JP6120704B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6120704B2
JP6120704B2 JP2013139454A JP2013139454A JP6120704B2 JP 6120704 B2 JP6120704 B2 JP 6120704B2 JP 2013139454 A JP2013139454 A JP 2013139454A JP 2013139454 A JP2013139454 A JP 2013139454A JP 6120704 B2 JP6120704 B2 JP 6120704B2
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Japan
Prior art keywords
semiconductor element
insulating substrate
metal pattern
metal
bonded
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JP2013139454A
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English (en)
Japanese (ja)
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JP2015015270A (ja
JP2015015270A5 (enExample
Inventor
新井　規由
規由 新井
修 碓井
修 碓井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2013139454A priority Critical patent/JP6120704B2/ja
Priority to US14/245,261 priority patent/US9171773B2/en
Priority to DE102014212376.3A priority patent/DE102014212376B4/de
Priority to CN201410314663.0A priority patent/CN104282641B/zh
Publication of JP2015015270A publication Critical patent/JP2015015270A/ja
Publication of JP2015015270A5 publication Critical patent/JP2015015270A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013139454A 2013-07-03 2013-07-03 半導体装置 Active JP6120704B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置
US14/245,261 US9171773B2 (en) 2013-07-03 2014-04-04 Semiconductor device
DE102014212376.3A DE102014212376B4 (de) 2013-07-03 2014-06-26 Halbleitervorrichtung
CN201410314663.0A CN104282641B (zh) 2013-07-03 2014-07-03 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2015015270A JP2015015270A (ja) 2015-01-22
JP2015015270A5 JP2015015270A5 (enExample) 2016-03-03
JP6120704B2 true JP6120704B2 (ja) 2017-04-26

Family

ID=52106507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013139454A Active JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Country Status (4)

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US (1) US9171773B2 (enExample)
JP (1) JP6120704B2 (enExample)
CN (1) CN104282641B (enExample)
DE (1) DE102014212376B4 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9585279B2 (en) * 2013-03-21 2017-02-28 Mitsubishi Electric Corporation Semiconductor device
EP3276661B1 (en) * 2015-03-23 2021-01-13 Hitachi, Ltd. Semiconductor device
CN107615463B (zh) * 2015-05-26 2020-05-05 三菱电机株式会社 半导体装置的制造方法
JP6552450B2 (ja) * 2016-04-19 2019-07-31 三菱電機株式会社 半導体装置
JP6493317B2 (ja) * 2016-06-23 2019-04-03 三菱電機株式会社 半導体装置
US9960098B2 (en) * 2016-06-27 2018-05-01 Psemi Corporation Systems and methods for thermal conduction using S-contacts
US10727186B2 (en) * 2016-08-05 2020-07-28 Mitsubishi Electric Corporation Power semiconductor device
CN110462817B (zh) * 2017-04-06 2023-11-28 三菱电机株式会社 半导体装置及其制造方法、以及电力转换装置
CN107195623B (zh) * 2017-06-14 2023-10-27 扬州国扬电子有限公司 一种双面散热高可靠功率模块
WO2019012678A1 (ja) 2017-07-14 2019-01-17 新電元工業株式会社 電子モジュール
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10658386B2 (en) 2018-07-19 2020-05-19 Psemi Corporation Thermal extraction of single layer transfer integrated circuits
JP7038632B2 (ja) * 2018-09-12 2022-03-18 三菱電機株式会社 半導体装置、及び、半導体装置の製造方法
JP7516786B2 (ja) 2019-06-21 2024-07-17 株式会社村田製作所 半導体装置及びその製造方法
WO2021084638A1 (ja) * 2019-10-30 2021-05-06 三菱電機株式会社 気密封止型半導体装置
CN111211097B (zh) * 2020-02-17 2021-11-16 珠海格力电器股份有限公司 一种功率半导体器件的封装模块和封装方法
CN113496958B (zh) * 2020-03-20 2024-05-10 无锡华润微电子有限公司 基板及封装结构
JP7407684B2 (ja) * 2020-09-30 2024-01-04 三菱電機株式会社 半導体装置
JP7486600B2 (ja) * 2020-10-19 2024-05-17 三菱電機株式会社 半導体装置
US20240063073A1 (en) * 2021-03-25 2024-02-22 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device
US12218018B2 (en) * 2022-04-21 2025-02-04 Infineon Technologies Ag Semiconductor encapsulant strength enhancer
WO2024128062A1 (ja) * 2022-12-15 2024-06-20 ローム株式会社 半導体装置

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JPH07161925A (ja) 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP5048230B2 (ja) 2005-03-30 2012-10-17 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP2007305962A (ja) * 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP4973059B2 (ja) 2006-08-09 2012-07-11 日産自動車株式会社 半導体装置及び電力変換装置
JP5098392B2 (ja) * 2007-03-28 2012-12-12 株式会社豊田自動織機 半導体装置
US7944033B2 (en) * 2007-10-18 2011-05-17 Infineon Technologies Ag Power semiconductor module
JP4634497B2 (ja) * 2008-11-25 2011-02-16 三菱電機株式会社 電力用半導体モジュール
CN102771200A (zh) 2010-02-22 2012-11-07 三洋电机株式会社 多层印刷电路板及其制造方法
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package
JP5387620B2 (ja) * 2011-05-31 2014-01-15 株式会社安川電機 電力変換装置、半導体装置および電力変換装置の製造方法

Also Published As

Publication number Publication date
DE102014212376B4 (de) 2019-03-07
CN104282641B (zh) 2018-03-16
CN104282641A (zh) 2015-01-14
US9171773B2 (en) 2015-10-27
JP2015015270A (ja) 2015-01-22
US20150008570A1 (en) 2015-01-08
DE102014212376A1 (de) 2015-01-08

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