DE102006025162B3 - Flip-Chip-Bauelement und Verfahren zur Herstellung - Google Patents

Flip-Chip-Bauelement und Verfahren zur Herstellung Download PDF

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Publication number
DE102006025162B3
DE102006025162B3 DE102006025162A DE102006025162A DE102006025162B3 DE 102006025162 B3 DE102006025162 B3 DE 102006025162B3 DE 102006025162 A DE102006025162 A DE 102006025162A DE 102006025162 A DE102006025162 A DE 102006025162A DE 102006025162 B3 DE102006025162 B3 DE 102006025162B3
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Germany
Prior art keywords
component
support frame
chip
carrier substrate
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102006025162A
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German (de)
English (en)
Inventor
Alois Stelzl
Christian Bauer
Hans Krüger
Robert Hammedinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
Epcos AG
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Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102006025162A priority Critical patent/DE102006025162B3/de
Priority to PCT/DE2007/000970 priority patent/WO2007137568A1/de
Priority to JP2009512410A priority patent/JP5220004B2/ja
Application granted granted Critical
Publication of DE102006025162B3 publication Critical patent/DE102006025162B3/de
Priority to US12/277,927 priority patent/US7673386B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
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    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE102006025162A 2006-05-30 2006-05-30 Flip-Chip-Bauelement und Verfahren zur Herstellung Active DE102006025162B3 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102006025162A DE102006025162B3 (de) 2006-05-30 2006-05-30 Flip-Chip-Bauelement und Verfahren zur Herstellung
PCT/DE2007/000970 WO2007137568A1 (de) 2006-05-30 2007-05-30 Flip-chip-bauelement und verfahren zur herstellung
JP2009512410A JP5220004B2 (ja) 2006-05-30 2007-05-30 フリップチップ素子及びその製造方法
US12/277,927 US7673386B2 (en) 2006-05-30 2008-11-25 Flip-chip component production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006025162A DE102006025162B3 (de) 2006-05-30 2006-05-30 Flip-Chip-Bauelement und Verfahren zur Herstellung

Publications (1)

Publication Number Publication Date
DE102006025162B3 true DE102006025162B3 (de) 2008-01-31

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Family Applications (1)

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DE102006025162A Active DE102006025162B3 (de) 2006-05-30 2006-05-30 Flip-Chip-Bauelement und Verfahren zur Herstellung

Country Status (4)

Country Link
US (1) US7673386B2 (enExample)
JP (1) JP5220004B2 (enExample)
DE (1) DE102006025162B3 (enExample)
WO (1) WO2007137568A1 (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008016487A1 (de) * 2008-03-31 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
WO2012013416A1 (de) 2010-07-28 2012-02-02 Epcos Ag Modul und herstellungsverfahren
DE102010033551A1 (de) * 2010-08-05 2012-02-09 Epcos Ag Verfahren zur Herstellung einer Mehrzahl von elektronischen Bauelementen mit elektromagnetischer Schirmung und elektronisches Bauelement mit elektromagnetischer Schirmung
WO2012079927A1 (de) * 2010-12-16 2012-06-21 Epcos Ag Gehäustes elektrisches bauelement
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