DE112005001733T5 - Ultraviolettbestrahlungseinrichtung - Google Patents

Ultraviolettbestrahlungseinrichtung Download PDF

Info

Publication number
DE112005001733T5
DE112005001733T5 DE112005001733T DE112005001733T DE112005001733T5 DE 112005001733 T5 DE112005001733 T5 DE 112005001733T5 DE 112005001733 T DE112005001733 T DE 112005001733T DE 112005001733 T DE112005001733 T DE 112005001733T DE 112005001733 T5 DE112005001733 T5 DE 112005001733T5
Authority
DE
Germany
Prior art keywords
light emitting
emitting diodes
ultraviolet irradiation
row
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112005001733T
Other languages
German (de)
English (en)
Inventor
Kimihiko Kawasaki
Kenji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of DE112005001733T5 publication Critical patent/DE112005001733T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Led Device Packages (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE112005001733T 2004-07-22 2005-07-20 Ultraviolettbestrahlungseinrichtung Withdrawn DE112005001733T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-214534 2004-07-22
JP2004214534A JP4279738B2 (ja) 2004-07-22 2004-07-22 紫外線照射装置
PCT/JP2005/013267 WO2006009152A1 (ja) 2004-07-22 2005-07-20 紫外線照射装置

Publications (1)

Publication Number Publication Date
DE112005001733T5 true DE112005001733T5 (de) 2007-06-14

Family

ID=35785260

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005001733T Withdrawn DE112005001733T5 (de) 2004-07-22 2005-07-20 Ultraviolettbestrahlungseinrichtung

Country Status (7)

Country Link
US (1) US20080023639A1 (https=)
JP (1) JP4279738B2 (https=)
KR (1) KR20070032791A (https=)
CN (1) CN1989607A (https=)
DE (1) DE112005001733T5 (https=)
TW (1) TW200608479A (https=)
WO (1) WO2006009152A1 (https=)

