DE3480681D1 - Steckverbinder und verpackungseinrichtung fuer eine halbleitervorrichtung, die diesen steckverbinder benutzt. - Google Patents

Steckverbinder und verpackungseinrichtung fuer eine halbleitervorrichtung, die diesen steckverbinder benutzt.

Info

Publication number
DE3480681D1
DE3480681D1 DE8484304015T DE3480681T DE3480681D1 DE 3480681 D1 DE3480681 D1 DE 3480681D1 DE 8484304015 T DE8484304015 T DE 8484304015T DE 3480681 T DE3480681 T DE 3480681T DE 3480681 D1 DE3480681 D1 DE 3480681D1
Authority
DE
Germany
Prior art keywords
connector
semiconductor device
packaging
packaging device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484304015T
Other languages
English (en)
Inventor
Tetsuro Minemura
Hisashi Ando
Yoshiaki Kita
Isao Ikuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3480681D1 publication Critical patent/DE3480681D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0308—Shape memory alloy [SMA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Laminated Bodies (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DE8484304015T 1983-06-15 1984-06-14 Steckverbinder und verpackungseinrichtung fuer eine halbleitervorrichtung, die diesen steckverbinder benutzt. Expired - Lifetime DE3480681D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58105652A JPS59230741A (ja) 1983-06-15 1983-06-15 形状記憶複合材料

Publications (1)

Publication Number Publication Date
DE3480681D1 true DE3480681D1 (de) 1990-01-11

Family

ID=14413375

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484304015T Expired - Lifetime DE3480681D1 (de) 1983-06-15 1984-06-14 Steckverbinder und verpackungseinrichtung fuer eine halbleitervorrichtung, die diesen steckverbinder benutzt.

Country Status (5)

