DE3330068C2 - - Google Patents

Info

Publication number
DE3330068C2
DE3330068C2 DE19833330068 DE3330068A DE3330068C2 DE 3330068 C2 DE3330068 C2 DE 3330068C2 DE 19833330068 DE19833330068 DE 19833330068 DE 3330068 A DE3330068 A DE 3330068A DE 3330068 C2 DE3330068 C2 DE 3330068C2
Authority
DE
Germany
Prior art keywords
aluminum
layer
copper
circuit
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19833330068
Other languages
German (de)
English (en)
Other versions
DE3330068A1 (de
Inventor
Shinichiro Asai
Kazuo Katoh
Tatsuo Machida Tokio/Tokyo Jp Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of DE3330068A1 publication Critical patent/DE3330068A1/de
Application granted granted Critical
Publication of DE3330068C2 publication Critical patent/DE3330068C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Networks Using Active Elements (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
DE19833330068 1982-08-19 1983-08-19 Hybrid-integrierte schaltung und verfahren zur herstellung derselben Granted DE3330068A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57142726A JPS5933894A (ja) 1982-08-19 1982-08-19 混成集積用回路基板の製造法

Publications (2)

Publication Number Publication Date
DE3330068A1 DE3330068A1 (de) 1984-02-23
DE3330068C2 true DE3330068C2 (https=) 1988-12-01

Family

ID=15322152

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833330068 Granted DE3330068A1 (de) 1982-08-19 1983-08-19 Hybrid-integrierte schaltung und verfahren zur herstellung derselben

Country Status (6)

Country Link
US (1) US4521476A (https=)
JP (1) JPS5933894A (https=)
DE (1) DE3330068A1 (https=)
GB (1) GB2125618B (https=)
IT (1) IT1163829B (https=)
NL (1) NL188720C (https=)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
JPS6121983A (ja) * 1984-07-07 1986-01-30 工業技術院長 非酸化物系セラミックス―金属複合材料の製造方法
FR2574222B1 (fr) * 1984-12-04 1987-05-29 Sintra Procede de fabrication d'un substrat pour circuit hybride comportant des connexions faiblement resistives
JPS61176142A (ja) * 1985-01-31 1986-08-07 Toshiba Corp 基板構造体
DE3517965A1 (de) * 1985-05-18 1986-11-20 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung einer elektrischen schaltung in hybridtechnik
JPS61284991A (ja) * 1985-06-11 1986-12-15 電気化学工業株式会社 アルミニウム／銅複合箔張基板の回路形成法
JPS6239090A (ja) * 1985-08-14 1987-02-20 松下電工株式会社 アルミニウムワイヤ−ボンデイング用プリント配線板の製造方法
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
JPS6318697A (ja) * 1986-07-11 1988-01-26 日本電気株式会社 多層配線基板
JPS6331193A (ja) * 1986-07-24 1988-02-09 三井金属鉱業株式会社 プリント配線板の導体パタ−ン形成法
JPS6383256A (ja) * 1986-09-26 1988-04-13 Futaba Corp アルミニウム蒸着膜付銅部材
JPS6390890A (ja) * 1986-10-03 1988-04-21 株式会社　潤工社 プリント基板
GB8803519D0 (en) * 1988-02-16 1988-03-16 Emi Plc Thorn Electrical connectors
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JPH0634439B2 (ja) * 1988-05-10 1994-05-02 電気化学工業株式会社 プリント配線板の製造方法
KR920005459B1 (ko) * 1988-08-30 1992-07-04 가부시기가이샤 히다찌세이사꾸쇼 금속의 균질화방법 및 회로기판
JPH0390872A (ja) * 1989-09-01 1991-04-16 Toshiba Corp 半導体装置
JP2608980B2 (ja) * 1990-09-11 1997-05-14 電気化学工業株式会社 金属板ベース多層回路基板
JP2500523B2 (ja) * 1990-12-28 1996-05-29 日本電装株式会社 基板および基板の製造方法
EP0525644A1 (en) * 1991-07-24 1993-02-03 Denki Kagaku Kogyo Kabushiki Kaisha Circuit substrate for mounting a semiconductor element
JPH05102155A (ja) * 1991-10-09 1993-04-23 Sony Corp 銅配線構造体及びその製造方法
US5311404A (en) * 1992-06-30 1994-05-10 Hughes Aircraft Company Electrical interconnection substrate with both wire bond and solder contacts
GB2273257B (en) * 1992-06-30 1996-03-27 Hughes Aircraft Co Electrical interconnection substrate with both wire bond and solder contacts
KR100307465B1 (ko) * 1992-10-20 2001-12-15 야기 추구오 파워모듈
JPH07231015A (ja) * 1994-02-17 1995-08-29 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP3225854B2 (ja) * 1996-10-02 2001-11-05 株式会社デンソー 厚膜回路基板及びそのワイヤボンディング電極形成方法
US6194127B1 (en) * 1998-05-27 2001-02-27 Mcdonnell Douglas Corporation Resistive sheet patterning process and product thereof
KR100367056B1 (ko) * 1999-10-13 2003-01-09 가부시키가이샤 무라타 세이사쿠쇼 전자 부품의 지지 지그, 전자 부품의 지지 방법, 및 전자부품의 제조방법
US6506062B1 (en) 2001-08-01 2003-01-14 Visteon Global Technologies, Inc. Circuit board having an integrated circuit board connector and method of making the same
DE10230712B4 (de) * 2002-07-08 2006-03-23 Siemens Ag Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger
JP2005026525A (ja) * 2003-07-03 2005-01-27 Shinko Electric Ind Co Ltd 配線基板および配線基板の製造方法
WO2006053277A2 (en) * 2004-11-12 2006-05-18 Chippac, Inc. Wire bond interconnection
US7868468B2 (en) * 2004-11-12 2011-01-11 Stats Chippac Ltd. Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
US7731078B2 (en) * 2004-11-13 2010-06-08 Stats Chippac Ltd. Semiconductor system with fine pitch lead fingers
US8519517B2 (en) 2004-11-13 2013-08-27 Stats Chippac Ltd. Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
DE102004058016B4 (de) * 2004-12-01 2014-10-09 Epcos Ag Mit akustischen Oberflächenwellen arbeitendes Bauelement mit hoher Bandbreite
JP4595665B2 (ja) * 2005-05-13 2010-12-08 富士電機システムズ株式会社 配線基板の製造方法
IL182371A0 (en) * 2006-04-04 2007-07-24 Hanita Coatings R C A Ltd Patterns of conductive objects on a substrate and method of producing thereof
US7972710B2 (en) * 2006-08-31 2011-07-05 Antaya Technologies Corporation Clad aluminum connector
US8164176B2 (en) * 2006-10-20 2012-04-24 Infineon Technologies Ag Semiconductor module arrangement
US7701049B2 (en) * 2007-08-03 2010-04-20 Stats Chippac Ltd. Integrated circuit packaging system for fine pitch substrates
TWI338562B (en) * 2007-12-27 2011-03-01 Unimicron Technology Corp Circuit board and process thereof
US20090273907A1 (en) * 2008-04-30 2009-11-05 Unimicron Technology Corp. Circuit board and process thereof
EP2315242A1 (en) * 2009-10-23 2011-04-27 ABB Technology AG Circuit arrangement and manufacturing method thereof
DE102011050424B4 (de) * 2011-05-17 2017-09-28 Ksg Leiterplatten Gmbh Verfahren zum Herstellen eines Halbzeuges für eine ein- oder mehrlagige Leiterplatte
DE102014217186A1 (de) * 2014-08-28 2016-03-03 Continental Automotive Gmbh Verfahren zum Herstellen eines Schaltungsträgers und Schaltungsträger für elektronische Bauelemente
CN104219875A (zh) * 2014-09-15 2014-12-17 景旺电子科技(龙川)有限公司 一种线路金属基板的制造方法及线路金属基板
DE102015111667B4 (de) 2015-07-17 2025-11-06 Rogers Germany Gmbh Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates
EP3592241B1 (en) * 2017-03-07 2021-04-14 Koninklijke Philips N.V. Ultrasound imaging device with thermally conductive plate
DE102024101271A1 (de) * 2024-01-17 2025-07-17 Plasma Innovations GmbH Verbundmaterial zur Herstellung von Leiterplatten und Herstellungsverfahren

