CN1552099A - 模块部件 - Google Patents

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CN1552099A
CN1552099A CNA038009641A CN03800964A CN1552099A CN 1552099 A CN1552099 A CN 1552099A CN A038009641 A CNA038009641 A CN A038009641A CN 03800964 A CN03800964 A CN 03800964A CN 1552099 A CN1552099 A CN 1552099A
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circuit substrate
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ground connection
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seal
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CN1323435C (zh
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��Ե���
恒冈道朗
桥本兴二
叶山雅昭
安保武雄
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Panasonic Holdings Corp
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Abstract

本发明的模块部件包括：贴装部件；安装有贴装部件的电路基板；第一接地图形，其设在电路基板表面层的最外周；第一密封体，其设在电路基板上，在电路基板上的投影面积比电路基板的外形小，由第一树脂形成，密封贴装部件；金属膜，其覆盖密封体表面，与接地图形连接。该模块部件由于高度低，可以得到充分的屏蔽效果。

Description

模块部件
技术领域
本发明涉及用于各种电子设备、通信设备等的模块部件。
背景技术
图9所示的现有的模块部件包括：电路基板21，其至少在一面装有一个以上的贴装部件23；接地电极24，其呈凹状在电路基板21的侧面设置；金属罩22，其设置为覆盖所述贴装部件。金属罩22的一端插入接地电极24并且用焊接连接，进行模块部件的电屏蔽。
现有的模块部件为了用焊接把金属罩22与电路基板21的侧面连接起来，金属罩22必须有能自立程度的电路基板21的厚度。另外，由于金属罩22碰上装在电路基板21上的贴装部件23，会发生短路及由外部应力产生的电路动作不当。为了防止这些问题，金属罩的高度必须比贴装部件23的高度高。进而，在电路基板21与金属罩22的连接中，为了使金属罩22与在电路基板21表面形成的电路图形及贴装部件23不接触，在电路基板21与金属罩22之间设置间隙，并且在金属罩22上形成的端子与在多处的电路基板21的侧面端子部件连接。因此，该模块部件很难薄型化，收不到充分的屏蔽效果。
发明内容
模块部件包括：贴装部件；安装贴装部件的电路基板；接地图形，其设在所述电路基板表面层的最外周；密封体，其设在电路基板上，在电路基板上的投影面积比电路基板的外形小，由树脂形成，密封贴装部件；金属膜，其覆盖密封体的表面，与接地图形连接。
该模块部件由于高度低，可以收到充分的屏蔽效果。
附图说明
图1是根据本发明的实施例1的模块部件的立体图；
图2是图1所示模块部件中2-2处的剖面图；
图3是模块部件屏蔽效果的比较图；
图4是根据实施例1的另一模块部件的剖面图；
图5是根据本发明的实施例2的模块部件的立体图；
图6是图5所示模块部件中6-6处的剖面图；
图7是根据实施例2的另一模块部件的剖面图；
图8是根据实施例1的模块部件的放大剖面图；
图9是现有技术的模块部件的立体图。
附图标记说明：
具体实施方式
(实施例1)
图1是根据本发明的实施例1的模块部件的立体图，图2是图1所示模块部件中2-2处的剖面图。多层基板构成的电路基板1，其经过电源、地线、高频电路图形等至少两层以上的配线层形成，在电路基板1的表面安装电阻、电容、线圈、半导体、水晶等贴装部件3用无铅焊料焊接连接。象覆盖贴装部件3那样，形成密封体4，其在电路基板1上的投影面积比电路基板1的外形小，并由环氧树脂构成。在密封体4的表面形成金属膜2。金属膜2与在电路基板1的表层最外周的四边所形成的第一接地图形5连接。
图3是比较以有密封体4、没有金属膜2的模块部件为基准的各种试料的模块部件屏蔽效果的图。试料A是有金属罩的现有技术的模块。试料B在电路基板1的两个短边上有接地图形5。试料C具有设在电路基板1的四个角部的接地图形5。试料D在电路基板1的四边有接地图形5。试料E在电路基板1的两个长边上有接地图形5。在电路基板1的四边有接地图形5的试料E的模块部件比有金属罩的现有技术的模块部件具有更好的屏蔽效果。
如图3所示，具有与接地图形5在多处连接的金属膜2的模块部件和具有与接地图形5在四边连接的金属膜2的模块部件可以得到可靠的屏蔽效果。
如图2所示，在电路基板1的表层上形成的接地图形5与金属膜2连接。另外，如图4所示，也可以使在电路基板1的外周部形成的接地图形5的侧面端部与金属膜2连接。
若金属膜的厚度大致为1毫米以上，就可以收到足够的屏蔽效果。如图8所示，在密封体4的表面用无电解电镀形成铜金属膜101，该金属膜的表面用电解电镀形成更致密的金属膜102。而得到金属膜2。因此，金属膜2与接地图形5的连接电阻变低，使金属膜2的接地电位稳定，而提高屏蔽效果。
如图2或图4所示，电路基板1的投影面积比用金属膜2覆盖的密封体4的投影面积大，在密封体4和电路基板1上设置台阶。因此，由无电解电镀和电解电镀形成的金属膜2与密封体4和电路基板1的密接性提高，可以防止从密封体4和接地图形5上剝离。因此，可以可靠地屏蔽由贴装部件3组成的电路，该贴装部件3通过与在电路基板1上形成的接地图形5和设在密封体4上的金属膜2连接而形成在电路基板1上。
电路基板和贴装部件也可以用无铅焊料焊接连接。因此，该电路模块在与母基板连接时可以维持电路的连接，并能维持屏蔽效果。
电路基板和贴装部件也可以用导电性粘接剂连接。因此，该电路模块在与母模基板连接时维持电路的连接，并能维持屏蔽效果。
另外，电路基板和贴装部件的间隙也可以用树脂密封。因此，可以排除间隙空间中存在的空气，确保高可靠性，可以维持屏蔽效果。
(实施例2)
图5是根据本发明的实施例2的模块部件的立体图，图6是图5所示模块部件中线6-6处的剖面图。实施例2中的模块部件如图5所示，用金属膜2覆盖的密封体4由第二树脂形成的密封体7分割成三块。
如图6所示，在实施例1中说明过的电源、地线、高频电路图形等经过至少两层以上的配线层形成电路基板1，在其表面的外周部形成第一接地图形5。
电阻、电容、线圈、半导体和水晶等贴装部件3安装在电路基板1的表面上。如覆盖贴装部件3那样形成在电路基板1上的投影面积比电路基板1的外形小的密封体4，在密封体4上设置将贴装部件3分成所要求的电路块的分割槽6。
在密封体4和分割槽6的表面上形成的金属膜2在接地图形5的表面上连接。在分割槽6的金属膜2上形成用第二树脂填充的密封体7。
这样，贴装部件3用分割槽6分成所要求的电路块，并用密封体4覆盖，各个电路块在其表面上的金属膜2与第一接地图形5连接。因此，可以得到包含多个电路块的小型模块部件，这些电路块间被电屏蔽、互相没有电噪声干扰。
另外，由于在分割槽6中填充第二树脂而形成密封体7，即使是薄模块部件，弯曲强度也很强，可以保证弯曲很小。因此，可以确保金属膜2和接地图形5的连接可靠性，并能确保屏蔽性的效果。
图7所示的另一模块部件通过在电路基板1厚度方向的中途形成的金属膜2也可以屏蔽在电路基板1的内部形成的图形的一部分，收到比图6所示的模块部件好的屏蔽效果。
在密封体4的分割槽的底面或侧面，金属膜2和电路基板的接地图形5也可以各自独立。因此，提高各个电路块屏蔽效果。
根据本发明的部件是小型的、并具有很好的屏蔽效果。

Claims (9)

1.一种模块部件，包括：
贴装部件；安装有所述贴装部件的电路基板；
第一接地图形，其设在所述电路基板表面层的最外周；
第一密封体，其设在所述电路基板上，在所述电路基板上的投影面积比所述电路基板的外形小，由第一树脂形成，密封所述贴装部件；
金属膜，其覆盖所述密封体表面，与所述接地图形连接。
2如权利要求1所述的模块部件，其中，所述电路基板的所述表面层比所述电路基板的外形小，所述金属膜与所述接地图形的侧面端部连接。
3如权利要求1所述的模块部件，其中，还有设在所述电路基板的所述表面层上的第二接地图形，所述第一密封体具有与所要求的电路块对应形成的分割槽。
4如权利要求3所述的模块部件，其中，所述金属膜在所述分割槽的底面和侧面的至少一个上与所述第二接地图形连接。
5如权利要求3所述的模块部件，其中，还有设置由填充所述分割槽的第二树脂形成的第二密封体。
6如权利要求1所述的模块部件，其中，所述金属膜包括在所述第一密封体上由无电解电镀形成的第一膜和在所述第一膜上由电解电镀形成的第二膜。
7如权利要求1所述的模块部件，其中，所述电路基板与所述贴装部件用无铅焊料焊接连接。
8如权利要求1所述的模块部件，其中，所述电路基板与所述贴装部件用导电性粘接剂连接。
9如权利要求1所述的模块部件，其中，还设置密封所述电路基板与所述贴装部件间隙的第三树脂。
CNB038009641A 2002-07-19 2003-06-16 模块部件 Expired - Fee Related CN1323435C (zh)

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JP210750/2002 2002-07-19
JP2002210750 2002-07-19

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CN1552099A true CN1552099A (zh) 2004-12-01
CN1323435C CN1323435C (zh) 2007-06-27

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US (1) US7161252B2 (zh)
EP (1) EP1416532A4 (zh)
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CN (1) CN1323435C (zh)
WO (1) WO2004010499A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
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CN105578733A (zh) * 2016-02-26 2016-05-11 青岛海信移动通信技术股份有限公司 一种pcb及其制作方法
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