CN1951164B - 元件供给板收容体及元件供给装置 - Google Patents

元件供给板收容体及元件供给装置 Download PDF

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Publication number
CN1951164B
CN1951164B CN200580015014XA CN200580015014A CN1951164B CN 1951164 B CN1951164 B CN 1951164B CN 200580015014X A CN200580015014X A CN 200580015014XA CN 200580015014 A CN200580015014 A CN 200580015014A CN 1951164 B CN1951164 B CN 1951164B
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CN
China
Prior art keywords
plate
pallet
guide part
supply
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200580015014XA
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English (en)
Chinese (zh)
Other versions
CN1951164A (zh
Inventor
成田正力
石田贤一
平田修一
仕田智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1951164A publication Critical patent/CN1951164A/zh
Application granted granted Critical
Publication of CN1951164B publication Critical patent/CN1951164B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200580015014XA 2004-05-13 2005-04-20 元件供给板收容体及元件供给装置 Expired - Fee Related CN1951164B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004142984 2004-05-13
JP142984/2004 2004-05-13
PCT/JP2005/007532 WO2005112535A1 (ja) 2004-05-13 2005-04-20 部品供給用プレート収容体及び部品供給装置

Publications (2)

Publication Number Publication Date
CN1951164A CN1951164A (zh) 2007-04-18
CN1951164B true CN1951164B (zh) 2010-06-16

Family

ID=35394557

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580015014XA Expired - Fee Related CN1951164B (zh) 2004-05-13 2005-04-20 元件供给板收容体及元件供给装置

Country Status (6)

Country Link
US (1) US7806642B2 (ja)
JP (2) JP4564490B2 (ja)
KR (1) KR101143138B1 (ja)
CN (1) CN1951164B (ja)
TW (1) TW200601475A (ja)
WO (1) WO2005112535A1 (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8118531B2 (en) * 2005-11-21 2012-02-21 Hirata Corporation Tray holding device
US20080006559A1 (en) * 2006-07-07 2008-01-10 Entegris, Inc. Substrate carrier and handle
JP4735565B2 (ja) * 2007-02-15 2011-07-27 パナソニック株式会社 部品実装装置および部品実装方法
JP4892028B2 (ja) * 2009-03-24 2012-03-07 株式会社ナガオカ製作所 基板収納ラックを設定するための器具
US8602239B2 (en) * 2010-08-16 2013-12-10 Robert L. Thomas, JR. Decorative paper plate storage units
KR101690711B1 (ko) * 2011-08-19 2016-12-29 한화테크윈 주식회사 트레이 피더 및 이를 이용한 부품 공급 방법
EP3557965A1 (en) * 2012-03-12 2019-10-23 Mycronic AB Device for automatic storage of electronic components
EP2903404B1 (en) * 2012-09-27 2018-05-23 Fuji Machine Mfg. Co., Ltd. Component supply device
KR101773272B1 (ko) * 2012-12-27 2017-08-30 가와사끼 쥬고교 가부시끼 가이샤 엔드 이펙터 장치
PL3238514T3 (pl) * 2014-12-22 2020-06-01 Essegi Automation S.R.L. Ulepszona jednostka do przechowywania
EP3594996B1 (en) * 2017-03-09 2021-06-30 Fuji Corporation Component mounting machine
JP7108821B2 (ja) * 2018-05-25 2022-07-29 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品収納体の検出方法
JP7232994B2 (ja) * 2018-05-25 2023-03-06 パナソニックＩｐマネジメント株式会社 部品実装装置および部品収納体の検出方法
EP3806602A4 (en) * 2018-05-30 2021-06-16 Fuji Corporation TAPE FEEDER
EP3591695A1 (en) * 2018-07-06 2020-01-08 Meyer Burger AG Transport apparatus for transporting wafer-shaped objects
CN109461686A (zh) * 2018-10-22 2019-03-12 武汉华星光电半导体显示技术有限公司 电子面板的承托装置
TWI829738B (zh) * 2018-10-31 2024-01-21 日商三星鑽石工業股份有限公司 收納裝置及基板加工裝置
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11756816B2 (en) * 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US11469123B2 (en) 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7386389B2 (ja) * 2019-10-31 2023-11-27 パナソニックＩｐマネジメント株式会社 部品実装装置
US20230030233A1 (en) * 2020-01-06 2023-02-02 Lam Research Corporation Autoconfiguration of hardware components of various modules of a substrate processing tool
JP2023518834A (ja) * 2020-03-23 2023-05-08 アプライド マテリアルズ インコーポレイテッド エンクロージャシステムシェルフ
TWI814375B (zh) * 2022-05-10 2023-09-01 鴻勁精密股份有限公司 承盤裝置、取盤方法、補盤方法及作業機

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757895A (en) * 1984-09-20 1988-07-19 Gelzer John R Article packaging system
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
JP2625112B2 (ja) * 1985-10-24 1997-07-02 テキサス インスツルメンツ インコ−ポレイテツド 処理済ウエーハを所望の真空状態下で保管する方法
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
JPH0795551B2 (ja) * 1988-12-07 1995-10-11 松下電器産業株式会社 チップ供給装置
JPH0670241A (ja) 1992-08-18 1994-03-11 Mitsubishi Electric Corp 撮像装置
JPH06247484A (ja) * 1993-02-23 1994-09-06 Yodogawa Kasei Kk 基板支持用エレメントおよび基板支持用部材
JPH0670241U (ja) * 1993-03-10 1994-09-30 川崎製鉄株式会社 ウエハカセット治具
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
JPH09237798A (ja) 1996-02-28 1997-09-09 Sony Corp リードフレーム収納用マガジン
JPH09289244A (ja) * 1996-04-22 1997-11-04 Dainippon Screen Mfg Co Ltd 基板整列装置
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP3347295B2 (ja) 1998-09-09 2002-11-20 松下電器産業株式会社 部品実装ツールとそれによる部品実装方法および装置
JP3998354B2 (ja) * 1998-11-24 2007-10-24 信越ポリマー株式会社 輸送容器及びその蓋体の開閉方法並びにその蓋体の開閉装置
JP2000164686A (ja) * 1998-11-30 2000-06-16 Tokyo Seimitsu Co Ltd カセット用載置テーブル
US6082540A (en) * 1999-01-06 2000-07-04 Fluoroware, Inc. Cushion system for wafer carriers
JP3916380B2 (ja) * 1999-07-06 2007-05-16 株式会社荏原製作所 基板搬送容器待機ステーション
JP2001244323A (ja) * 2000-02-29 2001-09-07 Yamashita Denki Kk 基板収納用のマガジンラック
JP3938293B2 (ja) * 2001-05-30 2007-06-27 信越ポリマー株式会社 精密基板収納容器及びその押さえ部材
US6745901B2 (en) * 2001-10-12 2004-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cassette equipped with piezoelectric sensors
US20050223581A1 (en) * 2001-11-13 2005-10-13 Hale Kyle S Method of applying measuring markings
US6951284B2 (en) * 2001-11-14 2005-10-04 Entegris, Inc. Wafer carrier with wafer retaining system
EP1555689B1 (en) * 2002-10-25 2010-05-19 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特開2000-91385A 2000.03.31
JP特開2001-244323A 2001.09.07
JP特開昭62-169347A 1987.07.25

Also Published As

Publication number Publication date
WO2005112535A1 (ja) 2005-11-24
US20070227941A1 (en) 2007-10-04
JP2010206232A (ja) 2010-09-16
US7806642B2 (en) 2010-10-05
CN1951164A (zh) 2007-04-18
JPWO2005112535A1 (ja) 2008-03-27
WO2005112535A8 (ja) 2006-03-09
KR20070012700A (ko) 2007-01-26
TW200601475A (en) 2006-01-01
JP4642141B2 (ja) 2011-03-02
KR101143138B1 (ko) 2012-05-08
JP4564490B2 (ja) 2010-10-20

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Granted publication date: 20100616

Termination date: 20210420

CF01 Termination of patent right due to non-payment of annual fee