DE112022005002T5 - Selbstklebendes Klebeband - Google Patents

Selbstklebendes Klebeband Download PDF

Info

Publication number
DE112022005002T5
DE112022005002T5 DE112022005002.0T DE112022005002T DE112022005002T5 DE 112022005002 T5 DE112022005002 T5 DE 112022005002T5 DE 112022005002 T DE112022005002 T DE 112022005002T DE 112022005002 T5 DE112022005002 T5 DE 112022005002T5
Authority
DE
Germany
Prior art keywords
adhesive tape
adhesive layer
meth
adhesive
chip components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022005002.0T
Other languages
German (de)
English (en)
Inventor
Noriyuki Uchida
Yudai OGATA
Kozo Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of DE112022005002T5 publication Critical patent/DE112022005002T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112022005002.0T 2021-10-21 2022-10-20 Selbstklebendes Klebeband Pending DE112022005002T5 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021-172625 2021-10-21
JP2021172625 2021-10-21
JP2021-214308 2021-12-28
JP2021214308 2021-12-28
PCT/JP2022/039017 WO2023068314A1 (ja) 2021-10-21 2022-10-20 粘着テープ

Publications (1)

Publication Number Publication Date
DE112022005002T5 true DE112022005002T5 (de) 2024-08-01

Family

ID=86058281

Family Applications (2)

Application Number Title Priority Date Filing Date
DE112022005002.0T Pending DE112022005002T5 (de) 2021-10-21 2022-10-20 Selbstklebendes Klebeband
DE112022005024.1T Pending DE112022005024T5 (de) 2021-10-21 2022-10-20 Selbstklebendes Klebeband

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112022005024.1T Pending DE112022005024T5 (de) 2021-10-21 2022-10-20 Selbstklebendes Klebeband

Country Status (5)

Country Link
JP (4) JPWO2023068315A1 (https=)
KR (2) KR20240086601A (https=)
DE (2) DE112022005002T5 (https=)
TW (2) TW202330849A (https=)
WO (2) WO2023068315A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025183021A1 (ja) * 2024-03-01 2025-09-04 住友ベークライト株式会社 粘着テープ
WO2026054025A1 (ja) * 2024-09-05 2026-03-12 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (ja) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 転写基板、及び転写方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2806592B2 (ja) * 1990-02-14 1998-09-30 積水化学工業株式会社 アクリル系粘着剤組成物及び粘着テープ、粘着ラベル又は粘着シート
JP2011116916A (ja) * 2009-12-07 2011-06-16 Daio Paper Corp 粘着剤組成物、及び粘着シート
JP2013173913A (ja) * 2011-11-10 2013-09-05 Nitto Denko Corp 板の剥離方法
JP2013159760A (ja) * 2012-02-08 2013-08-19 Daio Paper Corp 熱伝導性粘着シート
CN106687545B (zh) * 2014-07-14 2020-10-16 电化株式会社 聚偏二氟乙烯系树脂粘合薄膜
GB2544335A (en) * 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP6757479B2 (ja) * 2019-01-30 2020-09-16 日東電工株式会社 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置
KR102554028B1 (ko) * 2019-02-07 2023-07-11 (주)이녹스첨단소재 폴더블 디스플레이용 점착제 조성물
JP7744137B2 (ja) * 2021-01-29 2025-09-25 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (ja) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 転写基板、及び転写方法

Also Published As

Publication number Publication date
TW202334358A (zh) 2023-09-01
KR20240086601A (ko) 2024-06-18
JP2024086923A (ja) 2024-06-28
DE112022005024T5 (de) 2024-08-01
JPWO2023068315A1 (https=) 2023-04-27
KR20240086602A (ko) 2024-06-18
JP2024163338A (ja) 2024-11-21
WO2023068315A1 (ja) 2023-04-27
TW202330849A (zh) 2023-08-01
WO2023068314A1 (ja) 2023-04-27
JP7476351B2 (ja) 2024-04-30
JPWO2023068314A1 (https=) 2023-04-27

Similar Documents

Publication Publication Date Title
DE60109951T2 (de) Durch energetische strahlung härtbare, thermisch entfernbare, druckempfindliche klebefolie sowie verfahren zum zerschneiden von teilen unter verwendung dieser folie
EP2226372B2 (de) Haftklebemassen zur Verklebung von Druckplatten
DE602005002454T2 (de) Acrylhaftklebstoffzusammensetzung für polarisationsfolie
DE60128894T2 (de) Acrylklebstoffzusammensetzungen für polarisierende filme sowie diese verwendender polarisierender film
DE60117287T2 (de) Vernetzte haftklebemittelzusammensetzungen sowie auf diesen basierende, für hochtemperaturanwendungen verwendbare klebende gegenstände
EP2116584B1 (de) Haftklebebänder zur Verklebung von Druckplatten
EP2867321B1 (de) Haftklebemasse zur verklebung von druckklischees auf druckzylindern für den flexodruck
EP3272828B1 (de) Haftklebemassen für die verklebung von flexiblen druckplatten
TWI639674B (zh) Adhesive sheet for electronic equipment
DE112022005002T5 (de) Selbstklebendes Klebeband
DE10107337A1 (de) Haftkleberfolie zum Wafer-Kleben
DE112006003042T5 (de) Klebstoffzusammensetzung und Klebstofffilm
DE102009045812A1 (de) Verfahren zur Herstellung von Verklebungen
DE60117560T2 (de) Polycaprolacton-klebemittelzusammensetzung
DE69833920T2 (de) Abdeckstreifen zum Transport von Chips und abgedichtete Struktur
DE69520826T2 (de) Retroreflektives kennzeichenschild und herstellungsverfahren
DE102022107748A1 (de) Klebeband zur Verklebung auf Lacken
EP2521739B1 (de) Multimodale copolymere, deren herstellung und verwendung in haftklebemassen
WO2020158414A1 (ja) 表面保護フィルム
DE102020207470A1 (de) Optisch transparentes hochflexibles klebeband sowie dessen verwendung zur verklebung von optischen bauteilen
DE102018216865A1 (de) Verwendung einer verdickten alkoholischen Zusammensetzung zur vertikalen, blasenfreien Verklebung von Substraten sowie Verfahren zur vertikalen Fügung zweier Substrate
EP3272827A1 (de) Haftklebemassen für die verklebung von flexiblen druckplatten
DE602004009127T2 (de) Zweischicht-Kunststofffolir und Klebeband
EP4202004A1 (de) Haftklebemasse für die verklebung von druckplatten
DE112019002716T5 (de) Haftklebstofffolie zum Oberflächenschutz