DE102014212376B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102014212376B4
DE102014212376B4 DE102014212376.3A DE102014212376A DE102014212376B4 DE 102014212376 B4 DE102014212376 B4 DE 102014212376B4 DE 102014212376 A DE102014212376 A DE 102014212376A DE 102014212376 B4 DE102014212376 B4 DE 102014212376B4
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DE
Germany
Prior art keywords
semiconductor element
insulating substrate
semiconductor device
metal
metal structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102014212376.3A
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German (de)
English (en)
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DE102014212376A1 (de
Inventor
Kiyoshi Arai
Osamu Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of DE102014212376A1 publication Critical patent/DE102014212376A1/de
Application granted granted Critical
Publication of DE102014212376B4 publication Critical patent/DE102014212376B4/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
DE102014212376.3A 2013-07-03 2014-06-26 Halbleitervorrichtung Active DE102014212376B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-139454 2013-07-03
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Publications (2)

Publication Number Publication Date
DE102014212376A1 DE102014212376A1 (de) 2015-01-08
DE102014212376B4 true DE102014212376B4 (de) 2019-03-07

Family

ID=52106507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014212376.3A Active DE102014212376B4 (de) 2013-07-03 2014-06-26 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US9171773B2 (enExample)
JP (1) JP6120704B2 (enExample)
CN (1) CN104282641B (enExample)
DE (1) DE102014212376B4 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5954491B2 (ja) * 2013-03-21 2016-07-20 三菱電機株式会社 半導体装置
JP6300386B2 (ja) * 2015-03-23 2018-03-28 株式会社日立製作所 半導体装置
DE112015006571T5 (de) * 2015-05-26 2018-03-01 Mitsubishi Electric Corporation Verfahren zum herstellen einer halbleiteranordnung
JP6552450B2 (ja) * 2016-04-19 2019-07-31 三菱電機株式会社 半導体装置
JP6493317B2 (ja) * 2016-06-23 2019-04-03 三菱電機株式会社 半導体装置
US9960098B2 (en) * 2016-06-27 2018-05-01 Psemi Corporation Systems and methods for thermal conduction using S-contacts
WO2018025571A1 (ja) * 2016-08-05 2018-02-08 三菱電機株式会社 パワー半導体装置
US11107756B2 (en) * 2017-04-06 2021-08-31 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same, and power conversion device
CN107195623B (zh) * 2017-06-14 2023-10-27 扬州国扬电子有限公司 一种双面散热高可靠功率模块
CN109511279B (zh) * 2017-07-14 2022-07-15 新电元工业株式会社 电子模块
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10658386B2 (en) 2018-07-19 2020-05-19 Psemi Corporation Thermal extraction of single layer transfer integrated circuits
JP7038632B2 (ja) * 2018-09-12 2022-03-18 三菱電機株式会社 半導体装置、及び、半導体装置の製造方法
JP7516786B2 (ja) * 2019-06-21 2024-07-17 株式会社村田製作所 半導体装置及びその製造方法
WO2021084638A1 (ja) * 2019-10-30 2021-05-06 三菱電機株式会社 気密封止型半導体装置
CN111211097B (zh) * 2020-02-17 2021-11-16 珠海格力电器股份有限公司 一种功率半导体器件的封装模块和封装方法
CN113496958B (zh) * 2020-03-20 2024-05-10 无锡华润微电子有限公司 基板及封装结构
JP7407684B2 (ja) * 2020-09-30 2024-01-04 三菱電機株式会社 半導体装置
DE112020007729T5 (de) * 2020-10-19 2023-08-10 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2022201426A1 (ja) * 2021-03-25 2022-09-29 三菱電機株式会社 半導体装置および半導体装置の製造方法
CN117546286A (zh) * 2021-06-25 2024-02-09 阿莫先恩电子电器有限公司 电源模块
US12218018B2 (en) * 2022-04-21 2025-02-04 Infineon Technologies Ag Semiconductor encapsulant strength enhancer
JP2026035927A (ja) * 2022-12-15 2026-03-05 ローム株式会社 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US20060220178A1 (en) 2005-03-30 2006-10-05 Hirotoshi Kubo Semiconductor device and method of manufacturing the same
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package
US20130003314A1 (en) 2010-02-22 2013-01-03 Sanyo Electronic Co., Ltd. Multilayer printed circuit board and manufacturing method therefor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161925A (ja) 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP2007305962A (ja) * 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP4973059B2 (ja) 2006-08-09 2012-07-11 日産自動車株式会社 半導体装置及び電力変換装置
JP5098392B2 (ja) * 2007-03-28 2012-12-12 株式会社豊田自動織機 半導体装置
US7944033B2 (en) * 2007-10-18 2011-05-17 Infineon Technologies Ag Power semiconductor module
JP4634497B2 (ja) * 2008-11-25 2011-02-16 三菱電機株式会社 電力用半導体モジュール
JP5387620B2 (ja) * 2011-05-31 2014-01-15 株式会社安川電機 電力変換装置、半導体装置および電力変換装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US20060220178A1 (en) 2005-03-30 2006-10-05 Hirotoshi Kubo Semiconductor device and method of manufacturing the same
US20130003314A1 (en) 2010-02-22 2013-01-03 Sanyo Electronic Co., Ltd. Multilayer printed circuit board and manufacturing method therefor
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package

Also Published As

Publication number Publication date
CN104282641B (zh) 2018-03-16
JP2015015270A (ja) 2015-01-22
DE102014212376A1 (de) 2015-01-08
CN104282641A (zh) 2015-01-14
US9171773B2 (en) 2015-10-27
US20150008570A1 (en) 2015-01-08
JP6120704B2 (ja) 2017-04-26

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