JP6120704B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6120704B2
JP6120704B2 JP2013139454A JP2013139454A JP6120704B2 JP 6120704 B2 JP6120704 B2 JP 6120704B2 JP 2013139454 A JP2013139454 A JP 2013139454A JP 2013139454 A JP2013139454 A JP 2013139454A JP 6120704 B2 JP6120704 B2 JP 6120704B2
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JP
Japan
Prior art keywords
semiconductor element
insulating substrate
metal pattern
metal
bonded
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Active
Application number
JP2013139454A
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English (en)
Japanese (ja)
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JP2015015270A (ja
JP2015015270A5 (enExample
Inventor
新井　規由
規由 新井
修 碓井
修 碓井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2013139454A priority Critical patent/JP6120704B2/ja
Priority to US14/245,261 priority patent/US9171773B2/en
Priority to DE102014212376.3A priority patent/DE102014212376B4/de
Priority to CN201410314663.0A priority patent/CN104282641B/zh
Publication of JP2015015270A publication Critical patent/JP2015015270A/ja
Publication of JP2015015270A5 publication Critical patent/JP2015015270A5/ja
Application granted granted Critical
Publication of JP6120704B2 publication Critical patent/JP6120704B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2013139454A 2013-07-03 2013-07-03 半導体装置 Active JP6120704B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置
US14/245,261 US9171773B2 (en) 2013-07-03 2014-04-04 Semiconductor device
DE102014212376.3A DE102014212376B4 (de) 2013-07-03 2014-06-26 Halbleitervorrichtung
CN201410314663.0A CN104282641B (zh) 2013-07-03 2014-07-03 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013139454A JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2015015270A JP2015015270A (ja) 2015-01-22
JP2015015270A5 JP2015015270A5 (enExample) 2016-03-03
JP6120704B2 true JP6120704B2 (ja) 2017-04-26

Family

ID=52106507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013139454A Active JP6120704B2 (ja) 2013-07-03 2013-07-03 半導体装置

Country Status (4)

Country Link
US (1) US9171773B2 (enExample)
JP (1) JP6120704B2 (enExample)
CN (1) CN104282641B (enExample)
DE (1) DE102014212376B4 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5954491B2 (ja) * 2013-03-21 2016-07-20 三菱電機株式会社 半導体装置
JP6300386B2 (ja) * 2015-03-23 2018-03-28 株式会社日立製作所 半導体装置
DE112015006571T5 (de) * 2015-05-26 2018-03-01 Mitsubishi Electric Corporation Verfahren zum herstellen einer halbleiteranordnung
JP6552450B2 (ja) * 2016-04-19 2019-07-31 三菱電機株式会社 半導体装置
JP6493317B2 (ja) * 2016-06-23 2019-04-03 三菱電機株式会社 半導体装置
US9960098B2 (en) * 2016-06-27 2018-05-01 Psemi Corporation Systems and methods for thermal conduction using S-contacts
WO2018025571A1 (ja) * 2016-08-05 2018-02-08 三菱電機株式会社 パワー半導体装置
US11107756B2 (en) * 2017-04-06 2021-08-31 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same, and power conversion device
CN107195623B (zh) * 2017-06-14 2023-10-27 扬州国扬电子有限公司 一种双面散热高可靠功率模块
CN109511279B (zh) * 2017-07-14 2022-07-15 新电元工业株式会社 电子模块
JP6858688B2 (ja) * 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10658386B2 (en) 2018-07-19 2020-05-19 Psemi Corporation Thermal extraction of single layer transfer integrated circuits
JP7038632B2 (ja) * 2018-09-12 2022-03-18 三菱電機株式会社 半導体装置、及び、半導体装置の製造方法
JP7516786B2 (ja) * 2019-06-21 2024-07-17 株式会社村田製作所 半導体装置及びその製造方法
WO2021084638A1 (ja) * 2019-10-30 2021-05-06 三菱電機株式会社 気密封止型半導体装置
CN111211097B (zh) * 2020-02-17 2021-11-16 珠海格力电器股份有限公司 一种功率半导体器件的封装模块和封装方法
CN113496958B (zh) * 2020-03-20 2024-05-10 无锡华润微电子有限公司 基板及封装结构
JP7407684B2 (ja) * 2020-09-30 2024-01-04 三菱電機株式会社 半導体装置
DE112020007729T5 (de) * 2020-10-19 2023-08-10 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2022201426A1 (ja) * 2021-03-25 2022-09-29 三菱電機株式会社 半導体装置および半導体装置の製造方法
CN117546286A (zh) * 2021-06-25 2024-02-09 阿莫先恩电子电器有限公司 电源模块
US12218018B2 (en) * 2022-04-21 2025-02-04 Infineon Technologies Ag Semiconductor encapsulant strength enhancer
JP2026035927A (ja) * 2022-12-15 2026-03-05 ローム株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161925A (ja) 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
JP2000174180A (ja) 1998-12-02 2000-06-23 Shibafu Engineering Kk 半導体装置
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP5048230B2 (ja) 2005-03-30 2012-10-17 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP2007305962A (ja) * 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP4973059B2 (ja) 2006-08-09 2012-07-11 日産自動車株式会社 半導体装置及び電力変換装置
JP5098392B2 (ja) * 2007-03-28 2012-12-12 株式会社豊田自動織機 半導体装置
US7944033B2 (en) * 2007-10-18 2011-05-17 Infineon Technologies Ag Power semiconductor module
JP4634497B2 (ja) * 2008-11-25 2011-02-16 三菱電機株式会社 電力用半導体モジュール
CN102771200A (zh) 2010-02-22 2012-11-07 三洋电机株式会社 多层印刷电路板及其制造方法
DE102010046963A1 (de) 2010-09-29 2012-03-29 Infineon Technologies Ag Multi-Chip Package
JP5387620B2 (ja) * 2011-05-31 2014-01-15 株式会社安川電機 電力変換装置、半導体装置および電力変換装置の製造方法

Also Published As

Publication number Publication date
CN104282641B (zh) 2018-03-16
JP2015015270A (ja) 2015-01-22
DE102014212376A1 (de) 2015-01-08
DE102014212376B4 (de) 2019-03-07
CN104282641A (zh) 2015-01-14
US9171773B2 (en) 2015-10-27
US20150008570A1 (en) 2015-01-08

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