US3833481A - Electroforming nickel copper alloys - Google Patents

Electroforming nickel copper alloys Download PDF

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Publication number
US3833481A
US3833481A US00316278A US31627872A US3833481A US 3833481 A US3833481 A US 3833481A US 00316278 A US00316278 A US 00316278A US 31627872 A US31627872 A US 31627872A US 3833481 A US3833481 A US 3833481A
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United States
Prior art keywords
nickel
copper
anode
alloy
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US00316278A
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English (en)
Inventor
R Olson
P Mentone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BUCKBEL MEARS CO
BUCKBEL MEARS CO US
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BUCKBEL MEARS CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BUCKBEL MEARS CO filed Critical BUCKBEL MEARS CO
Priority to US00316278A priority Critical patent/US3833481A/en
Priority to CA177,063A priority patent/CA1019274A/en
Priority to NL7310599A priority patent/NL7310599A/xx
Priority to GB3719573A priority patent/GB1435208A/en
Priority to BE135013A priority patent/BE804107A/xx
Priority to IT28841/73A priority patent/IT995341B/it
Priority to JP48119487A priority patent/JPS4990234A/ja
Priority to DE2359924A priority patent/DE2359924A1/de
Application granted granted Critical
Publication of US3833481A publication Critical patent/US3833481A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Definitions

  • the present methods of manufacturing copper nickel alloys for use in electronic circuits is to alloy nickel and copper into sheet form and then cold roll the copper nickel alloy sheet to the desired thickness. Next, one cuts or etches out the section of the sheet to form the proper resistance.
  • the difficulty with this particular process is that it is quite costly to cold roll an alloy until one obtains the proper thickness.
  • this process requires that the alloy be fastened or mounted in the circuit.
  • the present invention in contrast, provides a method of electroforming a nickel copper alloy onto a mandrel where it can be later stripped from or electroplating the copper nickel alloy directly onto an electrical circuit.
  • the present invention comprises a process that allows one to electroform or electroplate a copper nickel alloy rather than laminated layers of copper and nickel.
  • the invention comprises a process for electroforming or electroplating a nickel copper alloy by utilization of a nickel anode in an electroplating bath containing copper, nickel and boric acid.
  • FIG. 1 shows a schematic of a circuit used to electroform a copper nickel alloy
  • FIG. 2 shows a graph of the voltage applied between the cathode and the anode as a function of time
  • FIG. 3 shows a second graph of the voltage applied between the cathode and the anode as a function of time.
  • reference numeral 10 generally designates a schematic of an electrical circuit for applying the wave shape which we designate as a capacitor discharge bias plating technique.
  • Reference numeral 11 designates an electroplating solution with reference numerals l2 and 13 denoting the anode and the cathode which are located in the electroplating solution of the present invention.
  • Anode 12 connects to a power supply 14 through a resistor 16 and cathode 13 connects directly to power supply 14.
  • Located across the outputs of power supply 14 is a capacitor 17 and a mercury relay switch 18 which is normally in the open position.
  • Mercury relay switch 18 connects to a pulse generator 15 that supplies a signal to close mercury relay switch 18 at predetermined intervals.
  • FIG. 2 shows the shape of the applied signal utilizing this capacitor discharge technique.
  • the voltage designated V indicates the maximum voltage or a portion of the voltage available at the capacitor as it begins to discharge. This voltage decays down to the voltage level V, where voltage signal remains until it is interrupted by opening the contact in relay switch 18. The cycle is then repeated. Typically, an entire cycle may have a duration of milliseconds, however, no limitation is intended thereto.
  • FIG. 3 shows DC voltage signal that is applied between anode 12 and cathode 13.
  • the shape of the output signal is shown in FIG. 3 could be obtained by connecting a power supply 14 directly across anode 12 and cathode 13.
  • Each of these waves forms offer certain advantages in electroforming a nickel copper alloy.
  • With the wave shape shown in FIG. 2 we have been able to electroform nickel copper alloys that contain as much as 25% copper.
  • the results were a nickelcopper alloy.
  • wetting Agent Less than .l% by volume Wetting Agent Less than 1% by volume
  • the copper can be placed in solution by any suitable method, however, the preferred method is to use a copper sulfate solution or as a copper fluoborate solution.
  • the nickel can be placed in solution by any suitable method with the preferred method or a nickel fluoborate solution is used.
  • the amount of copper specified in the examples is the actual amount of copper and not the amount of the sulfate or fluoborate solution.
  • the preferred method is to suspend a bag containing boric acid in-the solution and allow the boric acid to dissolve in the solution. By having sufficient boric acid in the bag the material dissolves in the solution until the solution is saturated.
  • the temperature of the bath was at about 40 C., however, wide variations of the C H C H SO Na.
  • any number of wetting agents could be used as the function of the setting agent is to allow the electroplating bath to better wet the article and bring the fresh electroplating solution into contact with all regions on the plated article.
  • the current ranged from about to about 250 amps/square foot.
  • a method of plating an alloy consisting of copper and nickel comprising the steps of:
  • the high voltage signal comprises a signal formed by a capacitor discharging.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US00316278A 1972-12-18 1972-12-18 Electroforming nickel copper alloys Expired - Lifetime US3833481A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys
CA177,063A CA1019274A (en) 1972-12-18 1973-07-23 Electroforming nickel copper alloys in boric acid bath
NL7310599A NL7310599A (enrdf_load_html_response) 1972-12-18 1973-07-31
GB3719573A GB1435208A (en) 1972-12-18 1973-08-06 Electrodepositing copper-nickel alloys
BE135013A BE804107A (nl) 1972-12-18 1973-08-28 Werkwijze voor het op galvanische wijze bereiden van een koper-nikkelalliage
IT28841/73A IT995341B (it) 1972-12-18 1973-09-12 Procedimento per l elettroformatura di leghe rame nichel
JP48119487A JPS4990234A (enrdf_load_html_response) 1972-12-18 1973-10-25
DE2359924A DE2359924A1 (de) 1972-12-18 1973-12-01 Verfahren der galvanoformung einer nickel-kupfer-legierung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Publications (1)