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JP4624931B2 (ja) * 2006-01-19 2011-02-02 キヤノンマシナリー株式会社 ピックアップ装置及びピックアップ方法
JP2007329300A (ja) * 2006-06-08 2007-12-20 Disco Abrasive Syst Ltd 紫外線照射装置および紫外線照射装置を備えた切削機
JP5117709B2 (ja) * 2006-12-04 2013-01-16 リンテック株式会社 紫外線照射装置及び紫外線照射方法
WO2008142975A1 (ja) * 2007-05-18 2008-11-27 Tokyo Seimitsu Co., Ltd. ダイシング装置およびダイシング方法
JP5178268B2 (ja) * 2008-03-19 2013-04-10 トッパン・フォームズ株式会社 紫外線照射装置
JP5279309B2 (ja) * 2008-03-19 2013-09-04 トッパン・フォームズ株式会社 紫外線照射装置
JP5416918B2 (ja) * 2008-05-21 2014-02-12 リンテック株式会社 光照射装置及びこれに用いられる発光ダイオードの照度補正方法
JP4934112B2 (ja) * 2008-07-10 2012-05-16 リンテック株式会社 光照射装置
JP5075789B2 (ja) * 2008-10-20 2012-11-21 株式会社アルバック 光照射装置
JP2010171076A (ja) * 2009-01-20 2010-08-05 Lintec Corp 光照射装置及び光照射方法
JP5035272B2 (ja) * 2009-03-03 2012-09-26 ウシオ電機株式会社 光照射装置
JP5607310B2 (ja) * 2009-03-10 2014-10-15 リンテック株式会社 光照射装置及び光照射方法
JP5402121B2 (ja) * 2009-03-17 2014-01-29 セイコーエプソン株式会社 液滴吐出装置
JP5485570B2 (ja) * 2009-03-23 2014-05-07 リンテック株式会社 光照射装置及び光照射方法
JP5386232B2 (ja) 2009-05-26 2014-01-15 日東電工株式会社 紫外線照射装置
JP5257308B2 (ja) * 2009-09-17 2013-08-07 ウシオ電機株式会社 光照射装置
JP5547954B2 (ja) * 2009-12-14 2014-07-16 日東電工株式会社 粘着テープ剥離方法およびその装置
WO2011117946A1 (ja) * 2010-03-26 2011-09-29 シャープ株式会社 紫外線照射装置
US9456508B2 (en) * 2010-05-28 2016-09-27 Apple Inc. Methods for assembling electronic devices by internally curing light-sensitive adhesive
US9499338B2 (en) 2010-12-15 2016-11-22 Symbotic, LLC Automated bot transfer arm drive system
US11078017B2 (en) 2010-12-15 2021-08-03 Symbotic Llc Automated bot with transfer arm
US9266310B2 (en) 2011-12-16 2016-02-23 Apple Inc. Methods of joining device structures with adhesive
US9302457B2 (en) * 2012-09-07 2016-04-05 Apple Inc. Liquid optically clear adhesive lamination process control
WO2014142085A1 (ja) 2013-03-11 2014-09-18 リンテック株式会社 粘着シートおよび加工されたデバイス関連部材の製造方法
KR101671808B1 (ko) * 2014-12-03 2016-11-03 주식회사 필옵틱스 발광 다이오드를 이용한 자외선 경화 장치
JP6866631B2 (ja) * 2016-12-20 2021-04-28 東京エレクトロン株式会社 光処理装置、塗布、現像装置、光処理方法及び記憶媒体
JP6770428B2 (ja) * 2016-12-28 2020-10-14 株式会社Ｓｃｒｅｅｎホールディングス 除電装置および除電方法
JP6902452B2 (ja) * 2017-10-19 2021-07-14 株式会社荏原製作所 研磨装置
JP6805123B2 (ja) * 2017-12-27 2020-12-23 日機装株式会社 流体殺菌装置
CN110676283B (zh) * 2019-10-16 2022-03-25 福州大学 一种基于纳米线的μLED显示设计方法
KR102650608B1 (ko) * 2020-12-18 2024-03-25 세메스 주식회사 광 처리 부재, 그를 포함하는 기판 처리 장치 및 기판 처리 방법
KR20240036978A (ko) 2022-09-14 2024-03-21 삼성전자주식회사 광 조사 장치, 이를 포함하는 기판 디본딩 시스템 및 이를 이용한 기판 디본딩 방법
CN118998650B (zh) * 2024-10-22 2025-01-10 东莞锐视光电科技有限公司 一种紫外固化光源

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JPH0616529B2 (ja) * 1986-02-17 1994-03-02 ウシオ電機株式会社 粘着シ−ト処理装置
US6597008B1 (en) * 1999-09-09 2003-07-22 Fuji Photo Film Co., Ltd. Method of reading a radiation image converting panel
EP1229852A4 (en) * 1999-10-08 2006-03-15 Britesmile Inc DEVICE FOR SIMULTANEOUS ILLUMINATION OF TEETH
JP2003145812A (ja) * 2001-08-29 2003-05-21 Fuji Photo Film Co Ltd 定着器
JP2003098677A (ja) * 2001-09-25 2003-04-04 Pentax Corp 露光システム
US6596977B2 (en) * 2001-10-05 2003-07-22 Koninklijke Philips Electronics N.V. Average light sensing for PWM control of RGB LED based white light luminaries
US20030233138A1 (en) * 2002-06-12 2003-12-18 Altus Medical, Inc. Concentration of divergent light from light emitting diodes into therapeutic light energy
US7175712B2 (en) * 2003-01-09 2007-02-13 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US6903809B2 (en) * 2003-05-29 2005-06-07 Perkinelmer, Inc. Integrated, in-line bumping and exposure system
US6828576B2 (en) * 2003-06-11 2004-12-07 Paul Spivak UV LED light projection method and apparatus

Also Published As

Publication number Publication date
US20080023639A1 (en) 2008-01-31
JP4279738B2 (ja) 2009-06-17
JP2006040944A (ja) 2006-02-09
CN1989607A (zh) 2007-06-27
WO2006009152A1 (ja) 2006-01-26
TW200608479A (en) 2006-03-01
KR20070032791A (ko) 2007-03-22

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8139 Disposal/non-payment of the annual fee