DE102008035802A1 - Substratbearbeitungsvorrichtung - Google Patents

Substratbearbeitungsvorrichtung Download PDF

Info

Publication number
DE102008035802A1
DE102008035802A1 DE102008035802A DE102008035802A DE102008035802A1 DE 102008035802 A1 DE102008035802 A1 DE 102008035802A1 DE 102008035802 A DE102008035802 A DE 102008035802A DE 102008035802 A DE102008035802 A DE 102008035802A DE 102008035802 A1 DE102008035802 A1 DE 102008035802A1
Authority
DE
Germany
Prior art keywords
annular space
cup
substrate
outlet
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102008035802A
Other languages
German (de)
English (en)
Inventor
Norihiro Koshi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE102008035802A1 publication Critical patent/DE102008035802A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE102008035802A 2007-07-31 2008-07-31 Substratbearbeitungsvorrichtung Withdrawn DE102008035802A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007198826A JP4825178B2 (ja) 2007-07-31 2007-07-31 基板処理装置
JP2007-198826 2007-07-31

Publications (1)

Publication Number Publication Date
DE102008035802A1 true DE102008035802A1 (de) 2009-02-05

Family

ID=40176161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008035802A Withdrawn DE102008035802A1 (de) 2007-07-31 2008-07-31 Substratbearbeitungsvorrichtung

Country Status (5)

Country Link
US (1) US8042560B2 (https=)
JP (1) JP4825178B2 (https=)
KR (1) KR101244591B1 (https=)
DE (1) DE102008035802A1 (https=)
TW (1) TW200921771A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2515324A4 (en) * 2009-12-18 2014-01-22 J E T Co Ltd SUBSTRATE TREATMENT DEVICE

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4920643B2 (ja) * 2008-07-09 2012-04-18 東京エレクトロン株式会社 液処理装置および液処理方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
JP5726636B2 (ja) * 2011-05-24 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法
JP5726637B2 (ja) * 2011-05-24 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法
US9242279B2 (en) 2011-05-24 2016-01-26 Tokyo Electron Limited Liquid processing apparatus and liquid processing method
JP6057624B2 (ja) 2012-09-03 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ カップおよび基板処理装置
KR20150000548A (ko) * 2013-06-24 2015-01-05 삼성전자주식회사 기판 처리 장치
JP6250973B2 (ja) 2013-08-08 2017-12-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6234736B2 (ja) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
JP6229933B2 (ja) 2013-09-27 2017-11-15 株式会社Ｓｃｒｅｅｎホールディングス 処理カップ洗浄方法、基板処理方法および基板処理装置
JP6359925B2 (ja) 2014-09-18 2018-07-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6308141B2 (ja) * 2015-02-03 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP7314634B2 (ja) 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
KR102346529B1 (ko) * 2019-06-24 2021-12-31 세메스 주식회사 액 공급 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법
CN113019827A (zh) * 2021-03-06 2021-06-25 山东阅航环保科技有限公司 一种方便上色的中空玻璃风干装置
JP2024060970A (ja) * 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368066A (ja) 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05146736A (ja) * 1991-11-27 1993-06-15 Sharp Corp スピン式コーテイング装置
US5718763A (en) 1994-04-04 1998-02-17 Tokyo Electron Limited Resist processing apparatus for a rectangular substrate
JP3102831B2 (ja) 1994-06-20 2000-10-23 大日本スクリーン製造株式会社 回転処理装置
TW406216B (en) * 1995-05-24 2000-09-21 Tokyo Electron Ltd Apparatus for coating resist on substrate
JP2003264167A (ja) 1996-10-07 2003-09-19 Tokyo Electron Ltd 液処理方法及びその装置
TW418452B (en) 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
JP2000138163A (ja) 1998-10-30 2000-05-16 Tokyo Electron Ltd 液処理装置
JP3587723B2 (ja) 1999-04-30 2004-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4593713B2 (ja) * 2000-02-04 2010-12-08 芝浦メカトロニクス株式会社 スピン処理装置
JP3890026B2 (ja) 2003-03-10 2007-03-07 東京エレクトロン株式会社 液処理装置および液処理方法
JP3890025B2 (ja) 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368066A (ja) 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2515324A4 (en) * 2009-12-18 2014-01-22 J E T Co Ltd SUBSTRATE TREATMENT DEVICE

Also Published As

Publication number Publication date
US8042560B2 (en) 2011-10-25
JP4825178B2 (ja) 2011-11-30
JP2009038083A (ja) 2009-02-19
TWI374485B (https=) 2012-10-11
KR101244591B1 (ko) 2013-03-25
US20090031948A1 (en) 2009-02-05
TW200921771A (en) 2009-05-16
KR20090013024A (ko) 2009-02-04

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140201