DE19503823C2 - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer Halbleitervorrichtung

Info

Publication number
DE19503823C2
DE19503823C2 DE19503823A DE19503823A DE19503823C2 DE 19503823 C2 DE19503823 C2 DE 19503823C2 DE 19503823 A DE19503823 A DE 19503823A DE 19503823 A DE19503823 A DE 19503823A DE 19503823 C2 DE19503823 C2 DE 19503823C2
Authority
DE
Germany
Prior art keywords
carrier plate
wires
lead wire
semiconductor device
casting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19503823A
Other languages
German (de)
English (en)
Other versions
DE19503823A1 (de
Inventor
Tetsuya Ueda
Kazunari Michii
Yutaka Koyama
Naoto Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE19503823A1 publication Critical patent/DE19503823A1/de
Application granted granted Critical
Publication of DE19503823C2 publication Critical patent/DE19503823C2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W70/442—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE19503823A 1994-02-07 1995-02-06 Verfahren zur Herstellung einer Halbleitervorrichtung Expired - Lifetime DE19503823C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6013751A JP2866572B2 (ja) 1994-02-07 1994-02-07 半導体製造方法

Publications (2)

Publication Number Publication Date
DE19503823A1 DE19503823A1 (de) 1995-08-10
DE19503823C2 true DE19503823C2 (de) 2001-01-25

Family

ID=11841960

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19503823A Expired - Lifetime DE19503823C2 (de) 1994-02-07 1995-02-06 Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US5508232A (enExample)
JP (1) JP2866572B2 (enExample)
KR (1) KR0185790B1 (enExample)
DE (1) DE19503823C2 (enExample)
TW (1) TW269740B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260550A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置
US6600215B1 (en) 1998-04-02 2003-07-29 Micron Technology, Inc. Method and apparatus for coupling a semiconductor die to die terminals
TW434756B (en) 1998-06-01 2001-05-16 Hitachi Ltd Semiconductor device and its manufacturing method
US6221748B1 (en) 1999-08-19 2001-04-24 Micron Technology, Inc. Apparatus and method for providing mechanically pre-formed conductive leads
US6199743B1 (en) 1999-08-19 2001-03-13 Micron Technology, Inc. Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
KR100391124B1 (ko) * 2001-05-18 2003-07-12 에쓰에쓰아이 주식회사 반도체 패키지의 베이스, 이를 이용한 반도체 패키지 및그 제조방법
US20060278962A1 (en) * 2005-06-09 2006-12-14 Tessera, Inc. Microelectronic loop packages
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
US7763958B1 (en) * 2007-05-25 2010-07-27 National Semiconductor Corporation Leadframe panel for power packages
TWI462194B (zh) * 2011-08-25 2014-11-21 南茂科技股份有限公司 半導體封裝結構及其製作方法
US10699992B2 (en) * 2015-12-23 2020-06-30 Intel Corporation Reverse mounted gull wing electronic package
US10867894B2 (en) * 2018-10-11 2020-12-15 Asahi Kasei Microdevices Corporation Semiconductor element including encapsulated lead frames
JP2024112603A (ja) * 2023-02-08 2024-08-21 三菱電機株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0108502A2 (en) * 1982-10-08 1984-05-16 Fujitsu Limited A plastics moulded semiconductor device and a method of producing it
EP0447922A1 (en) * 1990-03-13 1991-09-25 Kabushiki Kaisha Toshiba Resin seal type semiconductor device
EP0477937A1 (en) * 1990-09-27 1992-04-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445271A (en) * 1981-08-14 1984-05-01 Amp Incorporated Ceramic chip carrier with removable lead frame support and preforated ground pad
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法
JPH01201947A (ja) * 1988-02-05 1989-08-14 Nec Corp 半導体装置
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
JPH02253650A (ja) * 1989-03-28 1990-10-12 Nec Corp リードフレーム
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
US5334872A (en) * 1990-01-29 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
JPH04192450A (ja) * 1990-11-27 1992-07-10 Sumitomo Metal Mining Co Ltd 複合リードフレーム
JPH04249348A (ja) * 1991-02-05 1992-09-04 Toshiba Corp 樹脂封止型半導体装置およびその製造方法
JP3215851B2 (ja) * 1991-02-13 2001-10-09 日立化成工業株式会社 樹脂封止型半導体装置およびその製造法
US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
US5327008A (en) * 1993-03-22 1994-07-05 Motorola Inc. Semiconductor device having universal low-stress die support and method for making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0108502A2 (en) * 1982-10-08 1984-05-16 Fujitsu Limited A plastics moulded semiconductor device and a method of producing it
EP0447922A1 (en) * 1990-03-13 1991-09-25 Kabushiki Kaisha Toshiba Resin seal type semiconductor device
EP0477937A1 (en) * 1990-09-27 1992-04-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type

Also Published As

Publication number Publication date
KR0185790B1 (ko) 1999-03-20
TW269740B (enExample) 1996-02-01
JPH07221243A (ja) 1995-08-18
US5508232A (en) 1996-04-16
KR950025963A (ko) 1995-09-18
JP2866572B2 (ja) 1999-03-08
DE19503823A1 (de) 1995-08-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
R071 Expiry of right