Country Link
US (1) US4950173A (de)
EP (1) EP0130719B1 (de)
JP (1) JPS59230741A (de)
CA (1) CA1203862A (de)
DE (1) DE3480681D1 (de)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61199074U (de) * 1985-05-31 1986-12-12
US5038467A (en) * 1989-11-09 1991-08-13 Advanced Interconnections Corporation Apparatus and method for installation of multi-pin components on circuit boards
US5046954A (en) * 1991-01-31 1991-09-10 Amp Incorporated Planar electrical connector
US5169331A (en) * 1991-05-01 1992-12-08 Group Dekko International Lampholder lead wire connector
US5295214A (en) * 1992-11-16 1994-03-15 International Business Machines Corporation Optical module with tolerant wave soldered joints
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5510721A (en) * 1994-12-19 1996-04-23 Ford Motor Company Method and adjustment for known good die testing using resilient conductive straps
US5810609A (en) 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5818748A (en) * 1995-11-21 1998-10-06 International Business Machines Corporation Chip function separation onto separate stacked chips
US5781031A (en) * 1995-11-21 1998-07-14 International Business Machines Corporation Programmable logic array
US5903059A (en) * 1995-11-21 1999-05-11 International Business Machines Corporation Microconnectors
EP0836113A3 (de) * 1996-10-14 2000-08-02 Konica Corporation Filmpackung mit Aufnahmeobjektiv und elektronischem Blitzgerät
WO1998038700A1 (en) * 1997-02-28 1998-09-03 Cornell Research Foundation, Inc. Self-assembled low-insertion force connector assembly
DE19735409C2 (de) * 1997-08-14 2000-04-06 Kathrein Werke Kg Verbindungseinrichtung
CA2213590C (en) * 1997-08-21 2006-11-07 Keith C. Carroll Flexible circuit connector and method of making same
US6249135B1 (en) * 1997-09-19 2001-06-19 Fujitsu Limited Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage
US6142789A (en) * 1997-09-22 2000-11-07 Silicon Graphics, Inc. Demateable, compliant, area array interconnect
DE29721298U1 (de) * 1997-12-02 1998-02-26 Festo Ag & Co Steckverbindungseinrichtung
US6037667A (en) * 1998-08-24 2000-03-14 Micron Technology, Inc. Socket assembly for use with solder ball
US6164993A (en) * 1999-02-12 2000-12-26 Micron Technology, Inc. Zero insertion force sockets using negative thermal expansion materials
US6179625B1 (en) 1999-03-25 2001-01-30 International Business Machines Corporation Removable interlockable first and second connectors having engaging flexible members and process of making same
US6562545B1 (en) 1999-09-17 2003-05-13 Micron Technology, Inc. Method of making a socket assembly for use with a solder ball
US6494508B1 (en) * 1999-11-23 2002-12-17 E. J. Brooks Company Tamper evident security seal
US6464513B1 (en) * 2000-01-05 2002-10-15 Micron Technology, Inc. Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same
US6298552B1 (en) * 2000-02-10 2001-10-09 Hon Hai Precision Ind. Co., Ltd. Method for making socket connector
US6392144B1 (en) * 2000-03-01 2002-05-21 Sandia Corporation Micromechanical die attachment surcharge
US6220877B1 (en) * 2000-05-05 2001-04-24 Alcoa Fujikura Limited Monolithic terminal interface
JP3782289B2 (ja) * 2000-07-06 2006-06-07 トキコーポレーション株式会社 形状記憶合金の処理方法および形状記憶合金
GB0019073D0 (en) * 2000-08-03 2000-09-27 Moore David F Microconnector
DE10051547A1 (de) * 2000-10-18 2002-04-25 Bosch Gmbh Robert Baugruppenträger für elektrische/elektronische Bauelemente
US6572389B2 (en) * 2000-12-14 2003-06-03 Intel Corporation Contact elements for surface mounting of burn-in socket
EP1382090A1 (de) * 2001-04-23 2004-01-21 Transition Automation, Inc. Anschlusshaltebefestigung mit feiner auflösung und leichtem entwurf
US7049693B2 (en) * 2001-08-29 2006-05-23 Micron Technology, Inc. Electrical contact array for substrate assemblies
JP3925147B2 (ja) * 2001-10-16 2007-06-06 モレックス インコーポレーテッド 回路基板間の接続装置
US6734511B2 (en) * 2001-11-02 2004-05-11 Taiwan Semiconductor Manufacturing Co. Ltd. Auto sensor function chip
US6691407B2 (en) * 2001-12-13 2004-02-17 Intel Corporation Methods for retaining assembled components
JP4213387B2 (ja) * 2002-01-10 2009-01-21 株式会社日立国際電気 超伝導回路の実装構造
JP3878041B2 (ja) * 2002-03-22 2007-02-07 株式会社日本マイクロニクス 接触子及びこれを用いた電気的接続装置
US6700800B2 (en) * 2002-06-14 2004-03-02 Intel Corporation Retainer for circuit board assembly and method for using the same
US20040163717A1 (en) * 2003-02-21 2004-08-26 Cookson Electronics, Inc. MEMS device assembly
US6808422B2 (en) * 2003-03-19 2004-10-26 Delphi Technologies, Inc. Filter insert for an electrical connector assembly
US7239065B2 (en) * 2003-07-08 2007-07-03 Tibion Corporation Electrostatic actuator with fault tolerant electrode structure
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
DE10344261A1 (de) * 2003-09-23 2005-05-04 Endress & Hauser Gmbh & Co Kg Leiterplatte mit einer Haltevorrichtung zum Halten bedrahteter elektronischer Bauteile, Verfahren zur Herstellung einer solchen Leiterplatte und deren Verwendung in einem Lötofen
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
JP3877735B2 (ja) * 2004-03-19 2007-02-07 アルプス電気株式会社 接続装置
WO2005096683A1 (ja) * 2004-03-31 2005-10-13 Mitsubishi Cable Industries, Ltd. 回路基板及びその製造方法及び回路基板を用いたジョイントボックス
US20050250379A1 (en) * 2004-05-05 2005-11-10 Adc Telecommunications, Inc. Hole adapter for a printed circuit board
US7118389B2 (en) * 2004-06-18 2006-10-10 Palo Alto Research Center Incorporated Stud bump socket
US7771803B2 (en) 2004-10-27 2010-08-10 Palo Alto Research Center Incorporated Oblique parts or surfaces
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
DE102005029325B4 (de) * 2005-06-24 2007-04-05 Junghans Feinwerktechnik Gmbh & Co. Kg Kontaktverbindung einer Zünderelektronik
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
FR2893448A1 (fr) * 2005-11-15 2007-05-18 St Microelectronics Sa Dispositif semi-conducteur a plusieurs puces de circuits integres assemblees et procede d'assemblage et de connexion electrique de puces de circuits integres
KR100654814B1 (ko) * 2006-01-03 2006-12-08 삼성전자주식회사 기판조립체
US7442046B2 (en) * 2006-05-15 2008-10-28 Sony Ericsson Mobile Communications Ab Flexible circuit connectors
DE102006027748A1 (de) * 2006-06-16 2007-12-20 Robert Bosch Gmbh Leiterplatte und Verfahren zur Herstellung einer lötfreien elektrischen Verbindung
CN201000930Y (zh) * 2006-08-02 2008-01-02 富士康(昆山)电脑接插件有限公司 电连接器
JP2008039502A (ja) * 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly
WO2008093175A1 (en) * 2007-02-02 2008-08-07 Fci Connection device
US20090146295A1 (en) * 2007-12-11 2009-06-11 Hidefumi Narita Ceramic substrate having thermal via
JP2009199809A (ja) * 2008-02-20 2009-09-03 Mitsumi Electric Co Ltd コネクタ、光伝送モジュールおよび光−電気伝送モジュール
US7963775B2 (en) * 2009-06-09 2011-06-21 Tyco Electronics Corporation Electrical connector having at least one hole with surface mount projections
US8757874B2 (en) * 2010-05-03 2014-06-24 National Instruments Corporation Temperature sensing system and method
JP2014063975A (ja) * 2012-08-31 2014-04-10 Nidec Copal Corp フレキシブルプリント配線板、及びそれを備えた機器
US8939778B2 (en) * 2013-01-10 2015-01-27 Hon Hai Precision Industry Co., Ltd. Electrcial socket with LGA type coil contacts for IC package
TWM468808U (zh) 2013-06-07 2013-12-21 Kingston Digital Inc 連接器及電子裝置
CN103419766B (zh) * 2013-08-07 2015-06-24 京西重工（上海）有限公司 真空助力器反应杆保持器及反应杆保持方法
US9570849B2 (en) * 2013-11-05 2017-02-14 Commscope Technologies Llc Float plate for blind matable electrical cable connectors
DE102014202359A1 (de) * 2014-02-10 2015-08-13 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Fixieren von Bauteilen

