GB1299519A - Electrodeposition of tin-bismuth alloys - Google Patents

Electrodeposition of tin-bismuth alloys

Info

Publication number
GB1299519A
GB1299519A GB56352/70A GB5635270A GB1299519A GB 1299519 A GB1299519 A GB 1299519A GB 56352/70 A GB56352/70 A GB 56352/70A GB 5635270 A GB5635270 A GB 5635270A GB 1299519 A GB1299519 A GB 1299519A
Authority
GB
United Kingdom
Prior art keywords
tin
electro
bath
salt
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB56352/70A
Inventor
Jean Pierre Lescure
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1299519A publication Critical patent/GB1299519A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1299519 Electro-deposition of tin-bismuth alloys INTERNATIONAL BUSINESS MACHINES CORP 26 Nov 1970 [19 Dec 1969] 56352/70 Headings C7A and C7B A tin-bismuth alloy (e.g. containing 0À12- 0À27% by weight of Bi) is electro-plated from an acidic bath including a Sn salt, a Bi salt and fluoboric acid. For example, a Sn anode wrapped in a close-textured polypropylene bag is used and the bath contains tin fluoborate, HBF 4 , H 3 BO 3 , Bi ions (obtained by introducing into the bath a mixture of Bi 2 (SO 4 ) 3 and Bi 2 O 3 in closetextured polypropylene bags), HCHO, gelatine, #-naphthol and known brighteners (unspecified). The electro-plating is carried out at a temperature of 20-50‹C. using 1-3 volts and 0À8-3A/dm<SP>2</SP>, e.g. on to Ni-plated sheet steel.
GB56352/70A 1969-12-19 1970-11-26 Electrodeposition of tin-bismuth alloys Expired GB1299519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6944284A FR2071199A5 (en) 1969-12-19 1969-12-19

Publications (1)

Publication Number Publication Date
GB1299519A true GB1299519A (en) 1972-12-13

Family

ID=9044910

Family Applications (1)

Application Number Title Priority Date Filing Date
GB56352/70A Expired GB1299519A (en) 1969-12-19 1970-11-26 Electrodeposition of tin-bismuth alloys

Country Status (5)

Country Link
US (1) US3663384A (en)
JP (1) JPS4931606B1 (en)
DE (1) DE2050145A1 (en)
FR (1) FR2071199A5 (en)
GB (1) GB1299519A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111188069A (en) * 2019-12-31 2020-05-22 大连长丰实业总公司 Tin-plated bismuth alloy solution and preparation method thereof

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4162205A (en) * 1978-10-19 1979-07-24 Vulcan Materials Company Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4599149A (en) * 1981-09-11 1986-07-08 Learonal, Inc. Process for electroplating tin, lead and tin-lead alloys and baths therefor
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4565609A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
LU87746A1 (en) * 1988-10-14 1991-05-07 M & T Chemicals Inc A method, bath and cell for the electrodeposition of tin-bismuth alloys
US5039576A (en) * 1989-05-22 1991-08-13 Atochem North America, Inc. Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5450784A (en) * 1993-09-28 1995-09-19 Detroit Diesel Corporation Electroplated piston skirt for improved scuff resistance
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP4728462B2 (en) * 2000-02-29 2011-07-20 日本リーロナール有限会社 Tin electroplating solution and plating method
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
JP6084112B2 (en) * 2013-05-09 2017-02-22 株式会社荏原製作所 Sn alloy plating apparatus and Sn alloy plating method
US9850588B2 (en) 2015-09-09 2017-12-26 Rohm And Haas Electronic Materials Llc Bismuth electroplating baths and methods of electroplating bismuth on a substrate
KR102579360B1 (en) * 2018-12-04 2023-09-18 현대자동차주식회사 Auxiliary brake control system of vehicle

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL54999C (en) * 1938-03-07
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
GB1051927A (en) * 1964-07-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111188069A (en) * 2019-12-31 2020-05-22 大连长丰实业总公司 Tin-plated bismuth alloy solution and preparation method thereof

Also Published As

Publication number Publication date
JPS4931606B1 (en) 1974-08-23
FR2071199A5 (en) 1971-09-17
DE2050145A1 (en) 1971-06-24
US3663384A (en) 1972-05-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee