CN1996552B - 晶片机 - Google Patents

晶片机 Download PDF

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Publication number
CN1996552B
CN1996552B CN2007100079329A CN200710007932A CN1996552B CN 1996552 B CN1996552 B CN 1996552B CN 2007100079329 A CN2007100079329 A CN 2007100079329A CN 200710007932 A CN200710007932 A CN 200710007932A CN 1996552 B CN1996552 B CN 1996552B
Authority
CN
China
Prior art keywords
transputer
wafer
workpiece
efem
end effector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2007100079329A
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English (en)
Chinese (zh)
Other versions
CN1996552A (zh
Inventor
安东尼·C·博诺拉
理查德·H·古尔德
罗杰·G·海纳
迈克尔·克罗拉克
杰里·斯皮斯尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Crossing Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/087,400 external-priority patent/US7066707B1/en
Application filed by Crossing Automation Inc filed Critical Crossing Automation Inc
Publication of CN1996552A publication Critical patent/CN1996552A/zh
Application granted granted Critical
Publication of CN1996552B publication Critical patent/CN1996552B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN2007100079329A 2001-08-31 2002-08-30 晶片机 Expired - Lifetime CN1996552B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31
US60/316,722 2001-08-31
US10/087,400 2002-03-01
US10/087,400 US7066707B1 (en) 2001-08-31 2002-03-01 Wafer engine

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB028193318A Division CN1329948C (zh) 2001-08-31 2002-08-30 晶片机

Publications (2)

Publication Number Publication Date
CN1996552A CN1996552A (zh) 2007-07-11
CN1996552B true CN1996552B (zh) 2012-09-05

Family

ID=23230354

Family Applications (3)

Application Number Title Priority Date Filing Date
CN2007100079329A Expired - Lifetime CN1996552B (zh) 2001-08-31 2002-08-30 晶片机
CNA2007100079333A Pending CN1996553A (zh) 2001-08-31 2002-08-30 用于半导体材料处理系统的一体化机架
CNB028193121A Expired - Fee Related CN1288714C (zh) 2001-08-31 2002-09-03 通用模块化晶片输送系统

Family Applications After (2)

Application Number Title Priority Date Filing Date
CNA2007100079333A Pending CN1996553A (zh) 2001-08-31 2002-08-30 用于半导体材料处理系统的一体化机架
CNB028193121A Expired - Fee Related CN1288714C (zh) 2001-08-31 2002-09-03 通用模块化晶片输送系统

Country Status (6)

Country Link
US (3) US7293950B2 (enExample)
JP (1) JP2005508085A (enExample)
KR (1) KR20050026371A (enExample)
CN (3) CN1996552B (enExample)
TW (1) TWI272665B (enExample)
WO (1) WO2003038869A2 (enExample)

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KR20050026371A (ko) 2005-03-15
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US7841820B2 (en) 2010-11-30
WO2003038869A3 (en) 2003-11-27
CN1996553A (zh) 2007-07-11
WO2003038869A2 (en) 2003-05-08
US20120213614A1 (en) 2012-08-23
CN1561535A (zh) 2005-01-05
US20030129045A1 (en) 2003-07-10
US8851817B2 (en) 2014-10-07
CN1288714C (zh) 2006-12-06
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