CN1533523A - 受控流体定比率控制的方法和装置 - Google Patents
受控流体定比率控制的方法和装置 Download PDFInfo
- Publication number
- CN1533523A CN1533523A CNA028104846A CN02810484A CN1533523A CN 1533523 A CN1533523 A CN 1533523A CN A028104846 A CNA028104846 A CN A028104846A CN 02810484 A CN02810484 A CN 02810484A CN 1533523 A CN1533523 A CN 1533523A
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- China
- Prior art keywords
- fluid
- flow
- set point
- controlled
- controller
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
- G05D7/0664—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging flows from a single flow
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0363—For producing proportionate flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0379—By fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7759—Responsive to change in rate of fluid flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87249—Multiple inlet with multiple outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
- Y10T137/87877—Single inlet with multiple distinctly valved outlets
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims (70)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29335601P | 2001-05-24 | 2001-05-24 | |
US60/293,356 | 2001-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1533523A true CN1533523A (zh) | 2004-09-29 |
CN100403198C CN100403198C (zh) | 2008-07-16 |
Family
ID=23128747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028104846A Expired - Fee Related CN100403198C (zh) | 2001-05-24 | 2002-05-23 | 流体流量控制器和定比率控制流体流量的方法和装置 |
Country Status (7)
Country | Link |
---|---|
US (5) | US6752166B2 (zh) |
EP (1) | EP1399789A1 (zh) |
JP (3) | JP4209688B2 (zh) |
KR (1) | KR20040019293A (zh) |
CN (1) | CN100403198C (zh) |
TW (1) | TW573240B (zh) |
WO (1) | WO2002095519A1 (zh) |
Cited By (8)
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CN101457352B (zh) * | 2007-12-10 | 2012-10-03 | 泰拉半导体株式会社 | 一种测量源物质蒸发部中剩余的源物质的量的方法 |
CN102124418B (zh) * | 2008-08-13 | 2013-07-03 | 国际壳牌研究有限公司 | 用于控制在多个气体流束之间的气体流量的方法 |
CN101702940B (zh) * | 2007-02-20 | 2013-07-31 | Mks仪器公司 | 包括利用多反对称最优控制装置的流量比率控制器的气体输送方法和系统 |
CN104514759A (zh) * | 2014-12-30 | 2015-04-15 | 天津福云天翼科技有限公司 | 一种大流量分离式蓄能器组的恒定压力调节系统 |
CN104583658A (zh) * | 2012-08-21 | 2015-04-29 | 应用材料公司 | 增强的气体流率控制的方法及设备 |
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CN108780761A (zh) * | 2016-03-15 | 2018-11-09 | 应用材料公司 | 用于气体流量比例控制的方法及组件 |
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CN101702940B (zh) * | 2007-02-20 | 2013-07-31 | Mks仪器公司 | 包括利用多反对称最优控制装置的流量比率控制器的气体输送方法和系统 |
CN101457352B (zh) * | 2007-12-10 | 2012-10-03 | 泰拉半导体株式会社 | 一种测量源物质蒸发部中剩余的源物质的量的方法 |
CN102124418B (zh) * | 2008-08-13 | 2013-07-03 | 国际壳牌研究有限公司 | 用于控制在多个气体流束之间的气体流量的方法 |
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CN104514759A (zh) * | 2014-12-30 | 2015-04-15 | 天津福云天翼科技有限公司 | 一种大流量分离式蓄能器组的恒定压力调节系统 |
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Also Published As
Publication number | Publication date |
---|---|
US7360551B2 (en) | 2008-04-22 |
US7424894B2 (en) | 2008-09-16 |
WO2002095519A1 (en) | 2002-11-28 |
KR20040019293A (ko) | 2004-03-05 |
US20060272703A1 (en) | 2006-12-07 |
US7143774B2 (en) | 2006-12-05 |
US20040200529A1 (en) | 2004-10-14 |
JP2008198203A (ja) | 2008-08-28 |
JP2008217779A (ja) | 2008-09-18 |
CN100403198C (zh) | 2008-07-16 |
JP2004527856A (ja) | 2004-09-09 |
EP1399789A1 (en) | 2004-03-24 |
US6941965B2 (en) | 2005-09-13 |
US20070107783A1 (en) | 2007-05-17 |
US6752166B2 (en) | 2004-06-22 |
TW573240B (en) | 2004-01-21 |
US20020179148A1 (en) | 2002-12-05 |
US20050241698A1 (en) | 2005-11-03 |
JP4209688B2 (ja) | 2009-01-14 |
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