GB1435208A - Electrodepositing copper-nickel alloys - Google Patents

Electrodepositing copper-nickel alloys

Info

Publication number
GB1435208A
GB1435208A GB3719573A GB3719573A GB1435208A GB 1435208 A GB1435208 A GB 1435208A GB 3719573 A GB3719573 A GB 3719573A GB 3719573 A GB3719573 A GB 3719573A GB 1435208 A GB1435208 A GB 1435208A
Authority
GB
United Kingdom
Prior art keywords
copper
nickel
voltage
phase
fluoborate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3719573A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Publication of GB1435208A publication Critical patent/GB1435208A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1435208 Electrolytic deposition of Cu-Ni alloys BUCKBEE-MEARS CO 6 Aug 1973 [18 Dec 1972] 37195/73 Heading C7B Copper-nickel alloy is electro-deposited using a nickel anode; an electrolyte containing copper, e.g. as copper sulphate or as copper fluoborate, nickel, e.g. as nickel fluoborate, sufficient boric acid to saturate the bath, and optionally a wetting agent, e.g. sodium dodecylbenzene sulphonate; and using a voltage consisting of a series of spaced apart pulses, each pulse having a first phase of decreasing voltage, e.g. produced by discharge of a capacitor, and a second phase of steady voltage.
GB3719573A 1972-12-18 1973-08-06 Electrodepositing copper-nickel alloys Expired GB1435208A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Publications (1)

Publication Number Publication Date
GB1435208A true GB1435208A (en) 1976-05-12

Family

ID=23228346

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3719573A Expired GB1435208A (en) 1972-12-18 1973-08-06 Electrodepositing copper-nickel alloys

Country Status (8)

Country Link
US (1) US3833481A (en)
JP (1) JPS4990234A (en)
BE (1) BE804107A (en)
CA (1) CA1019274A (en)
DE (1) DE2359924A1 (en)
GB (1) GB1435208A (en)
IT (1) IT995341B (en)
NL (1) NL7310599A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109252066A (en) * 2017-07-12 2019-01-22 钟表制作有限公司 The timepiece formed by nonmagnetic binary CuNi alloy

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
JP2670867B2 (en) * 1989-10-14 1997-10-29 同和鉱業株式会社 Aluminum alloy material plating method
MY111621A (en) * 1993-12-16 2000-09-27 Kiyokawa Plating Ind Co Ltd Method for producing metal film resistor
TW317575B (en) * 1994-01-21 1997-10-11 Olin Corp
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
EP1281789B1 (en) * 2001-07-31 2006-05-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) A plated copper alloy material and process for production thereof
US6992389B2 (en) * 2004-04-28 2006-01-31 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (en) * 2011-07-14 2012-03-28 徐志花 Novel and high-efficiency NiCu/Cu electrochemical sensor for detecting nitrobenzene and preparation method thereof
RU2588894C2 (en) 2012-04-19 2016-07-10 Дипсол Кемикалз Ко., Лтд. Bath for electroplating of copper-nickel alloy and procedure for application of galvanic coating
CN103484904A (en) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 Copper plating process for iron-based hardware
JP6439172B2 (en) * 2014-08-08 2018-12-19 ディップソール株式会社 Copper-nickel alloy electroplating bath
CN113774442B (en) * 2021-09-23 2023-02-17 中冶赛迪技术研究中心有限公司 Nano composite coating based on endogenesis precipitation method and preparation process thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
DE576585C (en) * 1931-05-13 1933-05-13 Julius Winkler Jr Process for the production of alloyed galvanic deposits
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109252066A (en) * 2017-07-12 2019-01-22 钟表制作有限公司 The timepiece formed by nonmagnetic binary CuNi alloy

Also Published As

Publication number Publication date
BE804107A (en) 1973-12-17
US3833481A (en) 1974-09-03
DE2359924A1 (en) 1974-06-20
IT995341B (en) 1975-11-10
CA1019274A (en) 1977-10-18
NL7310599A (en) 1974-06-20
JPS4990234A (en) 1974-08-28

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee