WO2005112535A8 - 部品供給用プレート収容体及び部品供給装置 - Google Patents

部品供給用プレート収容体及び部品供給装置

Info

Publication number
WO2005112535A8
WO2005112535A8 PCT/JP2005/007532 JP2005007532W WO2005112535A8 WO 2005112535 A8 WO2005112535 A8 WO 2005112535A8 JP 2005007532 W JP2005007532 W JP 2005007532W WO 2005112535 A8 WO2005112535 A8 WO 2005112535A8
Authority
WO
WIPO (PCT)
Prior art keywords
component
supplying
supporting guide
storing body
plate storing
Prior art date
Application number
PCT/JP2005/007532
Other languages
English (en)
French (fr)
Other versions
WO2005112535A1 (ja
Inventor
Shoriki Narita
Kenichi Ishida
Shuichi Hirata
Satoshi Shida
Original Assignee
Matsushita Electric Ind Co Ltd
Shoriki Narita
Kenichi Ishida
Shuichi Hirata
Satoshi Shida
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, Shoriki Narita, Kenichi Ishida, Shuichi Hirata, Satoshi Shida filed Critical Matsushita Electric Ind Co Ltd
Priority to KR1020067023503A priority Critical patent/KR101143138B1/ko
Priority to CN200580015014XA priority patent/CN1951164B/zh
Priority to US11/579,735 priority patent/US7806642B2/en
Priority to JP2006513513A priority patent/JP4564490B2/ja
Publication of WO2005112535A1 publication Critical patent/WO2005112535A1/ja
Publication of WO2005112535A8 publication Critical patent/WO2005112535A8/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

　複数の部品（２）が配置された複数の部品供給用プレート（６）を段積みして収容する部品供給用プレート収容体（５０）において、夫々の支持ガイド部（５０ｂ）の中から、各々の対の組を形成する上記夫々の支持ガイド部を、他の対の組を形成する上記夫々の支持ガイド部から識別可能であり、上記プレート供給方向より視認可能に、当該方向における上記夫々の支持ガイド部の端部又はその近傍に配置された識別マーク部（１１４）を形成する。
PCT/JP2005/007532 2004-05-13 2005-04-20 部品供給用プレート収容体及び部品供給装置 WO2005112535A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020067023503A KR101143138B1 (ko) 2004-05-13 2005-04-20 부품 공급용 플레이트 수용체 및 부품 공급 장치
CN200580015014XA CN1951164B (zh) 2004-05-13 2005-04-20 元件供给板收容体及元件供给装置
US11/579,735 US7806642B2 (en) 2004-05-13 2005-04-20 Receiver for component feed plates and component feeder
JP2006513513A JP4564490B2 (ja) 2004-05-13 2005-04-20 部品供給用プレート収容体及び部品供給装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004142984 2004-05-13
JP2004-142984 2004-05-13

Publications (2)

Publication Number Publication Date
WO2005112535A1 WO2005112535A1 (ja) 2005-11-24
WO2005112535A8 true WO2005112535A8 (ja) 2006-03-09

Family

ID=35394557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/007532 WO2005112535A1 (ja) 2004-05-13 2005-04-20 部品供給用プレート収容体及び部品供給装置

Country Status (6)

Country Link
US (1) US7806642B2 (ja)
JP (2) JP4564490B2 (ja)
KR (1) KR101143138B1 (ja)
CN (1) CN1951164B (ja)
TW (1) TW200601475A (ja)
WO (1) WO2005112535A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108821B2 (ja) 2018-05-25 2022-07-29 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品収納体の検出方法
JP7232994B2 (ja) 2018-05-25 2023-03-06 パナソニックＩｐマネジメント株式会社 部品実装装置および部品収納体の検出方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007057980A1 (ja) * 2005-11-21 2007-05-24 Hirata Corporation トレイ保持装置
US20080006559A1 (en) * 2006-07-07 2008-01-10 Entegris, Inc. Substrate carrier and handle
JP4735565B2 (ja) * 2007-02-15 2011-07-27 パナソニック株式会社 部品実装装置および部品実装方法
JP4892028B2 (ja) * 2009-03-24 2012-03-07 株式会社ナガオカ製作所 基板収納ラックを設定するための器具
US8602239B2 (en) * 2010-08-16 2013-12-10 Robert L. Thomas, JR. Decorative paper plate storage units
KR101690711B1 (ko) * 2011-08-19 2016-12-29 한화테크윈 주식회사 트레이 피더 및 이를 이용한 부품 공급 방법
EP2826350A2 (en) * 2012-03-12 2015-01-21 Mycronic AB Method and device for automatic storage of tape guides
CN104685986B (zh) * 2012-09-27 2017-07-04 富士机械制造株式会社 元件供给装置
CN104937708B (zh) * 2012-12-27 2018-04-24 川崎重工业株式会社 末端执行器装置
BR112017011580B1 (pt) * 2014-12-22 2022-01-18 Essegi Automation S.R.L. Unidade de armazenamento
JP6698212B2 (ja) * 2017-03-09 2020-05-27 株式会社Ｆｕｊｉ 部品装着機
EP3806602A4 (en) * 2018-05-30 2021-06-16 Fuji Corporation TAPE FEEDER
EP3591695A1 (en) * 2018-07-06 2020-01-08 Meyer Burger AG Transport apparatus for transporting wafer-shaped objects
CN109461686A (zh) * 2018-10-22 2019-03-12 武汉华星光电半导体显示技术有限公司 电子面板的承托装置
TWI829738B (zh) * 2018-10-31 2024-01-21 日商三星鑽石工業股份有限公司 收納裝置及基板加工裝置
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11469123B2 (en) 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7386389B2 (ja) * 2019-10-31 2023-11-27 パナソニックＩｐマネジメント株式会社 部品実装装置
US20230030233A1 (en) * 2020-01-06 2023-02-02 Lam Research Corporation Autoconfiguration of hardware components of various modules of a substrate processing tool
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
TWI814375B (zh) * 2022-05-10 2023-09-01 鴻勁精密股份有限公司 承盤裝置、取盤方法、補盤方法及作業機

