DE2359924A1 - Verfahren der galvanoformung einer nickel-kupfer-legierung - Google Patents
Verfahren der galvanoformung einer nickel-kupfer-legierungInfo
- Publication number
- DE2359924A1 DE2359924A1 DE2359924A DE2359924A DE2359924A1 DE 2359924 A1 DE2359924 A1 DE 2359924A1 DE 2359924 A DE2359924 A DE 2359924A DE 2359924 A DE2359924 A DE 2359924A DE 2359924 A1 DE2359924 A1 DE 2359924A1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- nickel
- cathode
- anode
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 27
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title description 13
- 229910000881 Cu alloy Inorganic materials 0.000 title description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 35
- 229910045601 alloy Inorganic materials 0.000 claims description 24
- 239000000956 alloy Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 9
- 239000000080 wetting agent Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 2
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 claims 1
- 235000000396 iron Nutrition 0.000 claims 1
- 239000000243 solution Substances 0.000 description 16
- 238000005323 electroforming Methods 0.000 description 12
- 229910000570 Cupronickel Inorganic materials 0.000 description 8
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 8
- 239000004327 boric acid Substances 0.000 description 8
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000012047 saturated solution Substances 0.000 description 2
- -1 Copper fluoroborate Chemical compound 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241000862632 Soja Species 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229940021013 electrolyte solution Drugs 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00316278A US3833481A (en) | 1972-12-18 | 1972-12-18 | Electroforming nickel copper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2359924A1 true DE2359924A1 (de) | 1974-06-20 |
Family
ID=23228346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2359924A Withdrawn DE2359924A1 (de) | 1972-12-18 | 1973-12-01 | Verfahren der galvanoformung einer nickel-kupfer-legierung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3833481A (enrdf_load_html_response) |
| JP (1) | JPS4990234A (enrdf_load_html_response) |
| BE (1) | BE804107A (enrdf_load_html_response) |
| CA (1) | CA1019274A (enrdf_load_html_response) |
| DE (1) | DE2359924A1 (enrdf_load_html_response) |
| GB (1) | GB1435208A (enrdf_load_html_response) |
| IT (1) | IT995341B (enrdf_load_html_response) |
| NL (1) | NL7310599A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0267972A1 (en) * | 1985-10-06 | 1988-05-25 | Technion Research & Development Foundation Ltd. | A method for the electrodeposition of an ordered alloy |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2670867B2 (ja) * | 1989-10-14 | 1997-10-29 | 同和鉱業株式会社 | アルミニウム合金素材のメッキ処理法 |
| MY111621A (en) * | 1993-12-16 | 2000-09-27 | Kiyokawa Plating Ind Co Ltd | Method for producing metal film resistor |
| TW317575B (enrdf_load_html_response) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
| US5780172A (en) * | 1995-12-18 | 1998-07-14 | Olin Corporation | Tin coated electrical connector |
| US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
| US6083633A (en) * | 1997-06-16 | 2000-07-04 | Olin Corporation | Multi-layer diffusion barrier for a tin coated electrical connector |
| US6547946B2 (en) * | 2000-04-10 | 2003-04-15 | The Regents Of The University Of California | Processing a printed wiring board by single bath electrodeposition |
| US6759142B2 (en) | 2001-07-31 | 2004-07-06 | Kobe Steel Ltd. | Plated copper alloy material and process for production thereof |
| US6992389B2 (en) * | 2004-04-28 | 2006-01-31 | International Business Machines Corporation | Barrier for interconnect and method |
| CN102393409A (zh) * | 2011-07-14 | 2012-03-28 | 徐志花 | 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法 |
| IN2014MN01920A (enrdf_load_html_response) | 2012-04-19 | 2015-07-10 | Dipsol Chem | |
| CN103484904A (zh) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | 一种铁基五金件的镀铜工艺 |
| JP6439172B2 (ja) * | 2014-08-08 | 2018-12-19 | ディップソール株式会社 | 銅−ニッケル合金電気めっき浴 |
| CH713970A1 (fr) * | 2017-07-12 | 2019-01-15 | Sa De La Manufacture Dhorlogerie Audemars Piguet & Cie | Composant horloger en alliage binaire CuNi amagnétique. |
| CN113774442B (zh) * | 2021-09-23 | 2023-02-17 | 中冶赛迪技术研究中心有限公司 | 一种基于内生析出法的纳米复合镀层及其制备工艺 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1969553A (en) * | 1934-08-07 | Electrolyte for the deposition of | ||
| US1750092A (en) * | 1921-11-26 | 1930-03-11 | Crawford Robert Brace Penn | Electroplating process |
| DE576585C (de) * | 1931-05-13 | 1933-05-13 | Julius Winkler Jr | Verfahren zur Herstellung legierter galvanischer Niederschlaege |
| US2575712A (en) * | 1945-09-29 | 1951-11-20 | Westinghouse Electric Corp | Electroplating |
| US2951978A (en) * | 1957-05-29 | 1960-09-06 | Thor P Ulvestad | Reverse pulse generator |
| GB957808A (en) * | 1962-02-09 | 1964-05-13 | Ass Elect Ind | Electrodeposition of copper-nickel alloy |
-
1972
- 1972-12-18 US US00316278A patent/US3833481A/en not_active Expired - Lifetime
-
1973
- 1973-07-23 CA CA177,063A patent/CA1019274A/en not_active Expired
- 1973-07-31 NL NL7310599A patent/NL7310599A/xx not_active Application Discontinuation
- 1973-08-06 GB GB3719573A patent/GB1435208A/en not_active Expired
- 1973-08-28 BE BE135013A patent/BE804107A/xx unknown
- 1973-09-12 IT IT28841/73A patent/IT995341B/it active
- 1973-10-25 JP JP48119487A patent/JPS4990234A/ja active Pending
- 1973-12-01 DE DE2359924A patent/DE2359924A1/de not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0267972A1 (en) * | 1985-10-06 | 1988-05-25 | Technion Research & Development Foundation Ltd. | A method for the electrodeposition of an ordered alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| IT995341B (it) | 1975-11-10 |
| GB1435208A (en) | 1976-05-12 |
| US3833481A (en) | 1974-09-03 |
| NL7310599A (enrdf_load_html_response) | 1974-06-20 |
| JPS4990234A (enrdf_load_html_response) | 1974-08-28 |
| BE804107A (nl) | 1973-12-17 |
| CA1019274A (en) | 1977-10-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |