JP4739024B2 - 基板加工方法、基板加工装置および基板搬送機構、基板分離装置 - Google Patents

基板加工方法、基板加工装置および基板搬送機構、基板分離装置 Download PDF

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Publication number
JP4739024B2
JP4739024B2 JP2005515994A JP2005515994A JP4739024B2 JP 4739024 B2 JP4739024 B2 JP 4739024B2 JP 2005515994 A JP2005515994 A JP 2005515994A JP 2005515994 A JP2005515994 A JP 2005515994A JP 4739024 B2 JP4739024 B2 JP 4739024B2
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Prior art keywords
substrate
suction
unit
substrates
members
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Japanese (ja)
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JPWO2005053925A1 (ja
Inventor
康智 岡島
勝喜 中田
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/336—Conveyor diverter for moving work

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2005515994A 2003-12-04 2004-12-03 基板加工方法、基板加工装置および基板搬送機構、基板分離装置 Expired - Fee Related JP4739024B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005515994A JP4739024B2 (ja) 2003-12-04 2004-12-03 基板加工方法、基板加工装置および基板搬送機構、基板分離装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003436226 2003-12-04
JP2003436226 2003-12-04
PCT/JP2004/018048 WO2005053925A1 (ja) 2003-12-04 2004-12-03 基板加工方法、基板加工装置および基板搬送方法、基板搬送機構
JP2005515994A JP4739024B2 (ja) 2003-12-04 2004-12-03 基板加工方法、基板加工装置および基板搬送機構、基板分離装置

Publications (2)

Publication Number Publication Date
JPWO2005053925A1 JPWO2005053925A1 (ja) 2007-06-28
JP4739024B2 true JP4739024B2 (ja) 2011-08-03

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Country Status (7)

Country Link
US (2) US20080190981A1 (enExample)
EP (1) EP1690660A1 (enExample)
JP (1) JP4739024B2 (enExample)
KR (1) KR101211428B1 (enExample)
CN (1) CN1890074B (enExample)
TW (1) TW200521095A (enExample)
WO (1) WO2005053925A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010095003A (ja) * 2004-03-15 2010-04-30 Mitsuboshi Diamond Industrial Co Ltd 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP2015013783A (ja) * 2013-07-08 2015-01-22 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置

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KR20070023958A (ko) * 2005-08-25 2007-03-02 삼성전자주식회사 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법
JP4904036B2 (ja) * 2005-09-15 2012-03-28 三星ダイヤモンド工業株式会社 基板分断システム
KR100809043B1 (ko) * 2007-06-20 2008-03-03 주식회사 휘닉스 디지탈테크 태그 분리 모듈 및 방법
KR100853989B1 (ko) * 2007-06-20 2008-08-25 주식회사 휘닉스 디지탈테크 셀 분리 장치 및 방법
US20090223628A1 (en) * 2008-03-07 2009-09-10 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus of composite substrate and manufacturing method of composite substrate with use of the manufacturing apparatus
CN102976599B (zh) * 2008-04-21 2015-06-24 塔工程有限公司 对结合基板进行台阶式划线的方法及其控制系统
JP5185380B2 (ja) * 2008-06-18 2013-04-17 三星ダイヤモンド工業株式会社 基板加工システム
TW201008887A (en) * 2008-06-25 2010-03-01 Mitsuboshi Diamond Ind Co Ltd Scribing apparatus
JP5312857B2 (ja) * 2008-06-30 2013-10-09 Ｔｏｗａ株式会社 基板の切断方法及び装置
JP2010023071A (ja) * 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd 貼り合わせ基板の端子加工方法
KR101160166B1 (ko) * 2008-11-05 2012-06-28 세메스 주식회사 절단 장치용 이송 유닛, 이를 갖는 절단 장치 및 이를 이용한 절단 방법
US20100195083A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Automatic substrate transport system
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
KR101228966B1 (ko) * 2010-06-14 2013-02-01 (주)성현 테크놀로지 평판소재 가공방법, 가공장치 및 이에 적용되는 평판소재
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
JP2013023401A (ja) * 2011-07-20 2013-02-04 Mitsuboshi Diamond Industrial Co Ltd 分断装置
JP5348212B2 (ja) * 2011-09-02 2013-11-20 三星ダイヤモンド工業株式会社 分断装置
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EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP6126396B2 (ja) * 2013-02-07 2017-05-10 三星ダイヤモンド工業株式会社 基板加工装置
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JP2015013783A (ja) * 2013-07-08 2015-01-22 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置

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US20090236384A1 (en) 2009-09-24
US20080190981A1 (en) 2008-08-14
WO2005053925A1 (ja) 2005-06-16
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TW200521095A (en) 2005-07-01
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CN1890074B (zh) 2011-03-30
JPWO2005053925A1 (ja) 2007-06-28

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