JPWO2023068315A1 - - Google Patents

Info

Publication number
JPWO2023068315A1
JPWO2023068315A1 JP2022573480A JP2022573480A JPWO2023068315A1 JP WO2023068315 A1 JPWO2023068315 A1 JP WO2023068315A1 JP 2022573480 A JP2022573480 A JP 2022573480A JP 2022573480 A JP2022573480 A JP 2022573480A JP WO2023068315 A1 JPWO2023068315 A1 JP WO2023068315A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022573480A
Other languages
Japanese (ja)
Other versions
JPWO2023068315A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023068315A1 publication Critical patent/JPWO2023068315A1/ja
Publication of JPWO2023068315A5 publication Critical patent/JPWO2023068315A5/ja
Priority to JP2024160036A priority Critical patent/JP2024163338A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022573480A 2021-10-21 2022-10-20 Pending JPWO2023068315A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024160036A JP2024163338A (ja) 2021-10-21 2024-09-17 粘着テープ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021172625 2021-10-21
JP2021214308 2021-12-28
PCT/JP2022/039020 WO2023068315A1 (ja) 2021-10-21 2022-10-20 粘着テープ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024160036A Division JP2024163338A (ja) 2021-10-21 2024-09-17 粘着テープ

Publications (2)

Publication Number Publication Date
JPWO2023068315A1 true JPWO2023068315A1 (https=) 2023-04-27
JPWO2023068315A5 JPWO2023068315A5 (https=) 2023-11-30

Family

ID=86058281

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2022573480A Pending JPWO2023068315A1 (https=) 2021-10-21 2022-10-20
JP2022567139A Active JP7476351B2 (ja) 2021-10-21 2022-10-20 粘着テープ
JP2024066654A Pending JP2024086923A (ja) 2021-10-21 2024-04-17 粘着テープ
JP2024160036A Pending JP2024163338A (ja) 2021-10-21 2024-09-17 粘着テープ

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2022567139A Active JP7476351B2 (ja) 2021-10-21 2022-10-20 粘着テープ
JP2024066654A Pending JP2024086923A (ja) 2021-10-21 2024-04-17 粘着テープ
JP2024160036A Pending JP2024163338A (ja) 2021-10-21 2024-09-17 粘着テープ

Country Status (5)

Country Link
JP (4) JPWO2023068315A1 (https=)
KR (2) KR20240086601A (https=)
DE (2) DE112022005002T5 (https=)
TW (2) TW202330849A (https=)
WO (2) WO2023068315A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025183021A1 (ja) * 2024-03-01 2025-09-04 住友ベークライト株式会社 粘着テープ
WO2026054025A1 (ja) * 2024-09-05 2026-03-12 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022116798A (ja) * 2021-01-29 2022-08-10 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2806592B2 (ja) * 1990-02-14 1998-09-30 積水化学工業株式会社 アクリル系粘着剤組成物及び粘着テープ、粘着ラベル又は粘着シート
JP2011116916A (ja) * 2009-12-07 2011-06-16 Daio Paper Corp 粘着剤組成物、及び粘着シート
JP2013173913A (ja) * 2011-11-10 2013-09-05 Nitto Denko Corp 板の剥離方法
JP2013159760A (ja) * 2012-02-08 2013-08-19 Daio Paper Corp 熱伝導性粘着シート
CN106687545B (zh) * 2014-07-14 2020-10-16 电化株式会社 聚偏二氟乙烯系树脂粘合薄膜
GB2544335A (en) * 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP6966281B2 (ja) 2017-09-29 2021-11-10 東レエンジニアリング株式会社 転写基板、及び転写方法
JP6757479B2 (ja) * 2019-01-30 2020-09-16 日東電工株式会社 粘着シート、粘着層付き光学フィルム、積層体、および画像表示装置
KR102554028B1 (ko) * 2019-02-07 2023-07-11 (주)이녹스첨단소재 폴더블 디스플레이용 점착제 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022116798A (ja) * 2021-01-29 2022-08-10 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Also Published As

Publication number Publication date
TW202334358A (zh) 2023-09-01
KR20240086601A (ko) 2024-06-18
JP2024086923A (ja) 2024-06-28
DE112022005024T5 (de) 2024-08-01
DE112022005002T5 (de) 2024-08-01
KR20240086602A (ko) 2024-06-18
JP2024163338A (ja) 2024-11-21
WO2023068315A1 (ja) 2023-04-27
TW202330849A (zh) 2023-08-01
WO2023068314A1 (ja) 2023-04-27
JP7476351B2 (ja) 2024-04-30
JPWO2023068314A1 (https=) 2023-04-27

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