KR20240086601A - 점착 테이프 - Google Patents

점착 테이프 Download PDF

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Publication number
KR20240086601A
KR20240086601A KR1020237033412A KR20237033412A KR20240086601A KR 20240086601 A KR20240086601 A KR 20240086601A KR 1020237033412 A KR1020237033412 A KR 1020237033412A KR 20237033412 A KR20237033412 A KR 20237033412A KR 20240086601 A KR20240086601 A KR 20240086601A
Authority
KR
South Korea
Prior art keywords
adhesive tape
meth
adhesive layer
adhesive
acrylic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237033412A
Other languages
English (en)
Korean (ko)
Inventor
노리유키 우치다
유다이 오가타
고조 우에다
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20240086601A publication Critical patent/KR20240086601A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • H01L21/6835—
    • H01L24/97—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H01L2221/68354—
    • H01L2221/68368—
    • H01L2224/95001—
    • H01L2924/12041—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020237033412A 2021-10-21 2022-10-20 점착 테이프 Pending KR20240086601A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021172625 2021-10-21
JPJP-P-2021-172625 2021-10-21
JP2021214308 2021-12-28
JPJP-P-2021-214308 2021-12-28
PCT/JP2022/039020 WO2023068315A1 (ja) 2021-10-21 2022-10-20 粘着テープ

Publications (1)

Publication Number Publication Date
KR20240086601A true KR20240086601A (ko) 2024-06-18

Family

ID=86058281

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237033412A Pending KR20240086601A (ko) 2021-10-21 2022-10-20 점착 테이프
KR1020237033413A Pending KR20240086602A (ko) 2021-10-21 2022-10-20 점착 테이프

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237033413A Pending KR20240086602A (ko) 2021-10-21 2022-10-20 점착 테이프

Country Status (5)

Country Link
JP (4) JPWO2023068315A1 (https=)
KR (2) KR20240086601A (https=)
DE (2) DE112022005002T5 (https=)
TW (2) TW202330849A (https=)
WO (2) WO2023068315A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025183021A1 (ja) * 2024-03-01 2025-09-04 住友ベークライト株式会社 粘着テープ
WO2026054025A1 (ja) * 2024-09-05 2026-03-12 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (ja) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 転写基板、及び転写方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2806592B2 (ja) * 1990-02-14 1998-09-30 積水化学工業株式会社 アクリル系粘着剤組成物及び粘着テープ、粘着ラベル又は粘着シート
JP2011116916A (ja) * 2009-12-07 2011-06-16 Daio Paper Corp 粘着剤組成物、及び粘着シート
JP2013173913A (ja) * 2011-11-10 2013-09-05 Nitto Denko Corp 板の剥離方法
JP2013159760A (ja) * 2012-02-08 2013-08-19 Daio Paper Corp 熱伝導性粘着シート
CN106687545B (zh) * 2014-07-14 2020-10-16 电化株式会社 聚偏二氟乙烯系树脂粘合薄膜
GB2544335A (en) * 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP6757479B2 (ja) * 2019-01-30 2020-09-16 日東電工株式会社 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置
KR102554028B1 (ko) * 2019-02-07 2023-07-11 (주)이녹스첨단소재 폴더블 디스플레이용 점착제 조성물
JP7744137B2 (ja) * 2021-01-29 2025-09-25 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019065441A1 (ja) 2017-09-29 2019-04-04 東レエンジニアリング株式会社 転写基板、及び転写方法

Also Published As

Publication number Publication date
TW202334358A (zh) 2023-09-01
JP2024086923A (ja) 2024-06-28
DE112022005024T5 (de) 2024-08-01
JPWO2023068315A1 (https=) 2023-04-27
DE112022005002T5 (de) 2024-08-01
KR20240086602A (ko) 2024-06-18
JP2024163338A (ja) 2024-11-21
WO2023068315A1 (ja) 2023-04-27
TW202330849A (zh) 2023-08-01
WO2023068314A1 (ja) 2023-04-27
JP7476351B2 (ja) 2024-04-30
JPWO2023068314A1 (https=) 2023-04-27

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