CN1965390A - 气相生长装置 - Google Patents
气相生长装置 Download PDFInfo
- Publication number
- CN1965390A CN1965390A CNA2005800059771A CN200580005977A CN1965390A CN 1965390 A CN1965390 A CN 1965390A CN A2005800059771 A CNA2005800059771 A CN A2005800059771A CN 200580005977 A CN200580005977 A CN 200580005977A CN 1965390 A CN1965390 A CN 1965390A
- Authority
- CN
- China
- Prior art keywords
- wafer
- mentioned
- epitaxially growing
- storage mechanism
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP049125/2004 | 2004-02-25 | ||
JP2004049125 | 2004-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1965390A true CN1965390A (zh) | 2007-05-16 |
CN100539027C CN100539027C (zh) | 2009-09-09 |
Family
ID=34879535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800059771A Active CN100539027C (zh) | 2004-02-25 | 2005-02-15 | 气相生长装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7670434B2 (zh) |
EP (1) | EP1720200B1 (zh) |
JP (1) | JP4647595B2 (zh) |
KR (1) | KR101322217B1 (zh) |
CN (1) | CN100539027C (zh) |
CA (1) | CA2556066C (zh) |
TW (1) | TW200539322A (zh) |
WO (1) | WO2005081298A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102144280A (zh) * | 2008-08-29 | 2011-08-03 | 威科仪器有限公司 | 具有变化热阻的晶片载体 |
CN102598239A (zh) * | 2009-12-02 | 2012-07-18 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
CN102691052A (zh) * | 2011-03-22 | 2012-09-26 | 奇力光电科技股份有限公司 | 晶圆承载盘与化学气相沉积机台 |
CN103668123A (zh) * | 2012-09-19 | 2014-03-26 | 甘志银 | 金属有机物化学气相沉积设备的载片盘 |
CN104818527A (zh) * | 2015-04-08 | 2015-08-05 | 上海晶盟硅材料有限公司 | 外延片生产设备 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1905063A1 (en) * | 2005-07-21 | 2008-04-02 | Lpe Spa | System for supporting and rotating a susceptor inside a treatment chamber of a water treating apparatus |
KR100925060B1 (ko) * | 2007-11-08 | 2009-11-03 | 삼성전기주식회사 | 화학 기상 증착 장치용 서셉터 |
JP5031910B2 (ja) * | 2010-06-23 | 2012-09-26 | シャープ株式会社 | 気相成長装置 |
US10316412B2 (en) | 2012-04-18 | 2019-06-11 | Veeco Instruments Inc. | Wafter carrier for chemical vapor deposition systems |
US10167571B2 (en) | 2013-03-15 | 2019-01-01 | Veeco Instruments Inc. | Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems |
US9716010B2 (en) | 2013-11-12 | 2017-07-25 | Globalfoundries Inc. | Handle wafer |
TWI656235B (zh) * | 2017-07-28 | 2019-04-11 | 漢民科技股份有限公司 | 化學氣相沉積系統 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5944818A (ja) * | 1982-09-07 | 1984-03-13 | Toshiba Corp | 加熱基台 |
JPS61112325A (ja) * | 1984-11-07 | 1986-05-30 | Hitachi Hokkai Semiconductor Kk | 板状物回転処理装置 |
JPS61242014A (ja) * | 1985-04-19 | 1986-10-28 | Toshiba Corp | 気相成長装置用サセプタ |
JPH02151024A (ja) * | 1988-12-01 | 1990-06-11 | Kyushu Electron Metal Co Ltd | 気相成長装置 |
JP2511336B2 (ja) * | 1991-05-15 | 1996-06-26 | 株式会社荏原総合研究所 | 有機性汚水や汚泥からの水素生産法及び装置 |
JPH07176482A (ja) | 1991-05-31 | 1995-07-14 | At & T Corp | エピタキシャル成長方法および装置 |
JPH06124901A (ja) * | 1992-10-09 | 1994-05-06 | Furukawa Electric Co Ltd:The | 化合物半導体薄膜の製造方法 |
JPH07136694A (ja) * | 1993-11-16 | 1995-05-30 | Ebara Res Co Ltd | 有機性廃棄物の加圧水素発酵法 |
JPH0936049A (ja) * | 1995-07-21 | 1997-02-07 | Mitsubishi Electric Corp | 気相成長装置およびこれによって製造された化合物半導体装置 |
US6001183A (en) * | 1996-06-10 | 1999-12-14 | Emcore Corporation | Wafer carriers for epitaxial growth processes |
JPH118119A (ja) | 1997-06-19 | 1999-01-12 | Nissan Motor Co Ltd | 電子コントロールユニット |
