JP6120704B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6120704B2
JP6120704B2 JP2013139454A JP2013139454A JP6120704B2 JP 6120704 B2 JP6120704 B2 JP 6120704B2 JP 2013139454 A JP2013139454 A JP 2013139454A JP 2013139454 A JP2013139454 A JP 2013139454A JP 6120704 B2 JP6120704 B2 JP 6120704B2
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Japan
Prior art keywords
semiconductor element
insulating substrate
metal pattern
metal
bonded
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JP2013139454A
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English (en)
Japanese (ja)
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JP2015015270A (ja
JP2015015270A5 (enExample
Inventor
新井　規由
規由 新井
修 碓井
修 碓井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2013139454A priority Critical patent/JP6120704B2/ja
Priority to US14/245,261 priority patent/US9171773B2/en
Priority to DE102014212376.3A priority patent/DE102014212376B4/de
Priority to CN201410314663.0A priority patent/CN104282641B/zh
Publication of JP2015015270A publication Critical patent/JP2015015270A/ja
Publication of JP2015015270A5 publication Critical patent/JP2015015270A5/ja
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Publication of JP6120704B2 publication Critical patent/JP6120704B2/ja
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    • H10W40/22—
    • H10W40/255—
    • H10W40/70—
    • H10W40/778—
    • H10W70/20—
    • H10W76/47—
    • H10W90/701—
    • H10W72/07651—
    • H10W72/60—
    • H10W72/884—
    • H10W74/00—
    • H10W76/15—
    • H10W90/734—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
JP2013139454A 2013-07-03 2013-07-03 半導体装置 Active JP6120704B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置
US14/245,261 US9171773B2 (en) 2013-07-03 2014-04-04 Semiconductor device
DE102014212376.3A DE102014212376B4 (de) 2013-07-03 2014-06-26 Halbleitervorrichtung
CN201410314663.0A CN104282641B (zh) 2013-07-03 2014-07-03 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2015015270A JP2015015270A (ja) 2015-01-22
JP2015015270A5 JP2015015270A5 (enExample) 2016-03-03
JP6120704B2 true JP6120704B2 (ja) 2017-04-26

Family

ID=52106507

Family Applications (1)

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JP2013139454A Active JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Country Status (4)

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US (1) US9171773B2 (enExample)
JP (1) JP6120704B2 (enExample)
CN (1) CN104282641B (enExample)
DE (1) DE102014212376B4 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147787A1 (ja) * 2013-03-21 2014-09-25 三菱電機株式会社 半導体装置
EP3276661B1 (en) * 2015-03-23 2021-01-13 Hitachi, Ltd. Semiconductor device
JP6456494B2 (ja) * 2015-05-26 2019-01-23 三菱電機株式会社 半導体装置の製造方法
JP6552450B2 (ja) * 2016-04-19 2019-07-31 三菱電機株式会社 半導体装置
JP6493317B2 (ja) * 2016-06-23 2019-04-03 三菱電機株式会社 半導体装置
US9960098B2 (en) * 2016-06-27 2018-05-01 Psemi Corporation Systems and methods for thermal conduction using S-contacts
US10727186B2 (en) * 2016-08-05 2020-07-28 Mitsubishi Electric Corporation Power semiconductor device
CN110462817B (zh) * 2017-04-06 2023-11-28 三菱电机株式会社 半导体装置及其制造方法、以及电力转换装置
CN107195623B (zh) * 2017-06-14 2023-10-27 扬州国扬电子有限公司 一种双面散热高可靠功率模块
US11658109B2 (en) 2017-07-14 2023-05-23 Shindengen Electric Manufacturing Co., Ltd. Electronic module
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10658386B2 (en) 2018-07-19 2020-05-19 Psemi Corporation Thermal extraction of single layer transfer integrated circuits
JP7038632B2 (ja) * 2018-09-12 2022-03-18 三菱電機株式会社 半導体装置、及び、半導体装置の製造方法
JP7516786B2 (ja) 2019-06-21 2024-07-17 株式会社村田製作所 半導体装置及びその製造方法
JP7123271B2 (ja) * 2019-10-30 2022-08-22 三菱電機株式会社 気密封止型半導体装置
CN111211097B (zh) * 2020-02-17 2021-11-16 珠海格力电器股份有限公司 一种功率半导体器件的封装模块和封装方法
CN113496958B (zh) * 2020-03-20 2024-05-10 无锡华润微电子有限公司 基板及封装结构
JP7407684B2 (ja) * 2020-09-30 2024-01-04 三菱電機株式会社 半導体装置
DE112020007729T5 (de) * 2020-10-19 2023-08-10 Mitsubishi Electric Corporation Halbleitervorrichtung
US20240063073A1 (en) * 2021-03-25 2024-02-22 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device
US12218018B2 (en) * 2022-04-21 2025-02-04 Infineon Technologies Ag Semiconductor encapsulant strength enhancer
WO2024128062A1 (ja) * 2022-12-15 2024-06-20 ローム株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161925A (ja) 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP5048230B2 (ja) 2005-03-30 2012-10-17 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP2007305962A (ja) * 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP4973059B2 (ja) 2006-08-09 2012-07-11 日産自動車株式会社 半導体装置及び電力変換装置
JP5098392B2 (ja) * 2007-03-28 2012-12-12 株式会社豊田自動織機 半導体装置
US7944033B2 (en) * 2007-10-18 2011-05-17 Infineon Technologies Ag Power semiconductor module
JP4634497B2 (ja) * 2008-11-25 2011-02-16 三菱電機株式会社 電力用半導体モジュール
CN102771200A (zh) 2010-02-22 2012-11-07 三洋电机株式会社 多层印刷电路板及其制造方法
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package
JP5387620B2 (ja) * 2011-05-31 2014-01-15 株式会社安川電機 電力変換装置、半導体装置および電力変換装置の製造方法

Also Published As

Publication number Publication date
CN104282641B (zh) 2018-03-16
US9171773B2 (en) 2015-10-27
JP2015015270A (ja) 2015-01-22
DE102014212376B4 (de) 2019-03-07
CN104282641A (zh) 2015-01-14
DE102014212376A1 (de) 2015-01-08
US20150008570A1 (en) 2015-01-08

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