DE19517573C2 - Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter - Google Patents

Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter

Info

Publication number
DE19517573C2
DE19517573C2 DE19517573A DE19517573A DE19517573C2 DE 19517573 C2 DE19517573 C2 DE 19517573C2 DE 19517573 A DE19517573 A DE 19517573A DE 19517573 A DE19517573 A DE 19517573A DE 19517573 C2 DE19517573 C2 DE 19517573C2
Authority
DE
Germany
Prior art keywords
container
fluid
overflow
substrates
overflow device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19517573A
Other languages
German (de)
English (en)
Other versions
DE19517573A1 (de
Inventor
Ludwig Denzler
Helmuth Harms-Janssen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Microtech GmbH
Original Assignee
Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19517573A priority Critical patent/DE19517573C2/de
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Priority to PCT/EP1996/001813 priority patent/WO1996036068A1/de
Priority to CA002217777A priority patent/CA2217777A1/en
Priority to CN96193885A priority patent/CN1079988C/zh
Priority to KR1019970708031A priority patent/KR100303230B1/ko
Priority to AT96914162T priority patent/ATE186423T1/de
Priority to DE59603571T priority patent/DE59603571D1/de
Priority to US08/952,708 priority patent/US5879464A/en
Priority to EP96914162A priority patent/EP0826232B1/de
Priority to JP08533713A priority patent/JP3088466B2/ja
Priority to TW085105340A priority patent/TW303309B/zh
Publication of DE19517573A1 publication Critical patent/DE19517573A1/de
Application granted granted Critical
Publication of DE19517573C2 publication Critical patent/DE19517573C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D21/00—Separation of suspended solid particles from liquids by sedimentation
    • B01D21/24—Feed or discharge mechanisms for settling tanks
    • B01D21/2433—Discharge mechanisms for floating particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE19517573A 1995-05-12 1995-05-12 Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter Expired - Fee Related DE19517573C2 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE19517573A DE19517573C2 (de) 1995-05-12 1995-05-12 Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter
EP96914162A EP0826232B1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter
CN96193885A CN1079988C (zh) 1995-05-12 1996-05-02 用于在容器中湿处理衬底的方法及设备
KR1019970708031A KR100303230B1 (ko) 1995-05-12 1996-05-02 용기내의기판의웨트처리를위한방법및장치
AT96914162T ATE186423T1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter
DE59603571T DE59603571D1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter
PCT/EP1996/001813 WO1996036068A1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter
CA002217777A CA2217777A1 (en) 1995-05-12 1996-05-02 Method and device for the wet processing of substrates in a container
JP08533713A JP3088466B2 (ja) 1995-05-12 1996-05-02 容器中での基材の湿式処理法及び装置
US08/952,708 US5879464A (en) 1995-05-12 1996-05-02 Method and device for wet-processing substrates in a vessel
TW085105340A TW303309B (enExample) 1995-05-12 1996-05-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19517573A DE19517573C2 (de) 1995-05-12 1995-05-12 Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter

Publications (2)

Publication Number Publication Date
DE19517573A1 DE19517573A1 (de) 1996-11-14
DE19517573C2 true DE19517573C2 (de) 2000-11-02

Family

ID=7761821

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19517573A Expired - Fee Related DE19517573C2 (de) 1995-05-12 1995-05-12 Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter
DE59603571T Expired - Fee Related DE59603571D1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59603571T Expired - Fee Related DE59603571D1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter

Country Status (10)

Country Link
US (1) US5879464A (enExample)
EP (1) EP0826232B1 (enExample)
JP (1) JP3088466B2 (enExample)
KR (1) KR100303230B1 (enExample)
CN (1) CN1079988C (enExample)
AT (1) ATE186423T1 (enExample)
CA (1) CA2217777A1 (enExample)
DE (2) DE19517573C2 (enExample)
TW (1) TW303309B (enExample)
WO (1) WO1996036068A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116868A (ja) * 1997-06-27 1999-01-22 Toshiba Corp 薬液置換装置及び薬液置換方法
US6216709B1 (en) 1998-09-04 2001-04-17 Komag, Inc. Method for drying a substrate
US6571806B2 (en) 1998-09-04 2003-06-03 Komag, Inc. Method for drying a substrate
GB2351279B (en) * 1999-06-22 2001-08-01 John Joseph Devuyst Draining vessel
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
DE10359320A1 (de) * 2003-12-17 2005-07-21 Scp Germany Gmbh Vorrichtung und Verfahren zum Trocknen von Substraten
KR101951778B1 (ko) * 2017-07-25 2019-02-25 무진전자 주식회사 웨이퍼 에칭 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT208307B (de) * 1959-02-10 1960-03-25 Franz Dr Ing Boehm Zumeßvorrichtung zur proportionalen Einbringung von Chemikalienlösungen in periodisch beschickte Behälter
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
CA2040989A1 (en) * 1990-05-01 1991-11-02 Ichiro Yoshida Washing/drying method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT208307B (de) * 1959-02-10 1960-03-25 Franz Dr Ing Boehm Zumeßvorrichtung zur proportionalen Einbringung von Chemikalienlösungen in periodisch beschickte Behälter
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers

Also Published As

Publication number Publication date
CN1184557A (zh) 1998-06-10
DE19517573A1 (de) 1996-11-14
CA2217777A1 (en) 1996-11-14
JPH10510101A (ja) 1998-09-29
US5879464A (en) 1999-03-09
EP0826232B1 (de) 1999-11-03
TW303309B (enExample) 1997-04-21
KR19990014690A (ko) 1999-02-25
EP0826232A1 (de) 1998-03-04
ATE186423T1 (de) 1999-11-15
KR100303230B1 (ko) 2001-11-30
DE59603571D1 (de) 1999-12-09
JP3088466B2 (ja) 2000-09-18
WO1996036068A1 (de) 1996-11-14
CN1079988C (zh) 2002-02-27

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: STEAG MICROTECH GMBH, 72124 PLIEZHAUSEN, DE

D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SCP U.S.,INC., WILMINGTON, DEL., US

8339 Ceased/non-payment of the annual fee