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757895A (en) * 1984-09-20 1988-07-19 Gelzer John R Article packaging system
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
JP2625112B2 (ja) 1985-10-24 1997-07-02 テキサス インスツルメンツ インコ−ポレイテツド 処理済ウエーハを所望の真空状態下で保管する方法
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
JPH0795551B2 (ja) * 1988-12-07 1995-10-11 松下電器産業株式会社 チップ供給装置
JPH0670241A (ja) 1992-08-18 1994-03-11 Mitsubishi Electric Corp 撮像装置
JPH06247484A (ja) * 1993-02-23 1994-09-06 Yodogawa Kasei Kk 基板支持用エレメントおよび基板支持用部材
JPH0670241U (ja) * 1993-03-10 1994-09-30 川崎製鉄株式会社 ウエハカセット治具
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
JPH09237798A (ja) 1996-02-28 1997-09-09 Sony Corp リードフレーム収納用マガジン
JPH09289244A (ja) * 1996-04-22 1997-11-04 Dainippon Screen Mfg Co Ltd 基板整列装置
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP3347295B2 (ja) 1998-09-09 2002-11-20 松下電器産業株式会社 部品実装ツールとそれによる部品実装方法および装置
JP3998354B2 (ja) * 1998-11-24 2007-10-24 信越ポリマー株式会社 輸送容器及びその蓋体の開閉方法並びにその蓋体の開閉装置
JP2000164686A (ja) * 1998-11-30 2000-06-16 Tokyo Seimitsu Co Ltd カセット用載置テーブル
US6082540A (en) * 1999-01-06 2000-07-04 Fluoroware, Inc. Cushion system for wafer carriers
JP3916380B2 (ja) * 1999-07-06 2007-05-16 株式会社荏原製作所 基板搬送容器待機ステーション
JP2001244323A (ja) * 2000-02-29 2001-09-07 Yamashita Denki Kk 基板収納用のマガジンラック
JP3938293B2 (ja) * 2001-05-30 2007-06-27 信越ポリマー株式会社 精密基板収納容器及びその押さえ部材
US6745901B2 (en) * 2001-10-12 2004-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cassette equipped with piezoelectric sensors
US20050223581A1 (en) * 2001-11-13 2005-10-13 Hale Kyle S Method of applying measuring markings
EP1453745A1 (en) * 2001-11-14 2004-09-08 Entegris, Inc. Wafer carrier with wafer retaining system
EP1555689B1 (en) * 2002-10-25 2010-05-19 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108821B2 (ja) 2018-05-25 2022-07-29 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品収納体の検出方法
JP7232994B2 (ja) 2018-05-25 2023-03-06 パナソニックＩｐマネジメント株式会社 部品実装装置および部品収納体の検出方法

Also Published As

Publication number Publication date
JPWO2005112535A1 (ja) 2008-03-27
WO2005112535A1 (ja) 2005-11-24
CN1951164A (zh) 2007-04-18
JP2010206232A (ja) 2010-09-16
JP4642141B2 (ja) 2011-03-02
US20070227941A1 (en) 2007-10-04
US7806642B2 (en) 2010-10-05
CN1951164B (zh) 2010-06-16
KR101143138B1 (ko) 2012-05-08
TW200601475A (en) 2006-01-01
JP4564490B2 (ja) 2010-10-20
KR20070012700A (ko) 2007-01-26

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