CA1019274A - Electroforming nickel copper alloys in boric acid bath - Google Patents

Electroforming nickel copper alloys in boric acid bath

Info

Publication number
CA1019274A
CA1019274A CA177,063A CA177063A CA1019274A CA 1019274 A CA1019274 A CA 1019274A CA 177063 A CA177063 A CA 177063A CA 1019274 A CA1019274 A CA 1019274A
Authority
CA
Canada
Prior art keywords
boric acid
copper alloys
acid bath
nickel copper
electroforming nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA177,063A
Other languages
English (en)
Inventor
Pat F. Mentone
Roger A. Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of CA1019274A publication Critical patent/CA1019274A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA177,063A 1972-12-18 1973-07-23 Electroforming nickel copper alloys in boric acid bath Expired CA1019274A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Publications (1)

Publication Number Publication Date
CA1019274A true CA1019274A (en) 1977-10-18

Family

ID=23228346

Family Applications (1)

Application Number Title Priority Date Filing Date
CA177,063A Expired CA1019274A (en) 1972-12-18 1973-07-23 Electroforming nickel copper alloys in boric acid bath

Country Status (8)

Country Link
US (1) US3833481A (enrdf_load_html_response)
JP (1) JPS4990234A (enrdf_load_html_response)
BE (1) BE804107A (enrdf_load_html_response)
CA (1) CA1019274A (enrdf_load_html_response)
DE (1) DE2359924A1 (enrdf_load_html_response)
GB (1) GB1435208A (enrdf_load_html_response)
IT (1) IT995341B (enrdf_load_html_response)
NL (1) NL7310599A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103484904A (zh) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 一种铁基五金件的镀铜工艺

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
JP2670867B2 (ja) * 1989-10-14 1997-10-29 同和鉱業株式会社 アルミニウム合金素材のメッキ処理法
MY111621A (en) * 1993-12-16 2000-09-27 Kiyokawa Plating Ind Co Ltd Method for producing metal film resistor
TW317575B (enrdf_load_html_response) * 1994-01-21 1997-10-11 Olin Corp
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US6992389B2 (en) * 2004-04-28 2006-01-31 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (zh) * 2011-07-14 2012-03-28 徐志花 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法
IN2014MN01920A (enrdf_load_html_response) 2012-04-19 2015-07-10 Dipsol Chem
JP6439172B2 (ja) * 2014-08-08 2018-12-19 ディップソール株式会社 銅−ニッケル合金電気めっき浴
CH713970A1 (fr) * 2017-07-12 2019-01-15 Sa De La Manufacture Dhorlogerie Audemars Piguet & Cie Composant horloger en alliage binaire CuNi amagnétique.
CN113774442B (zh) * 2021-09-23 2023-02-17 中冶赛迪技术研究中心有限公司 一种基于内生析出法的纳米复合镀层及其制备工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
DE576585C (de) * 1931-05-13 1933-05-13 Julius Winkler Jr Verfahren zur Herstellung legierter galvanischer Niederschlaege
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103484904A (zh) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 一种铁基五金件的镀铜工艺

Also Published As

Publication number Publication date
IT995341B (it) 1975-11-10
GB1435208A (en) 1976-05-12
US3833481A (en) 1974-09-03
NL7310599A (enrdf_load_html_response) 1974-06-20
JPS4990234A (enrdf_load_html_response) 1974-08-28
BE804107A (nl) 1973-12-17
DE2359924A1 (de) 1974-06-20

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