GB853939A - Platinum plating composition and process - Google Patents

Platinum plating composition and process

Info

Publication number
GB853939A
GB853939A GB20457/59A GB2045759A GB853939A GB 853939 A GB853939 A GB 853939A GB 20457/59 A GB20457/59 A GB 20457/59A GB 2045759 A GB2045759 A GB 2045759A GB 853939 A GB853939 A GB 853939A
Authority
GB
United Kingdom
Prior art keywords
platinum
dissolved
plating composition
platinum plating
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20457/59A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Publication of GB853939A publication Critical patent/GB853939A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Abstract

853,939. Electro-plates of platinium. SELREX CORPORATION. June 15, 1959 [Aug. 6, 1958], No. 20457/59. Class 41 An electrolyte for depositing relatively thick coatings of platinum electrolytic alloy consists of platinum diamino dinitrite dissolved in a mixture of H 3 PO 4 and H 2 SO 4 and water. Preferably the platinum salt is dissolved in water containing 10 to 100 parts of each acid and heated, to form a solution containing at least 6 g. of metal per litre. Plating conditions specified are 75 ‹ to 100 ‹C., current density 5 to 30 A.S.F. at 1 to 3 volts; the bath is preferably, agitated. U.S.A. Specification 1,779,436 is referred to.
GB20457/59A 1958-08-06 1959-06-15 Platinum plating composition and process Expired GB853939A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US753409A US2984603A (en) 1958-08-06 1958-08-06 Platinum plating composition and process

Publications (1)

Publication Number Publication Date
GB853939A true GB853939A (en) 1960-11-09

Family

ID=25030518

Family Applications (1)

Application Number Title Priority Date Filing Date
GB20457/59A Expired GB853939A (en) 1958-08-06 1959-06-15 Platinum plating composition and process

Country Status (8)

Country Link
US (1) US2984603A (en)
BE (1) BE580574A (en)
CH (1) CH393025A (en)
DE (1) DE1184173B (en)
ES (1) ES251551A1 (en)
FR (1) FR1229226A (en)
GB (1) GB853939A (en)
NL (2) NL241990A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2187204A (en) * 1986-02-28 1987-09-03 Technic Electroplating solution for deposition of palladium or alloys thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB897690A (en) * 1959-09-30 1962-05-30 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of platinum or palladium
US3267009A (en) * 1962-10-08 1966-08-16 Engelhard Ind Inc Electrodeposition of platinum containing minor amounts of bismuth
US3423226A (en) * 1965-06-28 1969-01-21 Mc Donnell Douglas Corp Plating of non-metallic bodies
US3437507A (en) * 1965-07-16 1969-04-08 Mc Donnell Douglas Corp Plating of substrates
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US6306277B1 (en) 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
US20070138019A1 (en) * 2005-12-21 2007-06-21 United Technologies Corporation Platinum modified NiCoCrAlY bondcoat for thermal barrier coating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE371542A (en) * 1929-07-02
GB367588A (en) * 1931-03-12 1932-02-25 Alan Richard Powell Improvements in or relating to the electrodeposition of the metals of the platinum group
GB367587A (en) * 1931-03-12 1932-02-25 Alan Richard Powell Improvements in or relating to the electro-deposition of palladium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2187204A (en) * 1986-02-28 1987-09-03 Technic Electroplating solution for deposition of palladium or alloys thereof
GB2187204B (en) * 1986-02-28 1990-11-14 Technic Electroplating solution for deposition of palladium or alloys thereof

Also Published As

Publication number Publication date
NL241990A (en)
ES251551A1 (en) 1959-12-16
US2984603A (en) 1961-05-16
BE580574A (en) 1959-11-03
DE1184173B (en) 1964-12-23
FR1229226A (en) 1960-09-05
NL122582C (en)
CH393025A (en) 1965-05-31

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