JP5220004B2 - フリップチップ素子及びその製造方法 - Google Patents

フリップチップ素子及びその製造方法 Download PDF

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JP5220004B2
JP5220004B2 JP2009512410A JP2009512410A JP5220004B2 JP 5220004 B2 JP5220004 B2 JP 5220004B2 JP 2009512410 A JP2009512410 A JP 2009512410A JP 2009512410 A JP2009512410 A JP 2009512410A JP 5220004 B2 JP5220004 B2 JP 5220004B2
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support frame
element chip
chip
metal
layer
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Japanese (ja)
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JP2009539235A (ja
JP2009539235A5 (enExample
Inventor
シュテルツル、アロイス
バウエル、クリスティアン
クルーゲル、ハンス
ハンメディンゲル、ロベルト
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TDK Electronics AG
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Epcos AG
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP2009512410A 2006-05-30 2007-05-30 フリップチップ素子及びその製造方法 Active JP5220004B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006025162.8 2006-05-30
DE102006025162A DE102006025162B3 (de) 2006-05-30 2006-05-30 Flip-Chip-Bauelement und Verfahren zur Herstellung
PCT/DE2007/000970 WO2007137568A1 (de) 2006-05-30 2007-05-30 Flip-chip-bauelement und verfahren zur herstellung

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JP2009539235A JP2009539235A (ja) 2009-11-12
JP2009539235A5 JP2009539235A5 (enExample) 2012-11-01
JP5220004B2 true JP5220004B2 (ja) 2013-06-26

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JP2009512410A Active JP5220004B2 (ja) 2006-05-30 2007-05-30 フリップチップ素子及びその製造方法

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US (1) US7673386B2 (enExample)
JP (1) JP5220004B2 (enExample)
DE (1) DE102006025162B3 (enExample)
WO (1) WO2007137568A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005009358B4 (de) * 2005-03-01 2021-02-04 Snaptrack, Inc. Lötfähiger Kontakt und ein Verfahren zur Herstellung
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
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