CN1649081A - 激光退火方法及激光退火装置 - Google Patents
激光退火方法及激光退火装置 Download PDFInfo
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- CN1649081A CN1649081A CNA2004100978839A CN200410097883A CN1649081A CN 1649081 A CN1649081 A CN 1649081A CN A2004100978839 A CNA2004100978839 A CN A2004100978839A CN 200410097883 A CN200410097883 A CN 200410097883A CN 1649081 A CN1649081 A CN 1649081A
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Images
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004022461 | 2004-01-30 | ||
JP2004022461A JP4838982B2 (ja) | 2004-01-30 | 2004-01-30 | レーザアニール方法およびレーザアニール装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1649081A true CN1649081A (zh) | 2005-08-03 |
CN100347814C CN100347814C (zh) | 2007-11-07 |
Family
ID=34805663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100978839A Expired - Fee Related CN100347814C (zh) | 2004-01-30 | 2004-11-30 | 激光退火方法及激光退火装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7397831B2 (zh) |
JP (1) | JP4838982B2 (zh) |
KR (1) | KR100685344B1 (zh) |
CN (1) | CN100347814C (zh) |
TW (1) | TWI260701B (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102165562A (zh) * | 2008-09-29 | 2011-08-24 | 日立电脑机器株式会社 | 半导体制造装置 |
CN102290342A (zh) * | 2011-09-05 | 2011-12-21 | 清华大学 | 一种采用六边形束斑的激光扫描退火方法 |
CN102321921A (zh) * | 2011-09-05 | 2012-01-18 | 西南科技大学 | 一种快速制备大面积均匀黑硅材料的方法和设备 |
CN104347368A (zh) * | 2013-07-26 | 2015-02-11 | 上海微电子装备有限公司 | 多激光的激光退火装置及方法 |
CN105209954A (zh) * | 2012-08-22 | 2015-12-30 | 住友重机械工业株式会社 | 激光照射装置 |
CN107170697A (zh) * | 2017-04-27 | 2017-09-15 | 昆山国显光电有限公司 | 一种基板退火装置 |
CN110655312A (zh) * | 2018-06-28 | 2020-01-07 | 三星电子株式会社 | 激光切割设备、激光束调制的方法和切割基板的方法 |
CN112424920A (zh) * | 2018-07-27 | 2021-02-26 | 株式会社考恩斯特 | 激光退火装置 |
CN112670212A (zh) * | 2020-12-24 | 2021-04-16 | 武汉理工大学 | 一种大面积印刷与激光退火制造装置及半导体制造方法 |
CN114730075A (zh) * | 2019-12-20 | 2022-07-08 | 株式会社V技术 | 激光照射装置 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4474108B2 (ja) * | 2002-09-02 | 2010-06-02 | 株式会社 日立ディスプレイズ | 表示装置とその製造方法および製造装置 |
JP4838982B2 (ja) * | 2004-01-30 | 2011-12-14 | 株式会社 日立ディスプレイズ | レーザアニール方法およびレーザアニール装置 |
DE102005037764B4 (de) * | 2005-08-10 | 2008-07-03 | Carl Zeiss Jena Gmbh | Anordnung zur homogenen Beleuchtung eines Feldes |
US7700463B2 (en) * | 2005-09-02 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
WO2007108157A1 (ja) * | 2006-03-17 | 2007-09-27 | Sharp Kabushiki Kaisha | 薄膜トランジスタの製造方法、レーザー結晶化装置及び半導体装置 |
CN101432851B (zh) * | 2006-03-30 | 2011-06-15 | 日立电脑机器株式会社 | 激光照射装置、激光照射方法以及改性目标体的制造方法 |
TW200741883A (en) * | 2006-04-21 | 2007-11-01 | Zeiss Carl Laser Optics Gmbh | Apparatus for laser annealing of large substrates and method for laser annealing for large substrates |
US7504326B2 (en) * | 2006-05-30 | 2009-03-17 | Advanced Micro Devices, Inc. | Use of scanning theme implanters and annealers for selective implantation and annealing |
US7935584B2 (en) * | 2006-08-31 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing crystalline semiconductor device |
US7662703B2 (en) * | 2006-08-31 | 2010-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing crystalline semiconductor film and semiconductor device |
JP4274251B2 (ja) * | 2007-01-24 | 2009-06-03 | ソニー株式会社 | レーザ描画方法及びレーザ描画装置 |
JP2008251839A (ja) * | 2007-03-30 | 2008-10-16 | Ihi Corp | レーザアニール方法及びレーザアニール装置 |
US20090120924A1 (en) * | 2007-11-08 | 2009-05-14 | Stephen Moffatt | Pulse train annealing method and apparatus |
US9498845B2 (en) | 2007-11-08 | 2016-11-22 | Applied Materials, Inc. | Pulse train annealing method and apparatus |
DE102008027231B4 (de) * | 2008-06-06 | 2016-03-03 | Limo Patentverwaltung Gmbh & Co. Kg | Vorrichtung zur Strahlformung |
TWI419203B (zh) * | 2008-10-16 | 2013-12-11 | Sumco Corp | 具吸附槽之固態攝影元件用磊晶基板、半導體裝置、背照式固態攝影元件及其製造方法 |
KR100914886B1 (ko) * | 2008-12-23 | 2009-08-31 | 주훈 | 다중 보정 모드를 가진 적외선 열상 현미경 어셈블리 |
DE102009053715A1 (de) * | 2009-11-19 | 2011-05-26 | Feha Lasertec Halle Gmbh | Laservorrichtung zur Gravur von Druckwalzen |
US8905547B2 (en) * | 2010-01-04 | 2014-12-09 | Elbit Systems Of America, Llc | System and method for efficiently delivering rays from a light source to create an image |
KR101777289B1 (ko) * | 2010-11-05 | 2017-09-12 | 삼성디스플레이 주식회사 | 연속측면고상화(Sequential Lateral Solidification:SLS)를 이용한 결정화 장치 |
JP5897825B2 (ja) * | 2011-06-20 | 2016-03-30 | 株式会社日立情報通信エンジニアリング | レーザ照射装置及びレーザ照射方法 |
JP5464192B2 (ja) * | 2011-09-29 | 2014-04-09 | 株式会社デンソー | 半導体装置の製造方法 |
KR101288993B1 (ko) * | 2011-12-20 | 2013-08-16 | 삼성디스플레이 주식회사 | 레이저 어닐링 장치 |
DE102012012883B4 (de) * | 2012-06-28 | 2015-11-12 | Innolas Solutions Gmbh | Laserbearbeitungsvorrichtung zur Laserbearbeitung eines Ausgangssubstrats für die Herstellung von Solarzellen |
JP2014133907A (ja) * | 2013-01-08 | 2014-07-24 | Mitsubishi Electric Corp | 成膜装置 |
US9390926B2 (en) | 2013-03-11 | 2016-07-12 | Applied Materials, Inc. | Process sheet resistance uniformity improvement using multiple melt laser exposures |
WO2014152867A1 (en) | 2013-03-14 | 2014-09-25 | Abbott Laboratories | Beam shaping optics of flow cytometer systems and methods related thereto |
JP5828852B2 (ja) * | 2013-03-15 | 2015-12-09 | 三星ダイヤモンド工業株式会社 | レーザー加工装置およびレーザー加工装置を用いた被加工物の加工方法 |
US10537965B2 (en) * | 2013-12-13 | 2020-01-21 | Applied Materials, Inc. | Fiber array line generator |
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- 2004-11-12 KR KR1020040092186A patent/KR100685344B1/ko not_active IP Right Cessation
- 2004-11-15 US US10/986,936 patent/US7397831B2/en not_active Expired - Fee Related
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TW200527516A (en) | 2005-08-16 |
JP4838982B2 (ja) | 2011-12-14 |
CN100347814C (zh) | 2007-11-07 |
JP2005217213A (ja) | 2005-08-11 |
US20050170572A1 (en) | 2005-08-04 |
US7397831B2 (en) | 2008-07-08 |
TWI260701B (en) | 2006-08-21 |
KR20050078187A (ko) | 2005-08-04 |
KR100685344B1 (ko) | 2007-02-22 |
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