IT995341B - PROCEDURE FOR ELECTROFORMING OF NICKEL COPPER ALLOYS - Google Patents

PROCEDURE FOR ELECTROFORMING OF NICKEL COPPER ALLOYS

Info

Publication number
IT995341B
IT995341B IT28841/73A IT2884173A IT995341B IT 995341 B IT995341 B IT 995341B IT 28841/73 A IT28841/73 A IT 28841/73A IT 2884173 A IT2884173 A IT 2884173A IT 995341 B IT995341 B IT 995341B
Authority
IT
Italy
Prior art keywords
electroforming
procedure
copper alloys
nickel copper
nickel
Prior art date
Application number
IT28841/73A
Other languages
Italian (it)
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of IT995341B publication Critical patent/IT995341B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
IT28841/73A 1972-12-18 1973-09-12 PROCEDURE FOR ELECTROFORMING OF NICKEL COPPER ALLOYS IT995341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Publications (1)

Publication Number Publication Date
IT995341B true IT995341B (en) 1975-11-10

Family

ID=23228346

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28841/73A IT995341B (en) 1972-12-18 1973-09-12 PROCEDURE FOR ELECTROFORMING OF NICKEL COPPER ALLOYS

Country Status (8)

Country Link
US (1) US3833481A (en)
JP (1) JPS4990234A (en)
BE (1) BE804107A (en)
CA (1) CA1019274A (en)
DE (1) DE2359924A1 (en)
GB (1) GB1435208A (en)
IT (1) IT995341B (en)
NL (1) NL7310599A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
JP2670867B2 (en) * 1989-10-14 1997-10-29 同和鉱業株式会社 Aluminum alloy material plating method
MY111621A (en) * 1993-12-16 2000-09-27 Kiyokawa Plating Ind Co Ltd Method for producing metal film resistor
TW317575B (en) * 1994-01-21 1997-10-11 Olin Corp
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
EP1281789B1 (en) 2001-07-31 2006-05-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) A plated copper alloy material and process for production thereof
US6992389B2 (en) * 2004-04-28 2006-01-31 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (en) * 2011-07-14 2012-03-28 徐志花 Novel and high-efficiency NiCu/Cu electrochemical sensor for detecting nitrobenzene and preparation method thereof
TWI580822B (en) 2012-04-19 2017-05-01 迪普索股份有限公司 Copper-nickel alloy electroplating bath and electroplating method
CN103484904A (en) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 Copper plating process for iron-based hardware
JP6439172B2 (en) * 2014-08-08 2018-12-19 ディップソール株式会社 Copper-nickel alloy electroplating bath
CH713970A1 (en) * 2017-07-12 2019-01-15 Sa De La Manufacture Dhorlogerie Audemars Piguet & Cie Watchmaking component in non-magnetic CuNi binary alloy.
CN113774442B (en) * 2021-09-23 2023-02-17 中冶赛迪技术研究中心有限公司 Nano composite coating based on endogenesis precipitation method and preparation process thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
DE576585C (en) * 1931-05-13 1933-05-13 Julius Winkler Jr Process for the production of alloyed galvanic deposits
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Also Published As

Publication number Publication date
NL7310599A (en) 1974-06-20
DE2359924A1 (en) 1974-06-20
JPS4990234A (en) 1974-08-28
GB1435208A (en) 1976-05-12
BE804107A (en) 1973-12-17
US3833481A (en) 1974-09-03
CA1019274A (en) 1977-10-18

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