TW303309B - - Google Patents

Download PDF

Info

Publication number
TW303309B
TW303309B TW085105340A TW85105340A TW303309B TW 303309 B TW303309 B TW 303309B TW 085105340 A TW085105340 A TW 085105340A TW 85105340 A TW85105340 A TW 85105340A TW 303309 B TW303309 B TW 303309B
Authority
TW
Taiwan
Prior art keywords
liquid
item
container
overflow
patent application
Prior art date
Application number
TW085105340A
Other languages
English (en)
Chinese (zh)
Original Assignee
Steag Micro Tech Gmbh Donaueschingen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Micro Tech Gmbh Donaueschingen filed Critical Steag Micro Tech Gmbh Donaueschingen
Application granted granted Critical
Publication of TW303309B publication Critical patent/TW303309B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D21/00—Separation of suspended solid particles from liquids by sedimentation
    • B01D21/24—Feed or discharge mechanisms for settling tanks
    • B01D21/2433—Discharge mechanisms for floating particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW085105340A 1995-05-12 1996-05-03 TW303309B (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19517573A DE19517573C2 (de) 1995-05-12 1995-05-12 Verfahren und Vorrichtung zur Naßbehandlung von Substraten in einem Behälter
PCT/EP1996/001813 WO1996036068A1 (de) 1995-05-12 1996-05-02 Verfahren und vorrichtung zur nassbehandlung von substraten in einem behälter

Publications (1)

Publication Number Publication Date
TW303309B true TW303309B (enExample) 1997-04-21

Family

ID=7761821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105340A TW303309B (enExample) 1995-05-12 1996-05-03

Country Status (10)

Country Link
US (1) US5879464A (enExample)
EP (1) EP0826232B1 (enExample)
JP (1) JP3088466B2 (enExample)
KR (1) KR100303230B1 (enExample)
CN (1) CN1079988C (enExample)
AT (1) ATE186423T1 (enExample)
CA (1) CA2217777A1 (enExample)
DE (2) DE19517573C2 (enExample)
TW (1) TW303309B (enExample)
WO (1) WO1996036068A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116868A (ja) * 1997-06-27 1999-01-22 Toshiba Corp 薬液置換装置及び薬液置換方法
US6216709B1 (en) 1998-09-04 2001-04-17 Komag, Inc. Method for drying a substrate
US6571806B2 (en) 1998-09-04 2003-06-03 Komag, Inc. Method for drying a substrate
GB2351279B (en) * 1999-06-22 2001-08-01 John Joseph Devuyst Draining vessel
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
DE10359320A1 (de) * 2003-12-17 2005-07-21 Scp Germany Gmbh Vorrichtung und Verfahren zum Trocknen von Substraten
KR101951778B1 (ko) * 2017-07-25 2019-02-25 무진전자 주식회사 웨이퍼 에칭 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT208307B (de) * 1959-02-10 1960-03-25 Franz Dr Ing Boehm Zumeßvorrichtung zur proportionalen Einbringung von Chemikalienlösungen in periodisch beschickte Behälter
US4722752A (en) * 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
CA2040989A1 (en) * 1990-05-01 1991-11-02 Ichiro Yoshida Washing/drying method and apparatus

Also Published As

Publication number Publication date
CN1184557A (zh) 1998-06-10
DE19517573A1 (de) 1996-11-14
CA2217777A1 (en) 1996-11-14
JPH10510101A (ja) 1998-09-29
US5879464A (en) 1999-03-09
EP0826232B1 (de) 1999-11-03
KR19990014690A (ko) 1999-02-25
EP0826232A1 (de) 1998-03-04
ATE186423T1 (de) 1999-11-15
KR100303230B1 (ko) 2001-11-30
DE59603571D1 (de) 1999-12-09
DE19517573C2 (de) 2000-11-02
JP3088466B2 (ja) 2000-09-18
WO1996036068A1 (de) 1996-11-14
CN1079988C (zh) 2002-02-27

Similar Documents

Publication Publication Date Title
TW303309B (enExample)
TW436912B (en) Wet etching apparatus for manufacturing semiconductor devices and method of circulating etching solution therein
TW382749B (en) Liquid supplying device
CN1308590A (zh) 灌－穿型水处理配水器
TW447005B (en) Bubble separator for manufacturing semiconductor devices and apparatus for supplying liquid and its driving method thereby
US2319531A (en) Apparatus for cleansing tubular elements
CN206328241U (zh) 一种污水处理装置
JP3386892B2 (ja) 洗浄槽
JP4034792B2 (ja) 炊飯水交換装置とそれを用いる炊飯システム
JPS63110731A (ja) 半導体基板処理装置
US1074572A (en) Photograph-developing apparatus.
JP4341185B2 (ja) 薬液製造装置
CN219401366U (zh) 一种用于储存待清洁半导体硅片的装置
CN215029108U (zh) 一种多功能化学教学用试验台
CN216937362U (zh) 一种用于移液枪枪头的多功能清洗桶
US1002946A (en) Developing-tank.
CN214972214U (zh) 一种多介质的雨水过滤装置
CN220982411U (zh) 一种分层同步称重设备
CN109297791B (zh) 一种迁移池及其使用方法
JP7156426B2 (ja) 濃度分布測定装置
JP2585524Y2 (ja) 蒸気放出ノズル
CN217171020U (zh) 一种方罐溶剂分装装置
CN221939114U (zh) 一种小磨香油储存罐
US548245A (en) Adolf bodesch
CN202136849U (zh) 电子化学品过滤装置