IL76592A - Method for electrodeposition of at least two metals from a single solution - Google Patents

Method for electrodeposition of at least two metals from a single solution

Info

Publication number
IL76592A
IL76592A IL76592A IL7659285A IL76592A IL 76592 A IL76592 A IL 76592A IL 76592 A IL76592 A IL 76592A IL 7659285 A IL7659285 A IL 7659285A IL 76592 A IL76592 A IL 76592A
Authority
IL
Israel
Prior art keywords
metals
nickel
copper
electrodeposition
range
Prior art date
Application number
IL76592A
Other versions
IL76592A0 (en
Inventor
Joseph Yahalom
Ori Zadok
Original Assignee
Technion Res & Dev Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technion Res & Dev Foundation filed Critical Technion Res & Dev Foundation
Priority to IL76592A priority Critical patent/IL76592A/en
Priority to US06/815,860 priority patent/US4652348A/en
Publication of IL76592A0 publication Critical patent/IL76592A0/en
Priority to EP86114677A priority patent/EP0267972B1/en
Priority to DE8686114677T priority patent/DE3687755T2/en
Priority to AT86114677T priority patent/ATE85656T1/en
Publication of IL76592A publication Critical patent/IL76592A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/09—Wave forms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Hard Magnetic Materials (AREA)

Abstract

The present invention relates to a method for the electtodeposition of an ordered alloy structured in alternate discrete layers, said alloys possessing high elastic modulus and adjustable magnetic susceptibility. The electrodeposition of at least two metals, characterized by a redox potential gap of at least 0,1 V between said metals, is obtained by the pulse plating technique with a frequency in the range of 0,02 Hz to 15 Hz. The concentrations of the noblest metal in the electrodeposition solution should be in the range of 0,001 M to 2,0 M while that of the less noble metal is about its saturation at room temperature. The discrete layers obtained according to the method are less than 90 ANGSTROM thickness being substantially pure. Examples of the metals to be electrodeposited according to the invention are copper-nickel; copper-palladium; nickel-gold; copper-nickel-iron and corresponding alloys with cobalt or iron replacing nickel.
IL76592A 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution IL76592A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution
US06/815,860 US4652348A (en) 1985-10-06 1986-01-03 Method for the production of alloys possessing high elastic modulus and improved magnetic properties by electrodeposition
EP86114677A EP0267972B1 (en) 1985-10-06 1986-10-22 A method for the electrodeposition of an ordered alloy
DE8686114677T DE3687755T2 (en) 1985-10-06 1986-10-22 METHOD FOR ELECTROPLATING AN ORDERED ALLOY.
AT86114677T ATE85656T1 (en) 1985-10-06 1986-10-22 METHOD OF ELECTROPLATING AN ORDERED ALLOY.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution

Publications (2)

Publication Number Publication Date
IL76592A0 IL76592A0 (en) 1986-02-28
IL76592A true IL76592A (en) 1989-03-31

Family

ID=11056283

Family Applications (1)

Application Number Title Priority Date Filing Date
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution

Country Status (5)

Country Link
US (1) US4652348A (en)
EP (1) EP0267972B1 (en)
AT (1) ATE85656T1 (en)
DE (1) DE3687755T2 (en)
IL (1) IL76592A (en)

