CN1770953A - 表面处理铜箔及电路基板 - Google Patents
表面处理铜箔及电路基板 Download PDFInfo
- Publication number
- CN1770953A CN1770953A CNA2005101089901A CN200510108990A CN1770953A CN 1770953 A CN1770953 A CN 1770953A CN A2005101089901 A CNA2005101089901 A CN A2005101089901A CN 200510108990 A CN200510108990 A CN 200510108990A CN 1770953 A CN1770953 A CN 1770953A
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- China
- Prior art keywords
- copper foil
- surface treatment
- thrust
- feature
- described surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
本发明例 | 铜箔的种类 | 处理面 | 电镀 | 原料箔 | 处理表面粗糙度(μm) | 突起物个数 | 亮度 | 薄膜 | 剥离强度(KN/m) | 传输损失减少率(%) | 精细布图特性最小值L/S(μm/μm) |
本发明例1 | 电解 | M | A | 1 | 1.12 | 72 | 22 | 薄膜1 | 0.51 | 25 | 14/14 |
本发明例2 | 电解 | S | B | 3 | 1.85 | 50 | 29 | 薄膜1 | 0.80 | 28 | 20/20 |
本发明例3 | 压延 | - | B | 1 | 1.25 | 64 | 22 | 薄膜1 | 0.57 | 18 | 15/15 |
本发明例4 | 电解 | M | B | 2 | 1.46 | 58 | 24 | 薄膜1 | 0.53 | 31 | 15/15 |
本发明例5 | 电解 | M | A | 3 | 1.76 | 45 | 28 | 薄膜1 | 0.74 | 21 | 20/20 |
本发明例6 | 压延 | - | C | 1 | 1.45 | 62 | 25 | 薄膜1 | 0.61 | 18 | 18/18 |
本发明例7 | 电解 | M | B | 2 | 1.35 | 65 | 24 | 薄膜1 | 0.58 | 17 | 15/15 |
本发明例8 | 电解 | S | A | 3 | 1.68 | 51 | 27 | 薄膜1 | 0.69 | 23 | 18/18 |
本发明例9 | 电解 | M | A | 1 | 1.08 | 85 | 21 | 聚酰亚胺 | 0.48 | 38 | 14/14 |
本发明例10 | 电解 | S | B | 3 | 1.75 | 53 | 23 | 聚酰亚胺 | 0.78 | 25 | 20/20 |
本发明例11 | 电解 | M | A | 1 | 1.12 | 76 | 28 | FR4 | 0.47 | 22 | 15/15 |
本发明例12 | 电解 | S | B | 3 | 1.86 | 47 | 22 | FR4 | 0.79 | 28 | 20/20 |
比较例 | 铜箔的种类 | 处理面 | 电镀 | 原料箔 | 处理表面粗糙度(μm) | 突起物个数 | 亮度 | 薄膜 | 剥离强度(KN/m) | 传输损失减少率(%) | 精细布图特性最小值L/S(μm/μm) |
比较例1 | 电解 | M | A’ | 1 | 2.52 | 10 | 43 | 薄膜1 | 0.53 | 0 | 30/30 |
比较例2 | 电解 | S | B’ | 3 | 3.42 | 6 | 37 | 薄膜1 | 0.81 | 0 | 50/50 |
比较例3 | 压延 | - | B’ | 1 | 2.05 | 2 | 39 | 薄膜1 | 0.59 | 0 | 25/25 |
比较例4 | 电解 | M | B’ | 2 | 3.12 | 3 | 38 | 薄膜1 | 0.55 | 0 | 45/45 |
比较例5 | 电解 | M | A’ | 3 | 2.78 | 7 | 36 | 薄膜1 | 0.77 | 0 | 40/40 |
比较例6 | 压延 | - | C’ | 1 | 2.38 | 7 | 38 | 薄膜1 | 0.59 | 0 | 30/30 |
比较例7 | 电解 | M | B’ | 2 | 2.25 | 0 | 41 | 薄膜1 | 0.57 | 0 | 25/25 |
比较例8 | 电解 | S | A’ | 3 | 2.89 | 10 | 37 | 薄膜1 | 0.76 | 0 | 45/45 |
比较例9 | 电解 | M | A’ | 1 | 2.05 | 3 | 39 | 聚酰亚胺 | 0.49 | 0 | 45/45 |
比较例10 | 电解 | S | B’ | 3 | 2.43 | 11 | 41 | 聚酰亚胺 | 0.81 | 0 | 30/30 |
比较例11 | 电解 | M | A’ | 1 | 2.10 | 12 | 36 | FR4 | 0.74 | 0 | 50/50 |
比较例12 | 电解 | S | B’ | 3 | 3.15 | 5 | 37 | FR4 | 0.76 | 0 | 50/50 |
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-293785 | 2004-10-06 | ||
JP2004293785A JP2006103189A (ja) | 2004-10-06 | 2004-10-06 | 表面処理銅箔並びに回路基板 |
JP2004293785 | 2004-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1770953A true CN1770953A (zh) | 2006-05-10 |
CN1770953B CN1770953B (zh) | 2010-05-05 |
Family
ID=35539621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101089901A Expired - Fee Related CN1770953B (zh) | 2004-10-06 | 2005-09-29 | 表面处理铜箔及电路基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060088723A1 (zh) |
EP (1) | EP1645662A1 (zh) |
JP (1) | JP2006103189A (zh) |
KR (1) | KR20060052031A (zh) |
CN (1) | CN1770953B (zh) |
TW (1) | TW200628037A (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101126168B (zh) * | 2006-06-07 | 2011-07-27 | 古河电气工业株式会社 | 表面处理电解铜箔及其制造方法以及电路基板 |
CN102215632A (zh) * | 2010-04-06 | 2011-10-12 | 福田金属箔粉工业株式会社 | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 |
CN102215635A (zh) * | 2010-04-06 | 2011-10-12 | 福田金属箔粉工业株式会社 | 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板 |
CN102713020A (zh) * | 2010-01-22 | 2012-10-03 | 古河电气工业株式会社 | 表面处理铜箔,其制造方法以及覆铜层压印刷电路板 |
CN102803576A (zh) * | 2010-01-22 | 2012-11-28 | 古河电气工业株式会社 | 粗化处理铜箔及其制造方法、覆铜层压板及印刷电路板 |
CN102959775A (zh) * | 2010-06-28 | 2013-03-06 | 古河电气工业株式会社 | 电解铜箔、锂离子充电电池用电解铜箔、使用该电解铜箔的锂离子充电电池用电极、使用该电极的锂离子充电电池 |
CN104685980A (zh) * | 2012-10-04 | 2015-06-03 | Jx日矿日石金属株式会社 | 多层印刷配线基板的制造方法及基底基材 |
CN104717831A (zh) * | 2013-11-29 | 2015-06-17 | Jx日矿日石金属株式会社 | 表面处理铜箔、层压板、印刷布线板、电子机器、附载体铜箔、及印刷布线板的制造方法 |
CN106953099A (zh) * | 2015-10-15 | 2017-07-14 | 长春石油化学股份有限公司 | 抗松弛铜箔 |
CN107130288A (zh) * | 2015-09-25 | 2017-09-05 | 日进材料股份有限公司 | 经表面处理的铜箔及其制造方法 |
CN109601024A (zh) * | 2017-07-31 | 2019-04-09 | 卢森堡电路箔片股份有限公司 | 表面处理过的铜箔和覆铜箔层压板 |
CN111937197A (zh) * | 2019-02-01 | 2020-11-13 | 长春石油化学股份有限公司 | 表面处理铜箔及铜箔基板 |
CN112708909A (zh) * | 2020-12-18 | 2021-04-27 | 江西省江铜耶兹铜箔有限公司 | 一种复合电镀液及高频pcb用低轮廓电解铜箔的制备方法 |
CN114603944A (zh) * | 2022-05-12 | 2022-06-10 | 广州方邦电子股份有限公司 | 金属箔、覆铜层叠板、线路板、半导体、负极材料和电池 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
JP4736703B2 (ja) * | 2005-10-14 | 2011-07-27 | 宇部興産株式会社 | 銅配線ポリイミドフィルムの製造方法 |
JP4556910B2 (ja) * | 2006-01-19 | 2010-10-06 | パナソニック電工株式会社 | 両面銅張積層板 |
JP4890546B2 (ja) | 2006-06-12 | 2012-03-07 | Jx日鉱日石金属株式会社 | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
JP5479668B2 (ja) * | 2006-12-26 | 2014-04-23 | 古河電気工業株式会社 | 表面処理銅箔 |
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JP4826569B2 (ja) * | 2007-10-05 | 2011-11-30 | 日立電線株式会社 | プリント配線板用金属板材およびその製造方法 |
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JP6261037B2 (ja) * | 2014-02-06 | 2018-01-17 | 古河電気工業株式会社 | 高周波回路用銅箔、銅張積層板及びプリント配線板 |
JP6089160B1 (ja) * | 2015-08-12 | 2017-03-01 | 古河電気工業株式会社 | 高周波回路用銅箔、銅張積層板、プリント配線基板 |
WO2017051897A1 (ja) * | 2015-09-24 | 2017-03-30 | Jx金属株式会社 | 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法 |
KR20170038969A (ko) * | 2015-09-30 | 2017-04-10 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
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- 2005-09-13 TW TW094131450A patent/TW200628037A/zh unknown
- 2005-09-29 CN CN2005101089901A patent/CN1770953B/zh not_active Expired - Fee Related
- 2005-10-05 US US11/243,192 patent/US20060088723A1/en not_active Abandoned
- 2005-10-05 KR KR1020050093334A patent/KR20060052031A/ko not_active Application Discontinuation
- 2005-10-06 EP EP05256254A patent/EP1645662A1/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
CN1770953B (zh) | 2010-05-05 |
TW200628037A (en) | 2006-08-01 |
JP2006103189A (ja) | 2006-04-20 |
KR20060052031A (ko) | 2006-05-19 |
US20060088723A1 (en) | 2006-04-27 |
EP1645662A1 (en) | 2006-04-12 |
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