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377259A (en) * 1965-03-15 1968-04-09 Gen Dynamics Corp Method for preventing oxidation degradation of copper by interposing barrier betweencopper and polypropylene
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate
US3967371A (en) * 1970-01-06 1976-07-06 Sescosem- Societe Europeenne Des Semi-Conducteurs Et De Microelectronique Methods of manufacturing multilayer interconnections for integrated circuits and to integrated circuits utilizing said method
US3997380A (en) * 1970-04-17 1976-12-14 Compagnie Internationale Pour L'informatique Method of engraving a conductive layer
JPS5146904B2 (https=) * 1971-09-30 1976-12-11
US3791858A (en) * 1971-12-13 1974-02-12 Ibm Method of forming multi-layer circuit panels
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US4072516A (en) * 1975-09-15 1978-02-07 Fiber Materials, Inc. Graphite fiber/metal composites
JPS5317747A (en) * 1976-08-02 1978-02-18 Sasaki Mooru Kk Natural light inlet tube
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
JPS57122592A (en) * 1981-01-23 1982-07-30 Tokyo Shibaura Electric Co Method of producing hybrid integrated circuit
US4404059A (en) * 1982-05-26 1983-09-13 Livshits Vladimir I Process for manufacturing panels to be used in microelectronic systems

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IT8322164A1 (it) 1985-01-21
GB8317006D0 (en) 1983-07-27
DE3330068A1 (de) 1984-02-23
IT8322164A0 (it) 1983-07-21
GB2125618A (en) 1984-03-07
US4521476A (en) 1985-06-04
NL188720C (nl) 1992-09-01
GB2125618B (en) 1986-07-02
NL8302539A (nl) 1984-03-16
IT1163829B (it) 1987-04-08
JPS5933894A (ja) 1984-02-23
NL188720B (nl) 1992-04-01

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