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
DE1915780A1 (de) * 1969-03-27 1970-10-08 Standard Elek K Lorenz Ag Elektrisches Verbindungselement
US3748108A (en) * 1970-04-07 1973-07-24 Us Army Thermally activated spring with improved thermal properties
US3670409A (en) * 1970-11-19 1972-06-20 Gte Automatic Electric Lab Inc Planar receptacle
DE2540943B2 (de) * 1975-09-13 1978-02-02 W.C. Heraeus Gmbh, 6450 Hanau Kontaktkoerper fuer einen elektrischen steckkontakt
GB2095480B (en) * 1981-02-26 1985-01-30 Goodlock Ltd Electrical contact
JPS57185680A (en) * 1981-05-08 1982-11-15 Fujitsu Ltd Method of coupling flexible printed board
JPS5949307B2 (ja) * 1981-09-25 1984-12-01 舟久保 煕康 形成記憶合金薄膜
JPS5871572A (ja) * 1981-10-23 1983-04-28 富士通株式会社 電気コネクタ
JPS5873973A (ja) * 1981-10-26 1983-05-04 日本電信電話株式会社 低温用コネクタ
US4487465A (en) * 1981-12-07 1984-12-11 Raychem Corporation Heat recoverable connecting device
JPS58105652A (ja) * 1981-12-18 1983-06-23 Meidensha Electric Mfg Co Ltd ル−プ式デ−タハイウエイシステムにおけるシステムダウン救済方法
CH660882A5 (de) * 1982-02-05 1987-05-29 Bbc Brown Boveri & Cie Werkstoff mit zweiweg-gedaechtniseffekt und verfahren zu dessen herstellung.
GB2130025A (en) * 1982-11-08 1984-05-23 Control Data Corp Memory board stacking module
JPS59146175A (ja) * 1983-02-10 1984-08-21 株式会社日立製作所 電気接続装置

Also Published As

Publication number Publication date
EP0130719A3 (en) 1986-02-05
EP0130719B1 (de) 1989-12-06
EP0130719A2 (de) 1985-01-09
JPS59230741A (ja) 1984-12-25
CA1203862A (en) 1986-04-29
US4950173A (en) 1990-08-21

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee