pod |
US7332731B2 (en) * | 2005-12-06 | 2008-02-19 | Asml Netherlands, B.V. | Radiation system and lithographic apparatus |
US7468521B2 (en) * | 2005-12-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20080060974A1 (en) * | 2006-02-21 | 2008-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask carrier treatment to prevent haze and ESD damage |
US7453071B2 (en) * | 2006-03-29 | 2008-11-18 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus comprising same |
US7368733B2 (en) | 2006-03-30 | 2008-05-06 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus comprising same |
US7442948B2 (en) * | 2006-05-15 | 2008-10-28 | Asml Netherlands B.V. | Contamination barrier and lithographic apparatus |
DE102006044591A1 (de) * | 2006-09-19 | 2008-04-03 | Carl Zeiss Smt Ag | Optische Anordnung, insbesondere Projektionsbelichtungsanlage für die EUV-Lithographie, sowie reflektives optisches Element mit verminderter Kontamination |
JP2008277585A (ja) * | 2007-04-27 | 2008-11-13 | Canon Inc | 露光装置の洗浄装置及び露光装置 |
NL2005741A (en) * | 2009-12-23 | 2011-06-27 | Asml Netherlands Bv | Lithographic apparatus and method. |
NL2008250A (en) * | 2011-03-08 | 2012-09-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4690528A (en) * | 1983-10-05 | 1987-09-01 | Nippon Kogaku K. K. | Projection exposure apparatus |
US4692934A (en) | 1984-11-08 | 1987-09-08 | Hampshire Instruments | X-ray lithography system |
US4648106A (en) | 1984-11-21 | 1987-03-03 | Micronix Corporation | Gas control for X-ray lithographic system |
EP0947882B1 (de) | 1986-07-11 | 2006-03-29 | Canon Kabushiki Kaisha | Verkleinerndes Projektionsbelichtungssystem des Reflexionstyps für Röntgenstrahlung |
US5821175A (en) | 1988-07-08 | 1998-10-13 | Cauldron Limited Partnership | Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface |
US5063586A (en) | 1989-10-13 | 1991-11-05 | At&T Bell Laboratories | Apparatus for semiconductor lithography |
US5315629A (en) | 1990-10-10 | 1994-05-24 | At&T Bell Laboratories | Ringfield lithography |
US5212588A (en) | 1991-04-09 | 1993-05-18 | The United States Of America As Represented By The United States Department Of Energy | Reflective optical imaging system for extreme ultraviolet wavelengths |
JPH0567558A (ja) | 1991-09-06 | 1993-03-19 | Nikon Corp | 露光方法 |
JP3127511B2 (ja) | 1991-09-19 | 2001-01-29 | 株式会社日立製作所 | 露光装置および半導体装置の製造方法 |
US5353323A (en) | 1994-02-02 | 1994-10-04 | Kabushiki Kaisha Toshiba | X-ray exposure apparatus |
-
1999
- 1999-04-30 US US09/302,850 patent/US6459472B1/en not_active Expired - Lifetime
- 1999-05-12 TW TW088107692A patent/TW533336B/zh not_active IP Right Cessation
- 1999-05-12 DE DE69933257T patent/DE69933257T2/de not_active Expired - Lifetime
- 1999-05-12 KR KR1019990016979A patent/KR100588120B1/ko not_active IP Right Cessation
- 1999-05-12 JP JP13162699A patent/JP3626627B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100588120B1 (ko) | 2006-06-09 |
JP2000058443A (ja) | 2000-02-25 |
US6459472B1 (en) | 2002-10-01 |
KR19990088230A (ko) | 1999-12-27 |
JP3626627B2 (ja) | 2005-03-09 |
TW533336B (en) | 2003-05-21 |
DE69933257T2 (de) | 2007-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |