TW579564B - Unified frame, system for transferring semiconductor wafers and related substrate objects, and system for transporting wafers - Google Patents

Abstract

The present invention is a unified spine structure that EFEM components, such as a wafer handling robot and a SMIF pod advance assembly, may mount to. The frame includes multiple vertical struts that are mounted to an upper support member and a lower support member. Structurally tying the vertical struts to the support members creates a rigid body to support the EFEM components. The vertical struts also provide a common reference that the EFEM components may align with. This eliminates the need for each EFEM component to align with respect to each other. Thus, if one EFEM component is removed it will not affect the alignment and calibration of the remaining secured EFEM components. The unified frame also creates an isolated storage area for the SMIF pod door and the port door within the environment that is isolated from the outside ambient conditions.

Description

579564

V. Explanation of the Invention (j Qingqiuyou This application case claims the priority of provisional application No. 60/3, 16,722 entitled "Universal Modular Processing Interface System," dated August 31, 2001. The application is incorporated herein by reference. "Reference h U.S. Patent Application No. 10 / xxx, XXX Circular Engine"; and 2. U.S. Patent Application No. 10 / xxx, Conductor Material Handling System No. xxx, Invention The present invention generally relates to a wafer transport system, and more specifically, this January, an integrated scalable size frame or structure that can be equipped with an equipment front-end module (EFEM) component, and used to transport crystals. Round wafer engine. BACKGROUND OF THE INVENTION Standard mechanical interface bays (SMIFpods) generally include a grab door that is mated to a hatch to provide a sealed environment in which wafers can be stored and transported.-Seed bay The system is a front-open integrated module called rigid piQ, where the door is located in the vertical plane, and the wafer is supported on a card. This card is installed in the ship's case, or two sets are installed in the case. When manufacturing semiconductor wafers, use SMIF to grab One of Wei ’s various tools includes processing tools for forming integrated circuit patterns on wafers, measurement tools for testing wafers, and one or more S MICs. Sorting and slicing M Bebe and rearranged wafer classifiers, and stockers for large regular storage S MIF grabs. One is σσ and the other is a spear.] Use one of the two structures to work in X years X months "X", the name is "a", "X", and "X", "X", and the name is "Semi-gutter -5- 579564 A7 B7. 5. Description of the invention The tool is located in the wafer fab: bay and chase structure; or Ballroom structure. In the bay and racecourse configuration, only the tools including the workpiece 1/0 port are kept in a Class-1 or better clean room environment in the front. In the ballroom structure, the tools are arranged according to their operations. Clustered, all tools are kept in Class-I or better clean room environment. The tool system in the fab includes a front-end interface, which is used to facilitate and monitor the workpiece between the chamber and the tool. (I.e., wafer) transport components. A conventional front-end unit or device The module (EFEM) 20 is shown in Figure 2 to 2. Generally, the efem 20 is produced in a tool manufacturing plant and then transferred to a wafer fab. Installing the EFEM 20 generally includes: a housing 22 that is fixed to the front of the tool; and The workpiece processing robot arm 24 is installed in the housing and can perform χ, ", 0, z actions to transfer the workpiece between the workpiece carrier, the tool and other front-end components. The robot arm 24 is generally installed by level screws, Thereby, the planarity of the robot arm 24 is adjusted after the EFEM 20 is constructed and attached to a tool. One or more pre-aligners are included.

In addition to a robotic arm 24, EFEM 20-General 26 'is used to perform wafer center identification, notch orientation, and difficult mark reading. The pre-aligner 26 is often screwed into the housing 22 with level screws to adjust the flatness of the pre-aligner after the EFEM 20 is constructed and attached to a tool. The EFEM 20 is equipped with one or more loader assemblies 28. The loader assembly 28 is used to store a workpiece «, to open the carrier and to provide the I piece to the robot arm 24 for transmission between the carrier and other processing tools. Artifact. For 3mm circle processing, Semiconductor Equipment & Materials International ("SEMI") has developed a vertically oriented frame, often called the box opener_loader tool standard interface (or "BOLTS" interface ). This BOLTS interface is attached to a tool front end-579564 A7 B7 5. Invention Description (3) or forms part of it, and provides a standard mounting point for the load port assembly to attach to the tool. In U.S. Patent No. 6,138,721 entitled "Tilt and Forward Loading Port Interface Alignment System", a method for adjusting a loading port assembly to an appropriate position adjacent to a BOLTS interface and then loading this loading port assembly is disclosed. The system attached to the interface, the case is assigned to the owner of this application and is incorporated herein by reference in its entirety. Once the robot arm 24, pre-aligner 26, and loading port assembly 28 have been mounted to the housing 22, the EFEM 20 is sent to the fab and attached to a tool in the factory. After being properly fixed to the tool, the EFEM assembly is placed flat in the housing 22 via level screws, and the robot arm 24 informs the robot arm 24 of the necessary access to transfer the workpiece between the loading port assembly, the pre-aligner and the tool. Take and drop position. A system for notifying each pick-up and drop-down position to a robotic arm in the front end of a tool is disclosed in US Patent Application No. 09 / 729,463 entitled "Self-Notifying Robotic Arm", which is assigned to this application 'S owner is incorporated herein by reference in its entirety. Once the position of the robotic arm has been informed, the side plates are attached to the housing 22 to seal the housing substantially against the surrounding environment. For example, the conventional EFEM system includes a plurality of separate and independent workpiece processing components mounted in an assembled housing. The housing 22 includes a structural frame. The structural frame is attached by a plurality of plates attached to the frame. Merge together by bolting, building or welding. After the housing 22 is assembled, the EFEM components are fixed to the various plates. One of the disadvantages of the conventional EFEM is that the tolerance of the overall system is mixed with the frame members, plates and component connections, resulting in the appearance of the assembled EFEM components. Poor alignment and need to be adjusted in position relative to each other. The relative position of the components must also be notified to the robot arm 24, so that this paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)%

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579564 A7 _ _ B7 V. Description of the invention (4 ~~ ^ " " The EFE Μ components can interact with each other. This alignment and notification procedure must occur each time one or more e ρ e Μ components are adjusted. Another shortcoming of the conventional art is that EFEM components are often manufactured by different suppliers. The suppliers have their own control and communication protocols. When assembling EFEM, steps must be taken so that the control parts of each component can communicate with each other and the components can interact with each other. 'Separate controls will complicate maintenance and add components and electrical connections in Efem. Also, especially in ballroom construction, the conventional efem system takes up a lot of space in a Class-1 clean room environment where space is at a premium Today's 300-mm semiconductor EFEM series includes several major subsystems, including load-cell modules (usually 2 to 4 per tool) for FSE M E E 15.1. For example, EFEM may consist of one The wafer processing robot arm is composed of a fan filter unit mounted on one of a structural steel frame, and has a board for the wafer processing area between the load cell and the processing tool. These components The combination provides a device for feeding wafers into and out of F0 (jp 10) and transferring between FOLJP and the wafer base of the processing tool. FouP 10 is manually loaded by an operator or used by one operator. The automatic material handling system (AMHS) in the loading and unloading loading port automatically loads, and industry standards have been formulated to allow multiple suppliers to provide loading ports, F0up 10 or other EFEM components integrated into a system. The module provides a standard interface between the wafer processing robot arm in EFEM and AMHS, which provides a standardized position for installing F0Up 10, docking with FOUP 10 to seal the front surface, and opening and closing the door to obtain And the wafer in F0UP 10. The dimensions of this unit are specified in SEM1E15.1. The loading port is attached to the front end via the Bolts interface defined by SEMI E · 63. This standard defines the loading port attachment The mounting holes and a surface are defined as from the factory-8-this paper size is applicable ® Standards (CNS) 8 4 specifications (21Q x 297 public love) ----- 579564 A7 B7 Five invention instructions (5 The floor of the house starts to rise up to 1386 mm from the floor and about 505 for each loading port Mm width. As a result, the loading port completely separates the processing tool from the operator's walkway in the factory. SEMI E-63 also defines the size of the loading port on the tool side to ensure interchangeability between different robot arm manufacturers The main functions of the loading port include: accepting and providing a FOUP 10 for the AMHS of the fab; moving F0UP. 10 to and from the port sealing surface (docking / undocking); opening and closing the F0UP door. In addition , You must perform functions such as locking the FOUP (H) to the forward board, styling and unlocking, and various batch ID and communication functions. According to SEMI Ei5 ", all of this functionality is contained in a single early-life component, usually in the form of a complete unit plus or a front-end tool. The load must be accurate and accurate to the wafer robot arm. If the load port in the system must be provided with wafers on a horizontal surface, the nl input port must be adjusted to make the crystal attached to the machine. The robot arm shortens the calibration time for each 1: 0! ^ 〇 King, and adjusts each wafer position for each fixture. To swap a new load port with a new load port: Tools and alignment calibration procedure. 9 ”There are quite lengthy door openings and door sealing frames, and they are usually also in the factory: the structure must also be aligned to perform this function by aligning fixtures and tools. It must also be leveled and aligned with one or more workers. * Today, by notifying the robotic arm of the position and the enemy's point, usually the stand-up position or the tool is used to achieve this effect manually. Planarity adjustment While -9-579564

Just because all the relationships between tools, robotic arms and F0up 丨 〇 make the installation of a tool front end a time-consuming task, all components are generally attached to a lower precision frame and use adjustment Be compensated. The loading port is installed on the front surface, the base arm of the ρρ Μ 丞 low, the fan / filter unit on the top ㈣), all other open surface tables & to complete the microenvironment enclosure. It is desirable to minimize adjustments between components and to shorten the time required to align the load port. The present invention provides this advantage. SUMMARY OF THE INVENTION The -type of the present invention provides an integrated structure or framework to precisely restrain many important EFEM components. In one embodiment, the frame is used as a unit for aligning the internal and external EFEM components—in the reference embodiment, the 'internal and external EFEM components are aligned relative to the vertical posts of the frame. Another aspect of the present invention provides an integrated structure or frame of scalable size. In one embodiment, the integrated structure includes vertical brackets fixed to upper and lower support members, the number of vertical brackets, and upper and lower supports. The length of the building components depends on the number of I / O ports in the EFEM. Similarly, the size and spacing of the vertical brackets and support members may be changed to accommodate 200 mm wafers, 300 mm wafers, and 400 mm wafers. According to another aspect of the present invention, the front loading components are accurately and precisely positioned relative to each other, and it is preferable to achieve this calibration procedure with a minimum of adjustments. In one embodiment, all internal and external EFEM components are precisely tied to the integrated frame so that they share a common reference point. -10 ·

V. Description of the invention (7 A7 B7: Another type of system provides an integrated frame, which separates and isolates the port door / loader from many internal EFEM components. In one embodiment, the port door / carrier door component It is lowered to a separate airflow located in the microenvironment /: storage area. The storage area prevents particles such as those created by the wafer processing robot from contaminating the device.

Another aspect of this Maoming is to provide a wafer carrier docking / intermediate panel that can be easily removed from EFEM to access the EM. In one embodiment of the present invention, the removable board is made of a transparent material, so the user can go to any problems / failures that occur in the microenvironment. Another aspect of the present invention is to reduce the footprint of EFEM. In one embodiment, EJEM is supported by a -roller, so that the bottom surface of EFEM is raised away from the fab floor. The area between £;% can be used as a service access to one of the processing tools, or as an area for the auxiliary compartment. Another aspect of the present invention is to provide a wafer engine for transferring wafers. In the conventional embodiment, the wafer engine can perform several functions such as inspection, marking, and measurement without the need for a separate processing station. Another aspect of the present invention provides a wafer engine capable of transmitting wafers within a reduced EFEM footprint. In one embodiment, a 'wafer engine includes: a linear driver to move a wafer along a ridge axis; A vertical drive to move the wafer along the z-axis; a radial drive to move the wafer along a radial axis; and a rotary drive to rotate the vertical and radial drives around a 0-axis. Another aspect of the present invention is to provide local filtering for different particle generating mechanisms on a wafer engine. In one embodiment, a fan / filter unit is installed to a diameter of -11-

X579564 A7 B7 V. Description of the invention (8) Directional drive to capture particles created by radial drive. In another embodiment, an exhaust system creates an air flow through one of the vertical drives to capture any particles created by the vertical drives. These local fans / passing units attempt to control the particles created by the wafer engine by exhausting the particles into a "dirty air" environment, or by passing the air through before they return to a "clean air" environment. Another aspect of the invention is to provide a wafer engine with "during flight (additional), dual parent swap and alignment capabilities. In one embodiment, the wafer engine has a fast-swap radial drive or buffer capability to store and transfer two wafers simultaneously. In another embodiment, an upper endpoint effector can be rotated and aligned to a first wafer, while a lower wafer is stored and / or transferred by a lower endpoint effector. Another aspect of the present invention is to provide a wafer engine with a removable / interchangeable slider mechanism. In one embodiment, the slider mechanism includes integrated processing tools such as OCR readers, aligners , ID reader or measurement worker. A removable sliding body mechanism allows the wafer fab to use the same crystal engine as a whole, so it is only necessary to customize the sliding body mechanism for each additional one station. Another aspect of the present invention is to provide a wafer engine with a vertical driver located above the actuator. The vertical driver is located approximately within the region of the UP 10 region and minimizes the footprint of the wafer engine. The present invention provides all of the aforementioned advantages. Type M is simply said. Figure 丨 is a perspective view of a known front-end component according to the known technology; Figure 2 is a top view of the front-end component shown in Figure 丨; Figure 3 is a study according to the conventional technology. Side view of the self-knowing other-end component; This paper size is applicable to the τ as home standard (CN_S) μ specification (pulse no. Y gutter-12, 579564 V. Description of the invention (9 \ Figure 4 is according to the present invention A perspective view of the spine structure-an embodiment; Fig. 5 is a partial exploded view of the spine structure shown in Fig. 4; Fig. 6 is a perspective view of an embodiment of the -butt interface according to the present invention-Fig. 7 is a spine according to the present invention Partially exploded perspective view of an embodiment of the structure and front-loading component; FIG. 8 is a perspective view of an example of a structure mounted to a spine according to the present invention; FIG. 9 is a shell of a UW hand. FIG. 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D, 3D

FIG. 11 is a partial exploded view of the integrated microenvironment and structure according to the present invention; FIG. 11 is an integrated microenvironment and structure shown in FIG. 11 Fig. 1 j is a perspective view of a part of the conventional embodiment of the Jinshishi-Yueyue ', mouth structure according to the present invention; the diagram is another embodiment of the integrated microenvironment and structure according to the present invention 15; FIG. 15 is an end view of the integrated microenvironment and structure shown in FIG. 14; FIG. 15 is a partial exploded view of a consistent embodiment of the integrated frame wood showing the integrated microenvironment and structure shown in FIG. 15; 1: A-17B, according to the conventional technique, FIG. NA is a plan view of a conventional wafer processing apparatus #-embodiment; FIG. 17B is a wafer processing robot arm shown in FIG. Top view of the effector; The picture shows a 7mm embodiment of a fast-change wafer engine according to one of the present invention.) Binding line 13-579564 A7 ______B7 V. Description of the invention (10) A perspective view; Figure 19 is Figure 1 Three-dimensional view of the wafer engine, showing the drive Figure 20 is a perspective view of another embodiment of a wafer engine according to the present invention; Figure h is a perspective view of the wafer engine shown in Figure 18, showing a fan / Air flow created by the filter unit; Figures 22A-22D; Figure 22A is a perspective view of another embodiment of a wafer engine equipped with a wheel alignment device and a 10 reader on a sliding body mechanism according to the present invention; Figure 22B is a top view of the wafer engine shown in Figure 22A; Figure 22 (: is a side view of the wafer engine shown in Figure 22A; Figure 22D is a rear view of the wafer engine shown in Figure 22A; Figure 23 FIG. 24A is a perspective view of an embodiment of the upper endpoint effector shown in FIG. 22A; FIGS. 24A-24C; FIG. 24A is a cut-away view of an embodiment of the wheeled endpoint effector aligner and shows that a wafer is supported by a pad ; 24β is a cut-away view of the wheeled end effector aligner of FIG. 24A, and shows that the wafer is supported by the wheel and lifted away from the pad, and FIG. 24C is the wheeled end effector alignment shown in FIG. 24A Cut-out view of the device, and shows that the wafer is released by the wheel and returned to the pad; A perspective view of another embodiment of the wafer engine; FIGS. 26A-26B; FIG. 26A is a perspective view of another embodiment of the radial driver, FIG. 26B is another embodiment of the radial driver; FIGS. 27A-27B, FIG. 27A FIG. 27β is a plan view of a conventional linear sliding robotic arm showing one of the minimum clearance and the maximum reach required for a wafer engine according to the present invention. Quick exchange of the central axis of rotation This paper scale is applicable to China National Standard (CNS) A4 specifications (210X297, 579564 A7 __ —_B7 V. Description of the invention (11) ~ '--- Exemplary action sequence of the sliding body; Figure 29A- 29D; FIG. 29A is a perspective view of an embodiment of the front-end loading interface according to the present invention, FIG. 29B is a front view of the integrated system shown in FIG. 29A: FIG. 29C is a front-end loading interface shown in FIG. 29A A side view of an embodiment: FIG. 29D is a plan view of the embodiment of the front-end human interface shown in FIG. 29A; FIG. 30A-30B; FIG. 30A is a perspective view of the embodiment of an integrated system installed to a processing tool; The picture shows the view Side view of the integrated system, and FIG. 31 is a side view of the integrated system shown in FIGS. 30A-30B, which shows the king-mouth; R & lt, how the system buffer space free for automated material handling system (AMHS). A detailed description of the present invention will now be described with reference to FIGS. 4 to 31, which summarizes a wafer transfer system. The preferred embodiment of the present invention is used for manufacturing semiconductor wafers of a millimeter. The present invention can also be used to Manufacture parts other than semiconductor wafers, such as main photomasks, flat panel displays, and magnetic storage disks. The invention can also be used to make workpieces larger or smaller than 300 mm, such as 200 mm and 150 mm. Furthermore, although the present invention preferably operates in the -F0up system, please understand that the present invention can also operate in other workpiece transfer systems, including open wafer card systems, and the system. Lid _ closed spine knot hibiscus spine structure 100 is based on the concept of a single integrated frame or structure that can be used as the bottom foundation for EFEM. The foundation can be repeatedly manufactured in a similar way to reduce the cost of the system 'and let EFEM components be installed on the frame to simplify. Alignment work. Structure or frame 100. Minimize the empty paper ruler Qicai required by a front-end loading tool. Family Standard (CNS) A4 Regulation 4 (2 lying 297 male *) -15- 579564 A7 __ B7 V. Description of the invention (12) The amount of time, a frame or structure also minimizes the alignment time and greatly simplifies access to the internal components of the front-end tool when maintenance procedures and / or repairs are required. 4-5 shows a preferred embodiment of the integrated spine structure 100. The spine 100 includes a plurality of vertical supports 102. The multiple vertical supports 102 are composed of an upper passageway or support member 104 and a lower passageway or support member 104. 6 connected together. Each vertical bracket 102 has an inner surface 108 and an outer surface 110. As shown in FIGS. 4 to 10, each vertical bracket 102 preferably has a generally rectangular cross-section, preferably a rectangular cross-section so that the outer surface of each vertical bracket 102 Forms a seal with any EFEM component mounted to the vertical bracket 102. The rectangular cross section of each vertical bracket 102 can also ensure that the upper supporting member 104 and the lower supporting member 106 are flush with respect to the inner surface 108 and the outer surface 110 when being fixed to each vertical bracket 102. Within the scope and spirit of the present invention, the vertical bracket 102 may have different cross sections such as, but not limited to, a circle or an oval. In the preferred embodiment, the spine structure 100 mainly includes a metal sheet component, among which there are several machine tool components that require precision, and the metal sheet is implemented in a manner that can obtain precision from certain types of this manufacturing technology. For example, the long bends in the upper support member 104 and the lower support member 106 that form a U-shape provide a straight reference for aligning the vertical support 102. In a preferred embodiment, the holes 120 and 122 are punched in the upper and lower passages i 04 and 106 to further secure a good hole pair between each vertical bracket 102 and the upper and lower passages 104 and 106. Align the holes. Sheet metal components also provide the system with a skin or mounting surface (described below) and structural support for the system. In the current EFEM system, the metal sheet is usually used as a non-structural sheet that only provides beauty and accommodation. If the metal sheet is used in several structural components, it can greatly reduce the EFEM material. The paper size is applicable to China. Standard (CNS) A4 specification (210X 297 mm) 579564 A7 B7 5. Description of the invention (13) Material cost. The upper branch member 104 is fixed to the top 114 of each vertical bracket 102, and the lower branch member 106 is fixed to the bottom 112 of each vertical bracket 102. To this end, the spine 100 provides a straight and rigid structure in terms of twisting and bending to build a front-end loading system. In a preferred embodiment, the 'upper support member 104 and the lower support member 106 are made of a single piece of metal sheet, and the bending part of the metal sheet used to create the upper support member 104 depends on the vertical support The width of the upper portion 114, so the width of the "u" -shaped upper support member 104 is substantially similar to the width of the upper portion H4 of each vertical bracket ι02. Similarly, the width of the "u" -shaped lower supporting member 106 is preferably similar to the width of the bottom 112 of each vertical bracket 102. The support members 104 and 106 are pre-aligned with respect to the inner log and the outer face of each vertical bracket 102. In a preferred embodiment, the lower portion 112 of each vertical stent 102 is wider than the upper portion 114 of each vertical stent 102. As clearly shown in FIGS. 4 to 5, the spine structure 100 is aligned with each vertical stent in a vertical orientation. 〇 02, so that the vertical supports 102 are substantially parallel to each other. Each vertical bracket 102 is preferably separated by a center of 505 mm ', which is the minimum allowable interval for adjacent loading ports according to SEMI E-15.1. Within the scope and spirit of the present invention, the vertical brackets 102 can also be separated by different or unequal distances. In order to provide a rigid structure in a twisted and lateral direction, each vertical bracket i 〇2 is fixed to the upper support member 104 and the lower support member 106. As shown in FIG. 4, each vertical bracket 102 is located between the upper support member 104 and the lower support member 106. As described above, each vertical bracket 102 is aligned with the mounting holes 120 and 122 in the upper support member 104 and the lower support member 106. In the example, each vertical bracket i〇2 is made of a bolt or -17- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 579564 A7 B7

5. Description of the invention (η) A pin is fixed to the upper support member 104, and the bolt or pin is fixed to the top 1 1 4 of the vertical bracket 102 (for example, via the mounting hole 120), and at least one bolt or pin is fixed to Face 11 or 08. Each vertical bracket 102 must also be fixed to the lower supporting member 106. In the example, a bolt or pin is fixed to the bottom of each vertical bracket 12 (for example, via the mounting hole 122), and at least one bolt or pin is fixed to the front 110 With both back 108. The "u" structure of the upper support member 104 and the lower support member 106 can further prevent each vertical bracket 102 from rotating in position, although the upper passage 104 and the lower passage 106 are formed by a single piece as shown in Figs. 4 to 5. The upper support member 104 and the lower support member 106 may be made of a plurality of materials within the scope and spirit of the present invention. In a preferred embodiment, as clearly shown in FIG. 5, the upper support member W4 and the lower support member 106 have a perforated surface, and the perforated surfaces of the upper support member 104 and the lower support member 106 allow the Air flows through the fan / filter unit 150 (FFU) (see Figure 10). When the lower support member 106 is fixed to the vertical bracket 102, it forms a front mounting surface 118 and a rear mounting surface U6 (see Figs. 6 to 10) for different EFEM component installations. In general, the spine 100 creates at least three parallel and collinear female-in-law surfaces: the front surface 110 of the upper portion 112, the front mounting surface ns, and the rear mounting surface 116. As described below, EFEM components are mounted to one of these three surfaces with a known spatial relationship between them, so components mounted to these surfaces can be aligned with minimal adjustment or not at all Need to adjust to align. The lower support member 1 06 also creates an air flow area 12 1 between the front mounting surface π 8 and the rear mounting surface 116, and designs the air flow area 1 2 1-18. This paper size is applicable to China's national standards ( CNS) A4 size (210X297 mm)

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579564 A7 ---- B7 _ V. Description of the invention (15) To accommodate a FOUP door opening / closing module 139, the seal door opening / closing fork group 1J 9 has been fork-guided to exit the port door opening and descend to the air Within the flow zone 1 2 i. Isolating the FOUP door opening / closing module 丨 39 from the wafer engine 3,000 operating area. Isolation will have many advantages, such as a single air flow generated by an FFU 150. ▲ The knife is divided into two isolated air flows. One of the air flows will be directed to the door opening / closing module 139, while the second separated air flow will be directed into the wafer engine area. Compared to the case where a single air flow flows through the wafer engine area and the F0up door opening / closing module 1 39, the two isolated air flows will provide a cleaner for the F0Up door opening / closing module 139. environment of. If there is only a single air flow path for wafer engine 00 and FOUP assembly 130, particles created by wafer engine 300 may contaminate foup / door assembly 139. The rear mounting surface 116 of the lower support member 106 also serves as a protective barrier between the FOUP door opening / closing fork group 139 and the wafer engine area. The rear mounting surface 116 prevents particles generated by the wafer engine 300 from entering for storage The F0up door opens / closes the air flow area 121 of the module 139. The rear mounting surface 1 丨 6 also allows the wafer engine 300 to have a local filtering and exhaust system, thereby exhausting "dirty, air that does not contaminate the FOUP door opening / closing-closing module 13 that contains particles below the wafer plane" 9 (Description is as follows.) The spinal structure 100 shown in Figs. 4 to 5 constitutes a four fcmjp 1 / 〇 'EFEM' In the spirit and scope of the present invention, efem may include any number of I / O 璋. In addition, EFEM may include spaces or blank spaces between the various I / O ports through which wafers are transferred, as described above, "Spine structure 100 scalable size", number of vertical brackets 102, and upper support members 104 The size of the paper used in the paper is subject to the Chinese National Standard (CNS) A4 (210 X 297 mm) ^ / ^ 564 Order

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579564 A7 B7 Two pairs of latches and slots, each pair having the same structure and operation. A cabin forward plate 134 generally includes two moving pins 1 j 5 or some other alignment feature that fit in corresponding grooves on the bottom surface of Fupup, thereby defining a fixation for the bottom surface of FOUP 10 on the forward plate 134. And repeatable positions. Once a F0UP 10 is detected on the cabin forward plate 134, F0up 10 advances toward the port door 14o until the FOUP door touches or approaches the port door 14o. The front surfaces of the doors need to be brought into contact with each other to trap the particles and ensure that the port door latch key fits tightly into the F0Up door keyway. US Patent Application No. 09 / 115,414 with the name of "Rosensenest" and others as "Hatch-to-port door-holding system", and Fosmght and others as "Hatch-to-port door Detention and emptying system, the beauty = Patent Application No. 09/13 0,254 discloses a system for ensuring a tight and clean interface between | ^ 〇1; 1 > 10 and the door, these two applications are Assigned to the owner of the present invention and incorporated herein by reference in its entirety. Once the FOUP 10 is coupled with the port gate, the linear and / or rotational drive states in EFEM move the FOUP 10 and the port gate into the EFEM together, and then away from the loading port opening, so that the workpiece can be subsequently passed through the wafer engine Take it in. As shown in Fig. 10, the port door 140 is attached to the F0up door 'and a control member actuates a slider to translate the carrier and the port door along the cams 12 in the vertical brackets 102. The cam 124 guides the interlocked carrier and the port door vertically downward into the air flow region 121 of the lower support member 106. As mentioned above, the port door 14 and the FOUP door are isolated from the rest of the ciass-1 area when stored in the air flow area 121. The linear sliding and rotational driving structure (not shown) is familiar to this technology and need not be described in detail. A linear slider may include a linear bearing and a driving mechanism. In an example, the linear bearing may include a bead or air Bearing-21-This paper size is applicable to China Standard ® (CNS) A4 specification (210X297 mm) '----- B7 V. Description of the invention (18). Likewise, the drive mechanism may include a motor having a cam lead screw, a belt drive, or a linear motor. In the example, the rotary drive may include a gear motor, a direct drive, a belt drive, or other similar devices. After the FOUP 10 and the port door are moved away from the docking / isolation plate 138, the wafer engine or robot arm 300 can transfer the workpiece into the front end of the workpiece without interference from the stored FOUP 10 and the cock door. Once the tool has completed the operation for a batch of workpieces and the workpiece returns to FOUP 10, the control member again activates the driver and slider to move the door back to the I / O port, where the F0UP door is transmitted and fixed sF〇up 10 ° The docking / isolating plate 138 is installed to the front of each vertical bracket 102. The docking / isolating plate 138 isolates the internal area (classq or "clean," area) of the front end of the tool from the external atmosphere or external area, and docks / Isolation plate 138 also provides a "face plane" to enable FOUP 10 to approach a close and controllable neighborhood (eg, separated by 0 to 5 mm). The plate 138 and F0up 10 and the port door 14 form an auxiliary seal. An auxiliary seal can make the plate 138 and F0 (Jp 1〇 have a point P and the same, but it is still on the plate Π8 and FOUP 10 Create air-tight seals between the plates. Airtight seals are required between the plates 138 and F0; P 10 to prevent gas from leaking out of the Class-I area or to maintain an inert environment loaded into the cockroach interface. Docking / Isolation Plate 13 8 is preferably made by processing a single piece of material with one or more F0lJp openings, the docking / isolating plate 3 8 includes alignment holes i to position it accurately for each vertical bracket 102 Provides a processed precision relationship between all FOUP 10 openings of EFEM. The docking / isolating plate 138 may also include -22 mounted to each vertical bracket using the same reference characteristics. ) A4 specification (21GX297 public reply) --- 579564

Individual pieces of material, plates 1 3 8 may be made of materials such as, but not limited to, plastic, metal, sheet metal, and even glass. In a preferred embodiment, the docking / isolating plate 138 is processed from a natural material such as polycarbonate, and the docking / isolating plate 138 is processed from a colorless material to provide a micro-environment that can be seen when the tool is operating. For internal or regional additional advantages, the current E15 loading port / SEIVII E63 Bolts interface does not define this feature. The docking / isolating plate 138 does not have any structural characteristics, so it may be fixed to the vertical brackets 102 of the spine 100 by only a few bolts and / or pins, so Gu easily removed the docking / isolating plate 138. And, because there is no EFEM, and the pieces are aligned with reference to this docking / isolating plate 138, the docking / isolating plate 138 can be removed from the EFEM without disturbing, such as the port door 140, f0up forward plate 134 or crystal Installation or alignment of EFEM components such as the circular engine 300. This will provide a way to easily access the “clean” area of EFEM (ciass-1 area in Figure 10) for repair, maintenance or elimination of errors. Figure 8 shows the wafer engine 300 mounted to the spine structure 100. This figure clearly shows that the wafer engine 300 can move linearly to access all ι / 〇 ports of EFem, and the wafer engine 300 is along a track The module 302 moves, and the rail module 302 is mounted to the rear mounting surface 116 of the lower supporting building member 106. In this embodiment, the linear drive 302 is shown as a belt drive. Within the scope and spirit of the present invention, the linear drive 302 may also include other drive systems such as, but not limited to, a direct drive, a linear motor, a cable drive, or a link drive. The components of the wafer engine 300 are described below. These drive systems are known in the art and need not be described in detail. Fig. 9 shows further details of the mounting system 3202 shown in Fig. 8 mounted to the spine structure 100. The "railway system 3 02 series includes the rear mounting which is all mounted to the lower channel." 06- This paper size applies to the country of China Standard (CNS) A4 size (210X 297 mm) 579564

One of the plates 118 has an upper rail 310, a lower rail 312, and a pallet guide 3m. -Item In the preferred embodiment, the upper X-axis 310 and the lower X-axis 3 12 are circular or tubular and are substantially parallel to each other. A bracket 304 is used to join the upper and lower rails 31, 3 and 2 and the bracket guide 311, and the upper and lower rails 31 and 312 are also main supports for the wafer engine 3a. ...

Figure 9 also shows that one of the control units 147, which are preferably located under the f0UP advancing unit, requires many electrical control devices (such as control wiring, Pcb, etc.). If these devices are easily accessible during maintenance and repair, it will be advantage. The control box 147 provides an area for installing electrical devices. In a preferred embodiment, the control box 147 has a pivoting front cover, which can be lowered to access the internal electrical components. The control box is provided with a plurality of electrical components and controls required for power supply and operation of the EFEM component. The system is scheduled to have easy access to these electrical components for maintenance. Therefore, the pivoting front cover of the control box 147 is fixed by a number of bolts and / or pins that can be removed and pivot the front cover downward to the plant floor. As shown in Figures 10, 30, and 31, the spine structure 100 architecture provides a way to minimize the footprint of the EFEM and seal the clean volume of the system while maintaining the accuracy of the overall system. The FFU 150 is installed and sealed in The upper passage 104 and a tool interface panel 154 form the top of the EFEM, and a front seal is provided by mounting a docking / isolation plate 138 to the front surface 110 of each vertical bracket 102. A sheet metal plate 15 preferably having a bud-shaped surface is mounted to the lower support member 106 to form the bottom of the EFEM, and the plate 152 also serves as an exhaust plate to allow exhaust gas from the 150 and the wafer engine 300 to be discharged into the atmosphere. Environment. Each side of the EFEM is sealed by a W plate 156, and an end plate 15 6 is installed and sealed to the spine 10 (see Figure 30), the tool interface panel 154, the plate 152, and the FFU 150. As shown in Figure 10, Lai -24- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) / y564

The clean air flow from the FFU 150 and the sliding body FFU 420 travels through the microenvironment or Class-I area, and exits through the bottom plate 152 and the lower passage 106. The air flow (described below) containing particles generated by the vertical drive 3 8 0 from the z-slot fan 3 5 4 also moves through the bottom plate 52. The air flow from the z-slot fan 354 will never enter a clean microenvironment . Generally speaking, the spine 100 creates a single reference system to calibrate and align EFEM components such as wafer engine 300 & fjp1 forward component 13. Separate EFEM components can be calibrated to a known and fixed level (such as a vertical bracket 102) instead of being aligned and aligned relative to each other. This calibration method has been greatly simplified compared to the conventional procedures required today. . Fig. 11 to Fig. 1 show another embodiment of a spine structure. The main structural elements of this embodiment include a horizontal beam 170, an alignment bracket 172, and a front mounting plate 174. As shown in FIG. Η, the horizontal beam 170 is preferably mounted to the bottom of each alignment bracket Π2 to form a rigid frame, and the front mounting plate 174 is also mounted to each pair of back brackets 172 and for external EFEM components (such as 17〇111 > forward The module i30) provides a mounting surface. The horizontal beam i 70 can be made of, for example, an aluminum extrusion, a steel pipe, a bent metal sheet structure, a flat plate, a laminated plate, or a combination of some of the above items. The horizontal beam 170 also provides a mounting surface for the linear actuator 306 (described below). Similar to the spine structure 100, this embodiment provides a single reference for installing and aligning EFEM components. Figure 12 shows that the F0UP door 12 and the loading door 140 are preferably still stored in an isolated area within the CUss-1 area. To this end, the beam 17o must be far enough away from the alignment bracket opening 2 to allow the FOUP door 12 And port door 140 fits on the beam 170 with the alignment bracket -25-

579564 A7 ______B7 V. Description of the invention (22) Between 172, as shown in Fig. 2), the separating piece 171 is placed between the alignment brackets 172 and the beams 170 to create a storage area. Within the scope and spirit of the present invention, it is also possible to create a storage area by other means. The beam 70 also serves as a protective barrier to prevent the particles created by the wafer engine 300 from contaminating the f0up door 12 or the door 140. . Figure 1 The support member or spine may include a beam 170 having a CNC milled aluminum plate 176, which is mounted to the beam 170 to support the x-axis rails J 10 and J 12. The rigidity of this structure is further enhanced by a piece of metal U-shaped section 175. The vertical alignment bracket 172 mounted to the section 175 is aligned to the vertical bracket similar to the previous embodiment. As shown in FIG. 丨, a front mounting plate 172 is mounted to the alignment bracket 174, and an EFEM component such as the FOUP advancing component 130 is mounted to the front mounting plate 172. The beam 170 can be located between the wafer engine 300 and the cabin opener under the working space of the wafer handler. The beam i 70 provides a structure capable of precisely mounting EFEM components regardless of the structure. Common components, and time-consuming adjustments on site are no longer required when installing or replacing EFEM. Single Frame / Sleeve FIGS. 14 to 16 show another embodiment of the spine structure constituting a FOUP docking station. In this embodiment, the EFEM-equipped spine structure is a single frame or sleeve 202. Similar to the spine structure 100, the frame 200 is a single reference for the internal (such as wafer engine 300) and external (such as f0UP advancement module 130) components mounted and aligned. As shown in FIG. 14, the spine structure 200 includes three loading port assemblies 204 mounted to the frame 202, and each loading port assembly 204 is similar to that disclosed in the preferred embodiment. -26- This paper standard applies to the Chinese National Standard (CNS ) A4 specification (21 × 297 mm) 579564 A7 B7 V. Description of the invention (23) Load port assembly 130 exposed. A loading port door 206 for isolating the Class-I area from external atmospheric conditions corresponds to each loading port assembly 204 to engage and remove the FOUP door for the FOUP sleeve. Within the scope and spirit of the present invention, the frame 202 may also have more or fewer I / O ports. Similarly, the frame 202 may include a padding or solid I / O chip located between the I / O ports that the wafer passes through. The frame 202 is preferably formed from a single piece of material. For example, the frame 202 may be produced by a press, and the frame 202 may be made from many different materials. For example, the frame 202 may be made of a material such as, but not limited to, metal sheet, polypropylene, composite material, or plastic. Frame 202 may also include anodized surface finishes to prevent or reduce outgassing. The frame 202 can be scaled regardless of whether it is made of a single piece of material or a separate element. To this end, the framework 202 can be customized to create multiple FOUP 1/0 ports that meet EFEM requirements. Figure 15 shows several EFEM components mounted to the frame 202. The preferred embodiment of the frame 202 made of a single piece of stainless steel is flexible. For example, the frame 202 can also be made of an aluminum sheet. The EFEM must be rigid enough to provide accurate support and alignment points for the EFEM components. Additional support members 2 10 are mounted to the frame 202 to provide precise and accurate support points for components such as the linear actuator 254, the filter unit 220, the FOUP advancing assembly 208, and the tool interface plane. In order to promote air flow through the loading interface, the top surface 20 1 and the bottom surface 203 of the frame 202 are perforated. A fan / filter unit 220 can be mounted to the top surface 201 of the frame 202 and forms a seal to control the air velocity and quality through the frame 202. This fan / filter unit technology is familiar to this technology. -27- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

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I. As stated, a single fan / filter unit 220 may be adapted to achieve the required air flow rate. However, when the frame 202 is increased in size and volume, the frame 202 may require multiple fans to maintain the required environmental conditions. If the inside of the efem is not isolated from the external atmospheric conditions (not an inert environment), air can be drawn in by the ffu. 'Yin's micro-environment and vented away through the perforated holes 2 1 2 in the bottom surface 203 of the frame 202. If the EFEM is an inert music system, a flow capture chamber 224 can be installed and sealed on the bottom surface 203 of the frame 202 to completely block and recirculate the air flow created by the fan / filter unit 220. The end cap 21 may also have a first-class light return path to direct air leaving the flow capture plenum 224 back to the fan / filter unit 220 for recirculation. Since the frame 202 creates the smallest enclosed volume, the present invention is an extremely efficient system from an air handling point of view. The micro-environment with less control and filtered air will make it easier to keep the air clean. An inert system that requires a molecular filter that deteriorates because more air is forced to pass, also benefits by containing a microenvironment with a smaller gas volume. In the example, if the passing gas has a smaller volume and velocity, the filter needs to be replaced less frequently. Systematic volume space stabs all of the aforementioned EFEMs (such as spine structure, spine, and frame). A major difference lies in the basic change in space utilization, even if this concept is applicable to all embodiments disclosed in this application. The space utilization characteristics only refer to Spinal structure 丨 〇〇. Among the known tool fronts, the front end occupies from the front of the loading port (the plane of the loading surface) to the surface of the processing tool and from the floor of the plant to the highest point (usually the top of the FFU) and front-28. This paper size applies to Chinese national standards (CNS) A4 size (210 X 297 mm)

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579564 A7 ----- _B7 Fifth, the entire width of the (25) end of the invention description. An EFEM system consisting of a spine structure 100 creates significant space under load port 130 and can return clean wafer engine areas to processing / measurement tools or for other uses. In addition, the overall depth of the enclosed area or micro-environment is also reduced by the width required for the EFEM structure. The crotch system of the radial slide 400 of the wafer engine can be rotated into the vertical bracket 102 The F0up door mechanism is generally in an unused area. Space can be returned to processing tools and end users who may have a lower footprint requirement for the overall tool. The wafer engine 300 is constructed using these new and smaller space constraints, such as radial, 400 / month pieces Deeper into the tool than the non-offset version. It is significantly lighter due to the much smaller system package and, if secured on a free-standing rolling frame, can be rolled away from the processing tool for direct access to the tool. Because this system is also shorter than normal machining tools, the space above it can also be used for other purposes, such as local FOUP 10 buffering for the AMHS system. For conventional high-hanging AMHS systems, because of the need for an unobstructed overhead path to the load port, a local buffer station may be placed only between the load port or the tool. For slide-out shelving configurations, material can be stored in one of the previously unused areas directly above the enclosed area of the integrated EFEM. As shown in Figures 30 to 31, this system can be integrated with processing tools in several ways, and is designed to support at four points. Two points of the base of the two outer vertical brackets provide attachment and alignment points at each end. Two points at the bottom corner of the plate provide rear support positions, which can be provided by easily moving the system away from one of the processing tools and rolling out the frame. The frame members can be cantilevered from the tool or from -29- this paper size applies China National Standard (CNS) A4 (210X 297mm) binding

579564 V. Description of the invention (26 The floor support processing worker is Λ ^ U support, or it may be a combination of the two and can be used as a point of movement for rolling out the frame. ”Qian Yangsheng left the processing tool The framework refers to any integrated microenvironment-semiconductor program related to any of the integrated micro-environment programs. The tools in this article include but are not limited to. Processing tools, 1 & For forming integrated circuit patterns on semiconductor wafers, measuring tools are used, which have various properties and workpieces of type 5 and ^ ^ ^ ^; and stockers, which are used for large-scale storage of workpieces and noon carriers. Used in this article The tool may only be-the enclosing part HX carries the guards processed on the back side of the board as described below in an enclosing space. In the example, the structure 1GG according to the present invention may contain a classifier, this classification p 蕤 出 _ 4, 0,, ° The workpieces are arranged and transmitted by or on multiple carriers. Alternatively, the structure 100 may include a classifier or a stand-alone pre-aligner. In the embodiment of the classifier or stand-alone pre-aligner, it is completely borrowed. Work with 100 EFEM components _ Intensive work, also based on structure 1000

The enclosure of the Class-1 area provides a clean environment in which one of the workpieces can be handled. In several embodiments of the invention, the structure can be considered as a part of the tool (see Figure 3A). In other embodiments of the invention, this system may be attached to the tool but still be considered separate from the tool (Figures 29 A-2 9 D). As shown in Figure H), the FOOP docking station system is formed around the ridge. A chassis 118 is fixed to the bottom support member 106 and forms a seal. In a preferred embodiment, the 'chassis 118 is a perforated surface to allow air to be fixed to the upper support member from the FFU 150 through the FFU 150 and sealed, and a wafer transfer plate 122 is fixed to the chassis 1i8 & FFU 15 〇 and a seal is formed. The wafer transfer board 丨 22 may include a transfer window 121 for the wafer engine 300 to transfer crystals between the aass- 丨 area and the processing-30- This paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) tools circle. This system forms an air-tight seal to maintain the Chsq environment. An air-tight seal is created between the spine ⑽ and the chassis 118, ^ ffu Μ㈣M ^ 0, and the wafer transfer plate ΐ22 with FFU ISO and chassis η8. 1 = And :: The pressure in the area is maintained at a level higher than the pressure of the big lice in the Class-I area. This pressure difference can prevent unfiltered air from entering the Class-1 [domain. To this end, airborne particles or pollutants are blown out of the ⑸ ~ 1 area through the mouth of the chassis. Tools occasionally operate in evil + T brothers, such as pure nitrogen environments. In this ring, brothers need to be completely isolated. "The area and the surrounding environment, an inflatable chamber can be fixed and sealed to the chassis U8, so that the micro-environment within the structure is completely isolated from atmospheric conditions ... the inflatable chamber (see Figure 14) can be worn to the chassis 118 to capture the air Fan / filter, unit 150 for recirculation ㈣ mounted to spine ⑽. Shame engine_ In general, the wafer engine 300 shown in Figures 18 to 23 minimizes the importance of mechanical inertia relative to the frequency of use and the importance of wafer transfer cycle time. Part of the benefits of this wafer engine Examples include: (1) faster wafer exchange time, (2) lower total system weight, and (3) an integrated package that takes up less volume. The wafer engine 300 may also be operated within any of the embodiments of the integrated spine disclosed in this application, or it may be operated as a stand-alone device. A preferred embodiment of the wafer engine 300 is shown in Figure 晶圆. The wafer engine 300 includes four main coordinated drivers to have in a ·: optimized wafer transfer 'four drives' along the __ line ,-^ Line, a z-axis and a radial or r axis to move a wafer. -31-The paper size is suitable for household materials (CNS) 'Specifications (21 () > < 297 public ^^ A7 B7 V. Description of the invention (28) The wafer engine has a linear driver assembly 302 to move the circular engine 30G along an X axis. #The movement along the x axis allows the wafer engine to access each F0UP 1/0 璋'The linear drive assembly 302 includes an X pallet and a rail system 306.' The X pallet 30 is slidably connected to the upper 3, 10, and 3 12 below, and the execution system 306 is installed to the rear mounting plate 116. It includes an upper rail 31 and a lower rail 312, and the upper rail 3 10 and the lower rail 3 12 extend along the axis and are substantially parallel to each other. In FIG. 18, the broken line of the rail group. Piece j〇6 shows the rail. The module 306 can have any length, rail, and the size of the j06 can be scaled so that the wafer engine 300 can be moved along the rail module 3, so that the FOUP 10 stores the Wafer. Rotary driver 350 of wafer engine 300 is also mounted on the pallet 300. Therefore, the movement caused by the pallet 304 drives the wafer engine 300 along the x axis. Wafer The engine 300 can also rotate and pivot about an axis 0. In a preferred embodiment, as shown in FIG. 18, the rotary drive 35 includes a support post 364, and the support post j64 extends along the 0 axis and is mounted to a ζ axis support. Rotary driver 350 includes -0 motor 362 to drive and rotate support post 364. Rotary driver 350 can rotate in clockwise or counterclockwise direction. Rotating 1 ± driver 350 can also be directly installed to vertical driver. 38. No axis is preferred and does not travel through the center of the sliding body 400. The advantages of this off-center structure of the sliding body 400 are described below. Rotation 丨 Driven state 3 5 0 further includes a fan extension platform 3 5 2. In an example of a driver ’s best practice of the wafer engine j 00, as shown in FIG. 20, a B-slot fan is mounted on the bottom side of the fan platform 352. This structure of the wafer engine 300 is a ζ-slot fan. Feathers 3 5 4 are at 0 motor 3 6 2 attached and provide an air vent The engine driving force across the wafer through the air 30〇 2 column 380 of discharged air line crossed the 2 column 38〇 -32- present paper material into ~㈣τ Guan (CNS) Α4 Specification (restored male _ 297

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(29) 4 shots away from any wafers transferred by the wafer engine 3⑻ (see Figure 2 1) or air flow can be discharged through the rotary drive 350 and leave its bottom. '. A vertical driving post 380 is mounted to the support member 370 and extends upward along the z-axis. The driving post 380 is a sliding body 400 (described below) of the wafer engine 300 and the wafer is driven along the z, Spring moves up and down. In a preferred embodiment, as shown in FIG. 19, the driving column 380 is an elongated column driving assembly extending substantially perpendicularly from the supporting member 37 and is located in the driving column 3 800 and includes a z driving motor 3 82, a 2 cable loop 384, a z guide 386 and a z ball screw 388. These driving devices are known in the art and need not be described in detail. Within the scope and spirit of the present invention, other devices can also be used to move the sliding body mechanism 400. The sliding body 400 preferably includes an upper endpoint effector 402 and a lower endpoint effector 404 'to quickly exchange the respective wafers along the Γ axis. The slider 400 supports the upper and lower end effectors 402 and 404 so as to be parallel to the crystal circle stored in each FOUP 10. As shown in FIG. 19 ', the upper endpoint effector 402 and the lower endpoint effector 400 move along a similar linear path. The upper end effector 402 and the lower end effector 404 are separated by a distance sufficient for the upper end effector 4202 and the lower end effector 404 to store wafers at the same time. The slider 400 includes a radial drive motor 4 1 〇 In this way, the upper end effector 402 and the lower end effector 404 move linearly along the radial or r axis. The upper end effector 402 is supported by a first support 406, and the lower end effector 404 is supported by a second support 408. The upper end effector support piece # 406 and the lower end effector support piece 408 are each slidably engaged and moved within a radial guide 4 10, and the radial guide 410 extends substantially across the length of the slide 400 -33- Applicable to China National Standard (CNS) A4 specification (210X 297 mm) 579564 A7 _____B7 V. Description of the invention (30 ^ " Each direction 'moving motor 4 1 0 series drives a radial drive belt 4 丨 4. Radial drive belt 414a is connected to the first support 4 06, and the second radial drive belt 4 14b is connected to the second support 4 08. The radial drive motor 41 0 can be rotated clockwise or sun-dial to rotate along _ The radial drive pulley 4 1 6 and an end idler pulley 418 rotate the radial drive belt and extend and retract the respective end effectors. This drive mechanism is known in the art and need not be described in detail. There are also other types of devices that move wafers along the 彳 -direction or the r-axis. Wafer engine 300 has many moving elements, which are prone to particles. For example, the upper end effector 402 and the lower end effect The continuous elongation and retraction of the device 400 will be in the microcircle Particles are created inside. In order to prevent particles from contaminating the wafers located on any of the end effectors, a car body fan / filter unit (FFU) 420 is installed on the bottom side of the slider 400, and the slider FFU 42 slides through the slider. The groove 420 is connected to 4 to pull in the air, pull the air through the sliding body, and pull the air out into the α㈣ area. The concern of the air flow is to reduce the amount of particles placed in the Class-1 area. 'Part A of the microenvironment system includes a fan / passing unit. This fan / filter unit is used to circulate air through the microenvironment and only filter the airflow flowing into the EFEM. Created in the microenvironment downstream of the fan / filter unit Any particles remain in the clean environment until they are discharged from the EFEM, especially because wafers in semiconductor manufacturing are increasingly required to have a lower tolerance for particle contamination, so the number of particles in the microenvironment needs to be minimized. Part of the wafer engine 300 Filtration removes particles created by any rotating or sliding mechanism on the circular engine 300 during particle creation. In a preferred embodiment, as shown in Figures 19 and 21, a local fan / filter unit Or fan统 -34- This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 public directors) ~ '----- 579564 A7 B7 V. Description of the invention (31 is next to the z-pillar 3 80 and the sliding body mechanism 4〇〇 The linear drive of the two, especially as shown in Figure 21, the fan / filter unit fixed to the sliding body mechanism 400 exhausts the filtered air into a clean micro-environment, and at the same time, the vertical drive of the 380-z fan system The unfiltered air is exhausted through the bottom plate of the EFEM. The wafer engine 300 series filters and discharges the air into the Class-1 area of the EFEM. If the wafer engine 300 does not have a fan / filter mounted to the slide mechanism 400, the particles created by the slide mechanism 400 will migrate through the class-1 area and contaminate the wafer supported by any of the end effectors. FIG. 20 shows another embodiment of the wafer engine 300. In this embodiment, the sliding body 400 is connected to the z-pillar j 80 so that 2; the pillar 380 is substantially along the r axis. Similar to the previous embodiment of the wafer engine 300, this embodiment includes a 0 motor 362, a vertical drive post 380, and a radial slider 400. The 0 motor rotates the wafer engine about the Θ axis, and the ζ post is linear along the ζ axis Moving the radial slider 400, the radial slider 400 moves the end effector 4 (Η) in the radial direction or the I * axis. For this reason, whenever the theta motor 362 rotates, the wafer engine and the wafer will Rotate around the 0 axis. Similar to the previous embodiment of the wafer engine 300, this embodiment can also include a fan / filter unit mounted to the radial slider 400 in a v-slot fan. As mentioned earlier, the crystal The sliding body 400 of the circular engine 300 may include end effectors L8 to 19 of different configurations, as shown in the upper and lower end effectors 4202 and 404 may include a passive edge wing member, and it may stop. This structure is a passive edge-holding endpoint effector for 300mm wafers known in this art. Figure 22 shows that the upper endpoint effector 402 may include an active edge-through transparent edge-holding portion, and The lower end effector 404 may include a passive edge support. Or 4 # * and the point effectors 402 and 404 may include, for example, A straight wolf tooling grip with dorsal contact, a reduced contact -35-A7 B7 V. Invention Description (Any combination of 32 area, removable pads. Similarly 'back drive 400 may include wafers that are processed at different stages = different types of end effectors. For example, one end effector may only process '' feet, but the second end effector may only process `` clean, An end effector can be designed to align and read the wafer ID before transferring to the processing tool, but the second end effector may include a high temperature pad for processing hot wafers after processing. The integrated processing tool Baizhi's wafer processing robot arm transfers individual wafers, such as from a F0up 10 to a separate processing station. The processing station inspects or aligns the wafer and the wafer processing robot arm The wafer can be transferred to the next station. When the processing station is operating, the wafer processing robot often has to sit or return-just transfer the second wafer. This operation reduces the output rate of the system. In one embodiment, Wafer Engine 3⑽ includes _sliding body_, sliding body Liu Kejin Lines are usually performed in-separate processing stations-or several of the above functions. By integrating one or more of the above functions in the sliding body 4⑽ will increase the system's output rate and reduce the EFEM footprint. Figures 22 to 23 show Equipped with a round aligner 440 and an ID reader 430, one of the wafer aligners 440 and ID readers 430 on the sliding body 400 of Anmeng A% ㈣ famous women ’s clothing. This embodiment is similar to Figure i 8 The wafer engine 300 shown in FIG. 19 is added with a wheel aligner 44 mounted on the upper end effector 402 and an ID reader 430 mounted on the slider 400. In A wheel-type aligner within the spirit and scope of the present invention. The lower endpoint effector 404 may also include a 1D reader 430 which can be viewed upward or downward to read the top or bottom of the wafer.

579564 A7 B7 V. Description of the invention (33) Marking on the top and / or bottom surface, within the scope and spirit of the present invention, m is read as 4J. It can also be mounted on the vertical driver 380 'or mounted on the wafer engine 3. 〇 in a fixed position elsewhere. In a preferred embodiment, a top-side m reader 430 is preferably mounted on the slider 400 for fast m reading. A second reading Can a woman drive a fixed position elsewhere in EFEM to read the bottom side? Mark to confirm or clarify the wafer ID as needed. If 1D reading is required but the orientation of the wafer is not important, the aligner can be eliminated, and the ID item picker 430 can watch the wafer arrive at each position of the end effector]] :) mark. To facilitate this operation, the ID reader 430 or a mirror assembly can be turned red above the surface of the wafer to view the ID mark. This will no longer require rotating the wafer to read m, which can improve cleanliness and yield. An aligner, such as a wheel or other device, controls the rotation of the wafer about an axis. Figures 23 to 24 show an embodiment of an end effector with a wheel aligner 44. Wheel aligner 440 includes a driving system 449 and a paddle plate 442. The paddle plate 442 is a main support for the wafer system. There are two sets of passive sprocket wheels 446 and two pads 448 at the end of the paddle sheet 2. The wheels 446 and 塾 448 support the wafer at different times during the alignment—the driving wheels 450 at the back end of the paddle 442 The wafer is supported along a third contact surface during wafer alignment. In one embodiment, the wheeled end effector 440 slides under a wafer bottom in a FOUP 10 and rises until the wafer is supported by the pad 448. The pad 448 preferably supports the wafer only along the bottom edge. In order to align the wafer, the wafer is pushed forward by the drive wheel 45 and up to the wheel 446. The wafer system is lifted off the pad 448 and is fully supported by the drive wheel 45 and the tip wheel 446. At this time, the driving wheel 45 can be rotated to rotate the wafer on the spot, and it can be -37. 579564 A7 __ B7 when the wafer engine 300 transfers the wafer V. Description of the invention (34) To perform this operation, the wafer The engine 300 does not have to remain in position to align the wafer. Alternatively, as shown in FIG. 26B, the sliding body 400 may include a vacuum aligner 4 1 1 ′ and a driving mechanism for the vacuum chuck aligner 4 丨 丨 (including a lifting and rotating shaft, and a spring). May reside in the sliding body 400. A sensor 409 can be mounted to the end effector 403 to locate the edge of the wafer when it is left on the end effector. The sensor 409 can also be mounted to a structure independent of the end effector 403. The 3 ′ sensing 409 can be located at various positions, as long as the position of the sensor 409 can read the top surface of the wafer. The edge position can be mapped relative to the rotation angle to find the center and orientation of the wafer. As a secondary feedback device, the sensor 409 knows the position of the sensor 409 relative to the wafer at any time. Therefore, the sensor 409 can send an error signal representing the Japanese circle misalignment, because the aligner receives additional error data from the sensor 409, an aligner with this sensor will be able to Improve the accuracy of the aligner. The wafer can then be reoriented by the chuck 4 1 1 and placed by the wafer engine 300 in the center of the next drop station. The sense is' 409 can be independently installed in EFEM as a component separated from the wafer engine 300. In this configuration, the wafer is placed on a rotatable chuck 4 1 1. Install /, the sensor 409 on the mechanism with position control and measurement device (not shown), you move near the edge of the wafer until the sensor signal is at the ideal level. When the sensor 409 signals, the wafer can be rotated to maintain the position of the sensor 409 at this ideal level, so that the sensor 409 can effectively maintain the same relative position to the edge of the wafer. When the wafer rotates, the sensor position relative to the wafer angular position is recorded. This data represents the change in the radial position of the wafer edge relative to the wafer rotation position.

579564 A7 ____ B7 __ 5. Description of the invention (35) To calculate the orientation of the wafer center and the datum relative to the center of the wafer chuck. : ¾ Record the sensor signal value together with the sensor mechanism position, which can provide additional edge position information to improve the accuracy of wafer center calculation or reference orientation. The wheeled endpoint effector aligner 440 may include other components such as, but not limited to, an optical notch sensor 452 to detect notches along the edge of the wafer. For example, once the notch has been located at the edge of the wafer, using the optical notch sensor 452, the driving wheel 450 can rotate the wafer to the desired position and retract it to allow the wafer to fall back onto the pad 448. This can be done while the end effector is in position or moving, and the ability to align the wafer when transferring between FOUP 10, or between a FOUP 10 and a processing tool can greatly shorten or eliminate one end The amount of time a point effector must sit still. And, if the wafer engine 300 can align a wafer on the fly, a separate processing station is not needed. The slider 400 can be used for various auxiliary functions, measurements and for capturing various crystals. The circular data sensor provides a stable mounting platform. In the example, the component can be integrated into or mounted on the slide 400 to detect the edge of a wafer, detect the position of the notch on the wafer, and read the CR / Bar code, counting particles (back or front), determining film thickness / uniformity or circuit element line width, and detecting resistivity (via contact probe or non-contact device) and wafer thickness. This technique can also be used Other methods known for inspecting and marking wafers are incorporated into the slider 4⑻. In order to transfer a workpiece to a carrier, the end effectors 4002 and 404 move horizontally under the transferred workpiece and then move upward to move the workpiece The workpiece lifts away from its stop: position, the end effectors 402 and 404 can also include edge grips at the edge 39-This paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 public directors) ---- --- A7 B7 V. Description of the invention (36) Workpieces. Or go to _ _Flyer's point effectors 402 and 404 can be blade-type end effectors to support on the bottom surface-Guang 丄 ^ In this example, the source has been shown) Attach to or away from paddle 442 and create a negative pressure = The flexible vacuum battalion is conducted to the surface of the end effector via the workpiece processing robot arm. When the vacuum source is turned on,-negative pressure is formed on the end effector On the surface of the sheet, create a suction that can hold a workpiece firmly. A true W (not shown) with: M can also be set on the robot arm and connected to the vacuum system to detect when the guard It engages with the end effector and limits the air pulling force through the straight air tube. Please understand that the present invention is not limited to the above-mentioned end effector. A variety of different end effects can be used. The effector has the ability to take and drop the workpiece. Red / month to 400 is also suitable for processing a wafer and isolating the wafer from the area. In the example of the slide body, the slide body 4GG may include an additional one for heating or Cool the wafer surface or perform thermal pre-surface processing. In another embodiment, the sliding body is 400 Including λ and not shown) 'When the wafer engine 300 transfers the wafer out of the processing tool and is located in the Class-1 area' This housing can be used to retract a wafer and temporarily store eight of them to provide excellent In an inert or clean environment in the Class-1 area environment, the π ,,, and first can include floating oxygen or an inert gas above the wafer surface. I Heavy exchange capability k processing station removes a processed crystal The time between a circle and a new wafer being put into a processing station is called "exchange time," most of the processing tools, the output rate is determined by the processing time plus the exchange time, the processing time or the exchange time Either contraction will increase the output rate, and the processing time is -40- (37 of the tool manufacturer). V. INTRODUCTION OF THE INVENTION However, for the second F time, it is the responsibility of the main EFEM manufacturer. (: Secondary, the conventional single-end effector wafer processing robotic arm of the mechanical arm "7: It can be committed in 8 to 16 seconds and depends on the station configuration and the wafer location, k. This robotic arm The following are commonly used as slashes /, and the station exchanges one sm | n 钿 忭 in order. The items that affect the exchange time are indicated in italics, and the items outside the critical path with, W are marked with (brackets). L Obtain wafers from processing station 2. Place processed wafers into loading port J • Obtain aligned wafers from aligner 4. Place wafers from aligner to processing station [Start wafer processing ]-(Processing% Robotic Arm Gets New Wafer From Loading Port) 6. (During Processing, Robotic Arm Puts New Wafer Into Aligner) 7. (During Processing, Aligner Aligns Wafer) [ [Repeat]-The quick-exchange robotic arm (such as the wafer engine 300) has two end effectors, so the following functions can be used to perform the same functions as described above to shorten the exchange time: [Complete the procedure] 1. Obtain the wafer from the processing station with the paddle 1. 2. Place the aligned wafer to the processing station with the paddle 2. [Processing wafer] 3 · (During processing, load from Obtain new wafers) 4. (Put new wafers into the aligner during processing) -41-1 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm)

5. (During processing, the aligner aligns the wafer) 6 · (During processing, the aligned wafer is obtained from the aligner) [Repeat], the arm speed reduces the exchange time by 3 to 6 seconds : It can slightly shorten the overall time for the robot arm to complete all actions.