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US5268235A (en) * 1988-09-26 1993-12-07 The United States Of America As Represented By The Secretary Of Commerce Predetermined concentration graded alloys
US5158653A (en) * 1988-09-26 1992-10-27 Lashmore David S Method for production of predetermined concentration graded alloys
BR8805772A (en) * 1988-11-01 1990-06-12 Metal Leve Sa BEARING SLIDING LAYER FORMING PROCESS
JP2544845B2 (en) * 1990-08-23 1996-10-16 インターナショナル・ビジネス・マシーンズ・コーポレイション Magnetic thin film, laminate, magnetic recording head, magnetic shield, and method for producing laminate
CA2033107C (en) * 1990-12-24 2001-06-12 Robert Edward Burrell Actively sterile surfaces
DE4394869T1 (en) * 1992-09-25 1994-10-20 Nippon Piston Ring Co Ltd Process for producing a magnetic material in the form of a multilayer film by plating
US6365220B1 (en) 1997-11-03 2002-04-02 Nucryst Pharmaceuticals Corp. Process for production of actively sterile surfaces
SE9903531D0 (en) * 1999-09-30 1999-09-30 Res Inst Acreo Ab Method for electro-deposition of metallic multi-layers
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
US6547944B2 (en) * 2000-12-08 2003-04-15 Delphi Technologies, Inc. Commercial plating of nanolaminates
US6599411B2 (en) 2001-04-20 2003-07-29 Hitachi Global Storage Technologies Netherlands, B.V. Method of electroplating a nickel-iron alloy film with a graduated composition
WO2003093169A2 (en) * 2002-04-29 2003-11-13 The Trustees Of Boston College Density controlled carbon nanotube array electrodes
US6902827B2 (en) * 2002-08-15 2005-06-07 Sandia National Laboratories Process for the electrodeposition of low stress nickel-manganese alloys
DE10259362A1 (en) * 2002-12-18 2004-07-08 Siemens Ag Process for depositing an alloy on a substrate
JP2005146405A (en) * 2003-11-14 2005-06-09 Toru Yamazaki Electrodeposition stacked alloy thin sheet, and its production method
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
ES2422455T3 (en) * 2005-08-12 2013-09-11 Modumetal Llc Compositionally modulated composite materials and methods for manufacturing them
US20100096850A1 (en) * 2006-10-31 2010-04-22 Massachusetts Institute Of Technology Nanostructured alloy coated threaded metal surfaces and methods of producing same
EP2084762B1 (en) 2006-11-01 2010-01-20 Eveready Battery Company, Inc. Alkaline electrochemical cell with reduced gassing and reduced discolouration
US20080226976A1 (en) 2006-11-01 2008-09-18 Eveready Battery Company, Inc. Alkaline Electrochemical Cell with Reduced Gassing
KR100848689B1 (en) * 2006-11-01 2008-07-28 고려대학교 산학협력단 Multilayer Nanowires and Forming Method thereof
US7584533B2 (en) * 2007-10-10 2009-09-08 National Semiconductor Corporation Method of fabricating an inductor structure on an integrated circuit structure
WO2010005983A2 (en) 2008-07-07 2010-01-14 Modumetal Llc Property modulated materials and methods of making the same
EP2440691B1 (en) 2009-06-08 2019-10-23 Modumetal, Inc. Electrodeposited, nanolaminate coatings and claddings for corrosion protection
US10030312B2 (en) * 2009-10-14 2018-07-24 Massachusetts Institute Of Technology Electrodeposited alloys and methods of making same using power pulses
CA2806328C (en) 2010-07-22 2019-01-22 Modumetal Llc Material and process for electrochemical deposition of nanolaminated brass alloys
US20130186765A1 (en) * 2012-01-23 2013-07-25 Seagate Technology Llc Electrodeposition methods
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EA201500949A1 (en) 2013-03-15 2016-02-29 Модьюметл, Инк. METHOD OF FORMING A MULTILAYER COATING, A COATING FORMED BY THE ABOVE METHOD, AND A MULTILAYER COATING
EA201500948A1 (en) 2013-03-15 2016-03-31 Модьюметл, Инк. METHOD OF MANUFACTURING A PRODUCT AND A PRODUCT MANUFACTURED BY THE ABOVE INDICATED BY THE METHOD
CN105283587B (en) 2013-03-15 2019-05-10 莫杜美拓有限公司 Nano Laminated Coating
EP3194642A4 (en) 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
BR112017005534A2 (en) 2014-09-18 2017-12-05 Modumetal Inc Methods of preparing articles by electrodeposition processes and additive manufacturing
CN106811778A (en) * 2015-11-27 2017-06-09 中国科学院大连化学物理研究所 The preparation and palladium-copper alloy film and application of component and the controllable palladium-copper alloy film of thickness
CN109952391B (en) 2016-09-08 2022-11-01 莫杜美拓有限公司 Method of providing a laminate coating on a workpiece, and articles made therefrom
CN109922936A (en) 2016-09-09 2019-06-21 莫杜美拓有限公司 By on workpiece deposition materials layer manufacture mold, the mold and product that are obtained by the technique
KR102412452B1 (en) 2016-09-14 2022-06-23 모두메탈, 인크. Systems for Reliable High-Throughput Complex Electric Field Generation, and Methods of Making Coatings Therefrom
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

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FR1438563A (en) * 1965-04-02 1966-05-13 Bull General Electric Improvements to coupled ferromagnetic blades or layers
US3480522A (en) * 1966-08-18 1969-11-25 Ibm Method of making magnetic thin film device
GB1210270A (en) * 1968-03-28 1970-10-28 Standard Telephones Cables Ltd Method of electroplating two-layer films
US3833481A (en) * 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
JPS5713637B2 (en) * 1973-09-04 1982-03-18

Also Published As

Publication number Publication date
ATE85656T1 (en) 1993-02-15
IL76592A0 (en) 1986-02-28
US4652348A (en) 1987-03-24
DE3687755D1 (en) 1993-03-25
EP0267972B1 (en) 1993-02-10
DE3687755T2 (en) 1993-07-01
EP0267972A1 (en) 1988-05-25

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