JP2000355766A (ja) | 1999-06-15 | 2000-12-26 | Hitachi Kokusai Electric Inc | 基板処理装置及び基板処理方法 |
US6494955B1 (en) * | 2000-02-15 | 2002-12-17 | Applied Materials, Inc. | Ceramic substrate support |
JP2002134484A (ja) * | 2000-10-19 | 2002-05-10 | Asm Japan Kk | 半導体基板保持装置 |
JP2003037071A (ja) * | 2001-07-25 | 2003-02-07 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置および気相成長方法 |
JP3771475B2 (ja) * | 2001-10-05 | 2006-04-26 | 忠行 今中 | 水素の製造法および製造装置 |
JP3857106B2 (ja) * | 2001-11-06 | 2006-12-13 | 株式会社タクマ | 微生物を用いた水素及びメタンの製造方法ならびに装置 |
JP4003527B2 (ja) | 2002-04-25 | 2007-11-07 | 信越半導体株式会社 | サセプタおよび半導体ウェーハの製造方法 |
JP4216541B2 (ja) * | 2002-06-13 | 2009-01-28 | 日鉱金属株式会社 | 気相成長装置 |
JP3882141B2 (ja) | 2002-06-13 | 2007-02-14 | 日鉱金属株式会社 | 気相成長装置および気相成長方法 |
JP2004194625A (ja) * | 2002-12-20 | 2004-07-15 | Densei:Kk | 水素生成装置および水素生成方法 |
DE10261362B8 (de) * | 2002-12-30 | 2008-08-28 | Osram Opto Semiconductors Gmbh | Substrat-Halter |
JP2005013045A (ja) * | 2003-06-24 | 2005-01-20 | Takuma Co Ltd | 有機性廃棄物からの連続的水素生成方法 |
JP2005066420A (ja) * | 2003-08-20 | 2005-03-17 | Japan Science & Technology Agency | 廃棄パンの水素・メタン二段発酵処理方法 |
-
2005
- 2005-02-15 KR KR1020067016830A patent/KR101322217B1/ko active IP Right Grant
- 2005-02-15 CA CA2556066A patent/CA2556066C/en active Active
- 2005-02-15 CN CNB2005800059771A patent/CN100539027C/zh active Active
- 2005-02-15 WO PCT/JP2005/002225 patent/WO2005081298A1/ja active Application Filing
- 2005-02-15 JP JP2006510194A patent/JP4647595B2/ja active Active
- 2005-02-15 EP EP05719127.2A patent/EP1720200B1/en active Active
- 2005-02-15 US US10/589,348 patent/US7670434B2/en not_active Expired - Fee Related
- 2005-02-22 TW TW094105299A patent/TW200539322A/zh unknown
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102144280A (zh) * | 2008-08-29 | 2011-08-03 | 威科仪器有限公司 | 具有变化热阻的晶片载体 |
CN102598239A (zh) * | 2009-12-02 | 2012-07-18 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
CN104377140A (zh) * | 2009-12-02 | 2015-02-25 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
CN102598239B (zh) * | 2009-12-02 | 2015-07-29 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
CN105140166A (zh) * | 2009-12-02 | 2015-12-09 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
CN104377140B (zh) * | 2009-12-02 | 2018-04-03 | 维易科精密仪器国际贸易(上海)有限公司 | 用于提高衬底载体的性能的方法 |
US10262883B2 (en) | 2009-12-02 | 2019-04-16 | Veeco Instruments Inc. | Method for improving performance of a substrate carrier |
CN102691052A (zh) * | 2011-03-22 | 2012-09-26 | 奇力光电科技股份有限公司 | 晶圆承载盘与化学气相沉积机台 |
CN103668123A (zh) * | 2012-09-19 | 2014-03-26 | 甘志银 | 金属有机物化学气相沉积设备的载片盘 |
CN104818527A (zh) * | 2015-04-08 | 2015-08-05 | 上海晶盟硅材料有限公司 | 外延片生产设备 |
Also Published As
Publication number | Publication date |
---|---|
EP1720200B1 (en) | 2014-12-03 |
JP4647595B2 (ja) | 2011-03-09 |
JPWO2005081298A1 (ja) | 2008-01-17 |
TWI345264B (zh) | 2011-07-11 |
CA2556066A1 (en) | 2005-09-01 |
EP1720200A4 (en) | 2007-01-31 |
US20070163504A1 (en) | 2007-07-19 |
KR101322217B1 (ko) | 2013-10-25 |
TW200539322A (en) | 2005-12-01 |
US7670434B2 (en) | 2010-03-02 |
CA2556066C (en) | 2013-07-16 |
CN100539027C (zh) | 2009-09-09 |
WO2005081298A1 (ja) | 2005-09-01 |
EP1720200A1 (en) | 2006-11-08 |
KR20070019689A (ko) | 2007-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Corporation |