The overall action time is very important in the 2-work-to-work application, so the above project will enter the critical path of output rate. The wafer engine of the same and # lucky meat heart and point effector aligner 44 is: if the robot arm has the ability to align at the same time and the ability to exchange quickly, it will advance daily-step by step to improve the output rate and reduce the movement of the entire robot arm . The alignment effect of the flying equipment does not shorten the exchange and change the time, but it does shorten the overall mechanical operation time. Therefore, there is a short processing time at ^ /, or the robot arm must be processed at the eve of the processing station. In the circumstances, the output rate is calculated in the monthly plan. And, by reducing the order

Line: the number of movements and wafer transfers, the simultaneous alignment of the flight can increase the manipulator's life and change m degree. 1Yu Feiding's fast-swap wafer engine that reads on the same day. Comparable, the sequence is: [Complete the procedure] • Obtain wafers from the processing station with the slurry sheet 1. • Align the aligned wafers with the purple sheet 2. Place the wafer in the processing station [Process wafer] 3 (During processing, obtain a new wafer from the loading port) 4. (During processing, align the wafer with D + I j ^ private to the next position for quick exchange ) -42-

579564 A7 B7 V. Description of the invention (39) Unrestricted Z-axis operation Figure 25 shows a wafer engine 300, which includes an off-center sliding body 400, and this sliding body 4 〇〇 has a wheel aligner 454 and an m read state 4 j 0, and an extended z-axis drive column 3 8 0 ·. This embodiment of the wafer engine includes an extended z-pillar 380 ', for example to access a stocker, or a loading port or processing station that may be located above the FOUP 1/0 port. Basically, the height of the z-axis driving column 380 or 380, is not limited. The wafer engine 300 or 300 can move the upper end effector 402 or the lower end effector in a radial or r axis. 4⑽ to retrieve a wafer located in a FOUP 10. The distance required for the upper endpoint effector 402 or lower endpoint effector 404 to enter the UP 10 is designed as a short distance because it is the most commonly required wafer engine 300 or 300 to operate. The height of the vertical driving column 380 or 3 80 'does not affect the distance that the upper end effector 402 or the lower end effector 404 must travel. Therefore, the degree of vertical driving column 38 or 38 does not affect the Radial or r-axis motion. The conventional wafer processing robot must linearly move the z-driven column to F0up⑺ so that the end effector can take in and remove the wafer from the FOUP 10. Therefore, a high vertical driving column system for the wafer processing robot arm needs to move a large vertical column by a motor or a belt drive. Moving this inertia will exert a large strain on the circular processing robot arm. Because along the most frequently travelling scales. The moving axis of the axis is also the shortest distance. The wafer if engine disclosed in this application is an improvement over these wafer processing robot arms. Fig. 2A shows a cheek. A conventional linear sliding robotic arm can access the inside of the processing tool by 250 mm to transfer and place the wafer into the processing tool. Similarly, a conventional wafer processing robot arm needs to have -43 in this EFEM working space. This paper size is suitable for standard (CNS) A4 specifications (210 X 297 mm) "-

The minimum clearance of A centimeter allows the wafer processing robot arm to move within the EFEM. Fig. 27Bk shows the advantages of the contact with the swing gap without the off-center sliding body rotating around the $ axis. In a preferred embodiment, the axis of rotation of the sliding body shown by the zero axis in FIG. 19 is offset by about 50 mm. There are two significant advantages to the off-center rotation axis of the wafer engine 300. First, the maximum reach of an end effector (such as the upper end effector 402 or the lower end effector 404) in a processing tool is increased to 35mm; Second, the minimum clearance required in the EFEMi working space is reduced to 42G mm, and the maximum reach and minimum clearance distance is for demonstration purposes only. By increasing the reach of the end effector in the machining tool and reducing the minimum clearance required for the internal movement of the circular engine 300, the overall footprint of EFEM can be reduced. FIG. 28 shows an exemplary sequence of operations of the circular engine 300 without a rapid exchange slide 400 that is off-center from the axis of rotation. In the example, step one shows that the wafer engine 300 lifts the wafer in the loading port area. Step 2 shows: the wafer engine 300 retracts the wafer from the loading port 1 along a radial axis. Step three shows: the wafer engine 300 rotates around the 0 axis and moves back along the Z axis to avoid collision with the loading port 1. Step 4 shows that the wafer engine 300 moves to the I / O port of the processing station along the X axis. Step 5 shows that the wafer engine 300 continuously rotates around the Θ axis and positions the wafer along the X axis to enter the processing station. Step 6 shows that the β wafer engine 300 waits for the program to complete. Step 7 shows that the wafer bow 300 exchanges the processed wafer for a new wafer ready to enter the processing station. Finally, step eight is not shown: the wafer engine 300 retracts the processed wafer on a radial axis and moves along the X and 0 axes to return the processed wafer to the loading port II, II or Three inside. -44-

579564 A7 B7 V. Description of the Invention (41) '' The above-mentioned wafer engines 300 and 300 | provide several benefits over conventional wafer processing robot arms. For most wafer processing applications, the radial motion required to insert and remove wafers into a FUP 10 or a processing station has the highest duty cycle and the longest overall travel distance. The wafer engine 300 places the radial driver 400 as close to the wafer as possible before trying to access the wafer. This placement method can reduce the moving quality and action of the upper endpoint effector 402 and the lower endpoint effector 404. Time and wear. The Z driving column 380 occupies the same volume of space scanned by the wafer when the wafer engine 300 rotates, and the driving column 380 does not extend under the work plane. A conventional wafer processing robot must use wafers. The area under the plane is used to access some wafers in FOUP 10. In general, the end effector is mounted on the top of a column that moves up and down along the 2 axis. This column occupies two original rooms for other purposes. Similarly, when the post moves horizontally along the 乂 axis, the area under the wafer plane must be approximately cleared so that the post does not run in and damage any obstacles. The wafer engine 300 may make several changes and / or modifications while still retaining the unique elements and advantages described above. In the example, some applications may eliminate the χ-axis driver 302. Similarly, a single radial axis may be sufficient, and some applications (such as classifiers) may not require a rotary drive. Instead, the 2-axis drive, the J80, will be mounted to the shim plate 308. For example, a classifier application may cause all loaded scripts I to be in the same direction, and if the alignment and I 0 reading functions are integrated into the wafer engine 300, no rotation is required. Figures 29 to j 1 show several configurations of the integrated system. The figure shows the integrated system mounted on a roll-out frame. As mentioned previously, the conventional efem system extends all the way down to the fab floor. By forming a spine structure of 100-45- This paper size is applicable to the national standard (CNS) A4 specification of the towel (210X297) ~ -------- 579564 A7 B7 V. Description of the invention (42) The space savings obtained by EFEM or other embodiments disclosed in this application have significantly reduced the footprint of the integrated system. As shown in Figure 29A, the integrated system is mounted on a roll-out frame, leaving the loading port assembly at 900 mm S EI standard south. When this integrated system is screwed to the front end of a processing tool and in a preferred embodiment, there is about 2 feet behind the integrated system and on the fab floor. Open space, which has never existed before for wafers. This space allows semiconductor manufacturers to place other items such as electrical control boxes under an integrated system. Alternatively, a processing tool can now have a maintenance access section and can be borrowed This maintenance access is accessed by crawling under the integrated system. Rolling out of the frame can also improve the overall maintenance characteristics of processing tools that are bolted to the integrated system. In the example, if maintenance is required on the processing tool, the integrated system The bolt can be released from the machining tool, the wheel that rolls out of the frame can be unlocked, and the integrated system can be rolled away from the front of the machining tool. The conventional EFEM of a bolt to the machining tool does not contain the ability to roll the EFEM out Wheel, and is usually a cumbersome device that requires more than one maintenance person to lift the EFEM out of the processing tool. As mentioned previously, the integrated system of the present invention weighs only a few hundred pounds and is therefore easily rolled by a single maintenance person from the front of the processing tool Figure 30 shows an integrated system integrated in a processing tool. In an example, the system of the present invention can be integrated and installed into a processing tool. One advantage of this system is that if each processing tool in a fab is An integrated system is installed. The fab will have a front-end loading system that can meet the needs of various processing tools, and contains a similar environment to reduce the need for storage and preparation of materials and training of maintenance personnel. -46- This paper standard is applicable to China Standard (CNS) Α4 size (210 X 297 mm)

Binding

Line 579564 A7 B7 V. Description of the Invention (43) Electric Control System The conventional EFEM must include a type of distributor compatible with the power needs of countries around the world. Therefore, most EFEMs today must be able to adapt to 110 V or 220 V systems. To be able to adapt to any system, EFEM needs to include power components such as step-up or step-down transformers and other electrical components. These electrical components must be installed in the EFEM, thus increasing the footprint of the EFEM. In the design of the EFEM of the present invention, all electrical components, such as the FOUP forward plate assembly, the wafer engine 300, and the fan / filter unit 150, are all operated in a 48 V system. Generally speaking, the EFEM of the present invention can be electrically connected to a 110V or 220V system. The 110V or 220V system is stepped down to 48V to control all the aforementioned components. By simplifying the EFEM power distribution system, many conventional power distribution components, such as step-up transformers, are no longer needed, thereby further reducing the footprint of the E F E M of the present invention. -47- This paper size applies to China National Standard (CNS) Α4 size (210 X 297 mm)

Claims (1)

