CN1890074B - 基板加工方法、基板加工装置、基板输送方法、基板输送机构 - Google Patents

基板加工方法、基板加工装置、基板输送方法、基板输送机构 Download PDF

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Publication number
CN1890074B
CN1890074B CN2004800356523A CN200480035652A CN1890074B CN 1890074 B CN1890074 B CN 1890074B CN 2004800356523 A CN2004800356523 A CN 2004800356523A CN 200480035652 A CN200480035652 A CN 200480035652A CN 1890074 B CN1890074 B CN 1890074B
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China
Prior art keywords
substrate
mother
adsorption
mother substrate
small
Prior art date
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Expired - Fee Related
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CN2004800356523A
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English (en)
Chinese (zh)
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CN1890074A (zh
Inventor
冈岛康智
中田胜喜
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN1890074A publication Critical patent/CN1890074A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/336—Conveyor diverter for moving work

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN2004800356523A 2003-12-04 2004-12-03 基板加工方法、基板加工装置、基板输送方法、基板输送机构 Expired - Fee Related CN1890074B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP436226/2003 2003-12-04
JP2003436226 2003-12-04
PCT/JP2004/018048 WO2005053925A1 (ja) 2003-12-04 2004-12-03 基板加工方法、基板加工装置および基板搬送方法、基板搬送機構

Publications (2)

Publication Number Publication Date
CN1890074A CN1890074A (zh) 2007-01-03
CN1890074B true CN1890074B (zh) 2011-03-30

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Country Link
US (2) US20080190981A1 (enExample)
EP (1) EP1690660A1 (enExample)
JP (1) JP4739024B2 (enExample)
KR (1) KR101211428B1 (enExample)
CN (1) CN1890074B (enExample)
TW (1) TW200521095A (enExample)
WO (1) WO2005053925A1 (enExample)

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US7770500B2 (en) * 2004-03-15 2010-08-10 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
KR20070023958A (ko) * 2005-08-25 2007-03-02 삼성전자주식회사 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법
JP4904036B2 (ja) * 2005-09-15 2012-03-28 三星ダイヤモンド工業株式会社 基板分断システム
KR100809043B1 (ko) * 2007-06-20 2008-03-03 주식회사 휘닉스 디지탈테크 태그 분리 모듈 및 방법
KR100853989B1 (ko) * 2007-06-20 2008-08-25 주식회사 휘닉스 디지탈테크 셀 분리 장치 및 방법
US20090223628A1 (en) * 2008-03-07 2009-09-10 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus of composite substrate and manufacturing method of composite substrate with use of the manufacturing apparatus
CN102976599B (zh) * 2008-04-21 2015-06-24 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
JP5185380B2 (ja) * 2008-06-18 2013-04-17 三星ダイヤモンド工業株式会社 基板加工システム
TW201008887A (en) * 2008-06-25 2010-03-01 Mitsuboshi Diamond Ind Co Ltd Scribing apparatus
JP5312857B2 (ja) * 2008-06-30 2013-10-09 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP2010023071A (ja) * 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd 貼り合わせ基板の端子加工方法
KR101160166B1 (ko) * 2008-11-05 2012-06-28 세메스 주식회사 절단 장치용 이송 유닛, 이를 갖는 절단 장치 및 이를 이용한 절단 방법
US20100195083A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Automatic substrate transport system
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
KR101228966B1 (ko) * 2010-06-14 2013-02-01 (주)성현 테크놀로지 평판소재 가공방법, 가공장치 및 이에 적용되는 평판소재
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JP6126396B2 (ja) * 2013-02-07 2017-05-10 三星ダイヤモンド工業株式会社 基板加工装置
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JP6105414B2 (ja) * 2013-07-08 2017-03-29 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置
JP5566511B2 (ja) * 2013-08-07 2014-08-06 三星ダイヤモンド工業株式会社 分断装置
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Publication number Publication date
KR101211428B1 (ko) 2012-12-18
US7845529B2 (en) 2010-12-07
CN1890074A (zh) 2007-01-03
US20090236384A1 (en) 2009-09-24
US20080190981A1 (en) 2008-08-14
JP4739024B2 (ja) 2011-08-03
WO2005053925A1 (ja) 2005-06-16
TWI342301B (enExample) 2011-05-21
TW200521095A (en) 2005-07-01
EP1690660A1 (en) 2006-08-16
KR20060123211A (ko) 2006-12-01
JPWO2005053925A1 (ja) 2007-06-28

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