JPS61199074U - - Google Patents

Info

Publication number
JPS61199074U
JPS61199074U JP8185285U JP8185285U JPS61199074U JP S61199074 U JPS61199074 U JP S61199074U JP 8185285 U JP8185285 U JP 8185285U JP 8185285 U JP8185285 U JP 8185285U JP S61199074 U JPS61199074 U JP S61199074U
Authority
JP
Japan
Prior art keywords
wiring boards
contact member
pressure contact
wiring
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8185285U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8185285U priority Critical patent/JPS61199074U/ja
Publication of JPS61199074U publication Critical patent/JPS61199074U/ja
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)
JP8185285U 1985-05-31 1985-05-31 Pending JPS61199074U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8185285U JPS61199074U (de) 1985-05-31 1985-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8185285U JPS61199074U (de) 1985-05-31 1985-05-31

Publications (1)

Publication Number Publication Date
JPS61199074U true JPS61199074U (de) 1986-12-12

Family

ID=30629025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8185285U Pending JPS61199074U (de) 1985-05-31 1985-05-31

Country Status (1)

Country Link
JP (1) JPS61199074U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004002203A1 (ja) * 2002-06-25 2003-12-31 Nec Corporation 回路基板装置および基板間の接続方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839033U (ja) * 1981-09-08 1983-03-14 ミツミ電機株式会社 可変コンデンサ
JPS5848778U (ja) * 1981-09-24 1983-04-01 小平　拓治 織物用糸
JPS5926887B2 (ja) * 1976-07-19 1984-07-02 三菱重工業株式会社 円筒形素材の芯出し方法
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
JPS61203698A (ja) * 1985-03-07 1986-09-09 ソニ−ケミカル　株式会社 電子回路接続部の補強方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926887B2 (ja) * 1976-07-19 1984-07-02 三菱重工業株式会社 円筒形素材の芯出し方法
JPS5839033U (ja) * 1981-09-08 1983-03-14 ミツミ電機株式会社 可変コンデンサ
JPS5848778U (ja) * 1981-09-24 1983-04-01 小平　拓治 織物用糸
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
JPS61203698A (ja) * 1985-03-07 1986-09-09 ソニ−ケミカル　株式会社 電子回路接続部の補強方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004002203A1 (ja) * 2002-06-25 2003-12-31 Nec Corporation 回路基板装置および基板間の接続方法
CN1327746C (zh) * 2002-06-25 2007-07-18 日本电气株式会社 电路基板装置及基板间的连接方法
US7501584B2 (en) 2002-06-25 2009-03-10 Nec Corporation Circuit board device and method for board-to-board connection

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