An integrated frame that can be used to install semiconductor front-end components. The integrated frame provides a single reference for all relatively aligned components, including: two vertical brackets standing to J, each of which has an upper, lower, and A front and a rear; an upper support member fixed to the top of each of the vertical brackets; a lower support member fixed to the lower portion of each of the vertical brackets, the lower support member creating a mounting surface fixed to the front, and a fixing To the rear mounting surface; and the front-loading components are mounted to the front and rear mounting surfaces. For example, the integrated frame of the scope of patent application, wherein the lower support member further creates a port door / carrier door storage area between the front mounting surface and the rear mounting surface. The upper support structure, wherein the lower support structure, and each of the vertical supports, such as the integrated frame member of claim 1, have at least one perforated surface. An integrated frame member such as the one in the scope of patent application has at least one perforated surface. For example, the integrated frames of the scope of patent application No. 1 are approximately parallel to each other. An integrated frame that can be used to install semiconductor front-end components. The _-type frame provides a single reference frame for all relatively aligned components. Integrate at least two vertical brackets, each of which has an upper dagger, 3 Front and back; 1. Upper and lower support members, which are fixed to the top of each vertical bracket. · Lower support members, which are fixed to S of each vertical bracket. The lower -48- The support members create a front mounting surface fixed to the front. The front loading components are mounted to the lower support structure and to the rear of the vertical bracket. The mounting surface of the spoon is an integrated frame such as the scope of patent application No. 6, and the piece has at least one perforated surface. An integrated support frame such as the 6th patent application, the copy has at least one perforated surface. Supporting structure under α-sea 9. The integrated frames such as the scope of patent application No. 6 are substantially parallel to each other. Each of these vertical supports 10.-An integrated frame-type recessed frame that can be used to install semiconductor front-end components provides a single reference for all relatively aligned components. The two spoons are at least two vertical supports, each of which has A top, a front and a back; a mouth, a top support member, which is fixed to the top of each vertical bracket, a 2 bone support member, which is fixed to the back of each vertical bracket, a mounting plate, which Fixed to the front of the vertical bracket; and the front-loading components are mounted to the front mounting plate and the back bone support structure, an integrated frame for mounting semiconductor front-end components, the integrated frame for all relatively aligned components Provide a single reference, including · At least two vertical brackets, each of which has an upper portion, a lower portion, a front and a rear;-a component mounting surface with a -1/0 port, the component mounting surface is fixed to each The top and bottom of the vertical bracket; and -49- This paper size applies to China National Standard (CNS) Α4 specification (21〇X 297 mm) --------- The 5 Series seeks to load the rear of the component mounting bracket.牛 ... (The component mounting surface and the vertical support 12.: = An integrated frame for co-mounting semiconductor front-end components, the integration provides a single reference for all relatively aligned components-reference 'contains: at least two vertical support, 夂 — Each of the 5H vertical brackets has-the first installation surface of the first installation table and a second t-shaped main I, and the third installation surface are parallel to each other; and Yiyi, ~ Temple One, Second, etc. = IN The module is mounted to at least one of the first, second, and first surface of the vertical bracket. 13. A wafer carrier and an external atmospheric strip for isolation; -A system of substrate objects, including semiconductor wafers and related and two frame woods, which includes at least two vertical brackets separated from each other and mounted to a lower supporting member, one 1/0 port and -port door / Carrier Η storage area; a carrier docking 'isolation plate' which is mounted to each of the vertical support rods, said = front Γ piece, which is mounted to the lower support wheel by which the two round carriers are moved to the carrier docking / isolation board, And remove the carrier from the Body docking / isolation board; used for cattle 'which has -port door and -drive mechanism'the port door system plate ^ 丨 Ηcarrier Π' and the drive mechanism is used in the I / O ". Port door / carrier door The port door is moved between storage areas; and outer space = where: the robot arm is mounted to the lower support member and is located in an environment isolated from the atmospheric conditions of the outer space. 579564 6. Scope of patent application Where the vertical brackets are large, where the carrier is docked / isolated board 〇 where the carrier is docked / isolated board 14. If the system of the scope of application for patent No. 13 is parallel to each other. 15. If the system under item 13 of the patent application is removably mounted to each of the vertical supports 16. If the system under item 15 of the patent application is transparent. 17. 18. If the system area of the patent application item 13 has at least one perforated surface t If the system of the patent application item 13 includes: wherein the port door / carrier door is stored therein and the wafer processing robot arm is supported below A linear actuator is mounted to the integrated frame member and has a linear motion along an x-axis; a rotary drive line rotates; it is mounted to the linear drive and rotates around a 0-Z-axis linear drive 'its follower The rotary drive extends and has a linear motion along the -2 axis, the 2 axis is offset from the Θ axis and is substantially parallel; and the I-direction drive is that it is removably mounted to the Z-axis linear drive and includes > Each H-reactor has a linear motion along a radial axis. 19. The system of claim 18, wherein when the rotary drive rotates, the radial axis rotates about the 0 axis. 20. A system for transferring semiconductor wafers and related substrate objects between a wafer carrier having a carrier door and a carrier sleeve and an environment isolated from external atmospheric conditions, comprising:-an integrated frame, which It has a front surface for installation, a partial installation surface, and an internal installation surface. The internal installation surface is separated from the outside. The integrated frame creates at least one hole and a door storage area; 1 / Port 0 and-a carrier door / cockroach a carrier advance assembly, which is mounted to the external support surface; a carrier docking / isolation plate, which is mounted to the external security spear surface: a wafer engine, which is mounted to the internal mounting surface; Y '21. 22. 23.… ,: car door assembly, which has a port door and a drive mechanism, the port door is a σ month type D δ Hai integrated frame, the drive mechanism is used to communicate with the carrier m port Move the port between storage areas. For example, the system of the patent application No. 20, wherein the system is installed to a plus = tool, so that the system is elevated above the fab floor and supported by a support structure, so the waste floor and the wafer waste floor There is an open space underneath. For example, the system of claim 20, wherein the system further includes a control box from women's clothing to the external mounting surface. A system for transferring wafers, comprising: at least one K-end loading port assembly selected from the group consisting of the following: a loading port assembly '(ii) a fan / filter unit, (out) a crystal Round processing robotic arm, (iv) a FUP UP docking / isolating plate, and (v) a port door assembly • 'and an integrated frame, which can be used to install these front-loading components, the -52- 本The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 24. 24. The single reference upper support member and the lower support frame of the end loading component are created to precisely align the 'the integrated The frame includes at least two vertical brackets for mounting the supporting members. ^ ^ Go to the wafer carrier disk 1. The system for transferring substrate objects between the environment isolated from the atmospheric conditions, including: Dry afternoon-Yue and related-combined frame 'It consists of spaced and installed to the lower support and At least two vertical I forks on an upper supporting member, the frame defining at least one 1 / 0th port and one port door / carrier door storage area; a transparent carrier docking / isolation plate that is mounted to each of the vertical brackets; A carrier advancing assembly, which is installed to the Xi Dingshi ^^ g female watch to the support member of the cymbal, the carrier advancing assembly is exposed to these external atmospheric conditions; a port door assembly, which presents a remote door e. And a drive mechanism for driving the port door between the I / O port and the port door / carrier door storage area; and a wafer processing robot arm environment, including: Isolation of external atmospheric conditions-a linear drive n 'which is mounted to the lower support member and has a linear motion along an X axis; --- a rotatable drive' which is mounted to the linear drive to rotate around the Θ axis;- -—Z axis Sexual drive, which has the rotary driving operation from the linear extending along a z axis, the z axis with the 0 axis offset from and substantially parallel form; and Van patent -53- — Radial actuators and include at least linear motion. , Which is removably mounted to the 2-axis linear drive-end effector and has a radial axis for transporting semiconductor wafers and related substrates between the -SMIF grab and isolated from external atmospheric conditions. The EFEM system includes an integrated cymbal, which has at least two vertical brackets mounted to an upper support member and a lower support member, the frame defining ―helper ;: a wafer engine that is mounted to the lower support Components, the wafer engine is located in the environment isolated from external atmospheric conditions; a SMIF advance assembly, which is installed to the lower support member, the inspection advance assembly is exposed to these external atmospheric conditions; a SMIF cabin docking board, It is mounted to each of the vertical brackets, and the docking plate is exposed to the external atmospheric conditions; and the vertical brackets of the integrated frame are provided to align the wafer engine, the SMIF module forward assembly, and the SMIF module. One of the boards is commonly referred to 26. The system of item 25 of the patent claim, wherein the wafer engine includes a linear drive mounted to the lower support member and having an axis along the χ axis A linear actuator that is mounted to the linear actuator to rotate about a 0 axis; a Z-axis linear actuator that extends from the rotary actuator and has a linear motion along a Z axis; the Z axis Offset from the 0-axis and approximately parallel; and -54 · 579564 8 8 8 8 AB c D, a patent application for a radial drive, which is removably mounted to the Z-axis linear drive and includes at least one endpoint The effector has a linear motion along a radial axis. 27. The system of claim 25, wherein the SMIF tank docking plate is transparent. -55- This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 579564 J / ^ JU Patent Application No. 091119819 7 Chinese Manual Replacement Page (December 1992) B7 V. Description of the invention (43a) Component symbol description 10 Front open integrated module (FOUP) 12 FOUPH 20 Front-end unit or equipment front-end module (EFEM) 22 Housing 24 Working manipulator arm 26 Pre-aligner 28,204 Loading port total 100,200 spine structure 102 vertical support 104 upper passage or support member 106 lower passage or support member '108 inner surface 110 outer 112 bottom 114 top 116 rear mounting surface 118 front mounting surface 120, 122 mounting hole 121 air flow area 124 cam guide 130 FOUP support Assembly 132 FOUP forward support 133 FOUP forward module 134 FOUP forward plate 135 Movement pin 138 FOUP docking / isolation plate 139 FOUP door opening / closing module 140, 206 Port door 144 Alignment hole -47a- This paper size applies to Chinese national standards ( CNS) A4 size (210 X 297 mm) 579564 Patent Application No. 091119819 Chinese specification miscellaneous pages (December 1992 ) G day correction * ^ V. Description of the invention (43b) 147 Control box 150, 220 Fan / filter unit (FFU) 152 Sheet metal plate 154 Tool interface plate 156 End plate 170 Horizontal beam 171 Separator 172 Alignment bracket 174 Front mounting plate 175 pieces of metal U-shaped section 176 CNC milled aluminum plate 201 top surface 202 single frame or sleeve 203 bottom surface 208 FOUP advance assembly 210 end cap 212 perforated hole 224 flow capture plenum 254 linear actuator 300, 300 * wafer engine 302 linear actuator Assembly 304,308 X pallet 306 rail assembly 310 upper X holder 311 holder guide 312 lower X holder 350 rotary drive 352 fan extension platform 354 Z slot fan 362 Θ motor-47b- This paper size applies to Chinese national standards (CNS ) A4 size (210 X 297 mm) 579564 Patent Application No. 091119819 Replacement page (December 1992) Date of amendment V. Description of invention (43c) 364 Support post 370 Z-axis support 380,380 'Z-axis drive post 382 Z drive motor 384 Z cable road 386 Z guide rail 388 Z ball screw Φ00 radial slider 401 end effector 402 End effector 404 Lower end effector 406 First support 408 Second support 409 Sensor 410 Radial drive motor 411 Vacuum collet aligner 414, 414a Radial drive belt 414b Second radial drive belt 416 Radial drive pulley 418 End point idler pulley 420 Sliding body fan / filter unit 430 ID reader 440, 454 Wheel aligner 442 Paddle plate 446 Pin wheel 448 Pad 449 Drive system 450 Drive wheel -47c- This paper size is applicable to China Standard (CNS) Α4 size (210 X 297 mm)