Publication Number Publication Date
US3833481A true US3833481A (en) 1974-09-03

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US00316278A Expired - Lifetime US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Country Status (8)

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US (1) US3833481A (enrdf_load_html_response)
JP (1) JPS4990234A (enrdf_load_html_response)
BE (1) BE804107A (enrdf_load_html_response)
CA (1) CA1019274A (enrdf_load_html_response)
DE (1) DE2359924A1 (enrdf_load_html_response)
GB (1) GB1435208A (enrdf_load_html_response)
IT (1) IT995341B (enrdf_load_html_response)
NL (1) NL7310599A (enrdf_load_html_response)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560812A (en) * 1993-12-16 1996-10-01 Kiyokawa Plating Industries Co., Ltd. Method for producing a metal film resistor
WO1997022472A1 (en) * 1995-12-18 1997-06-26 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US20030150742A1 (en) * 2000-04-10 2003-08-14 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US20050245070A1 (en) * 2004-04-28 2005-11-03 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (zh) * 2011-07-14 2012-03-28 徐志花 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法
CN103484904A (zh) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 一种铁基五金件的镀铜工艺
KR20170038918A (ko) * 2014-08-08 2017-04-07 딥솔 가부시키가이샤 구리-니켈 합금 전기 도금욕
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method
CN113774442A (zh) * 2021-09-23 2021-12-10 中冶赛迪技术研究中心有限公司 一种基于内生析出法的纳米复合镀层及其制备工艺

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
JP2670867B2 (ja) * 1989-10-14 1997-10-29 同和鉱業株式会社 アルミニウム合金素材のメッキ処理法
CH713970A1 (fr) * 2017-07-12 2019-01-15 Sa De La Manufacture Dhorlogerie Audemars Piguet & Cie Composant horloger en alliage binaire CuNi amagnétique.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
US1951893A (en) * 1931-05-13 1934-03-20 Jr Julius Winkler Electrodeposition of metal alloys
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
US1951893A (en) * 1931-05-13 1934-03-20 Jr Julius Winkler Electrodeposition of metal alloys
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560812A (en) * 1993-12-16 1996-10-01 Kiyokawa Plating Industries Co., Ltd. Method for producing a metal film resistor
CN1039558C (zh) * 1993-12-16 1998-08-19 清川电镀工业株式会社 金属膜电阻器制造方法及制成的金属膜电阻器
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
WO1997022472A1 (en) * 1995-12-18 1997-06-26 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US20030150742A1 (en) * 2000-04-10 2003-08-14 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
US7846317B2 (en) * 2000-04-10 2010-12-07 Lawrence Livermore National Security, Llc Processing a printed wiring board by single bath electrodeposition
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US20040209112A1 (en) * 2001-07-31 2004-10-21 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Plated copper alloy material and process for production thereof
US6939621B2 (en) 2001-07-31 2005-09-06 Kobe Steel, Ltd. Plated copper alloy material and process for production thereof
US6992389B2 (en) * 2004-04-28 2006-01-31 International Business Machines Corporation Barrier for interconnect and method
US20050245070A1 (en) * 2004-04-28 2005-11-03 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (zh) * 2011-07-14 2012-03-28 徐志花 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method
CN103484904A (zh) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 一种铁基五金件的镀铜工艺
KR20170038918A (ko) * 2014-08-08 2017-04-07 딥솔 가부시키가이샤 구리-니켈 합금 전기 도금욕
CN106574387A (zh) * 2014-08-08 2017-04-19 迪普索股份公司 铜‑镍合金电镀浴
EP3178968A4 (en) * 2014-08-08 2018-01-17 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath
US10316421B2 (en) 2014-08-08 2019-06-11 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath
CN106574387B (zh) * 2014-08-08 2019-10-18 迪普索股份公司 铜-镍合金电镀浴
CN113774442A (zh) * 2021-09-23 2021-12-10 中冶赛迪技术研究中心有限公司 一种基于内生析出法的纳米复合镀层及其制备工艺
CN113774442B (zh) * 2021-09-23 2023-02-17 中冶赛迪技术研究中心有限公司 一种基于内生析出法的纳米复合镀层及其制备工艺

Also Published As

Publication number Publication date
IT995341B (it) 1975-11-10
GB1435208A (en) 1976-05-12
NL7310599A (enrdf_load_html_response) 1974-06-20
JPS4990234A (enrdf_load_html_response) 1974-08-28
BE804107A (nl) 1973-12-17
CA1019274A (en) 1977-10-18
DE2359924A1 (de) 1974-06-20

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