CN100403198C - 流体流量控制器和定比率控制流体流量的方法和装置 - Google Patents
流体流量控制器和定比率控制流体流量的方法和装置 Download PDFInfo
- Publication number
- CN100403198C CN100403198C CNB028104846A CN02810484A CN100403198C CN 100403198 C CN100403198 C CN 100403198C CN B028104846 A CNB028104846 A CN B028104846A CN 02810484 A CN02810484 A CN 02810484A CN 100403198 C CN100403198 C CN 100403198C
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- China
- Prior art keywords
- fluid
- flow
- controlled
- set point
- controller
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- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
- G05D7/0664—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging flows from a single flow
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0363—For producing proportionate flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0379—By fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7759—Responsive to change in rate of fluid flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7761—Electrically actuated valve
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87249—Multiple inlet with multiple outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/877—With flow control means for branched passages
- Y10T137/87877—Single inlet with multiple distinctly valved outlets
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims (66)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29335601P | 2001-05-24 | 2001-05-24 | |
US60/293,356 | 2001-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1533523A CN1533523A (zh) | 2004-09-29 |
CN100403198C true CN100403198C (zh) | 2008-07-16 |
Family
ID=23128747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028104846A Expired - Fee Related CN100403198C (zh) | 2001-05-24 | 2002-05-23 | 流体流量控制器和定比率控制流体流量的方法和装置 |
Country Status (7)
Country | Link |
---|---|
US (5) | US6752166B2 (zh) |
EP (1) | EP1399789A1 (zh) |
JP (3) | JP4209688B2 (zh) |
KR (1) | KR20040019293A (zh) |
CN (1) | CN100403198C (zh) |
TW (1) | TW573240B (zh) |
WO (1) | WO2002095519A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104460706A (zh) * | 2013-09-12 | 2015-03-25 | 朗姆研究公司 | 群集的质量流装置和包含该装置的多管线质量流装置 |
CN108886001A (zh) * | 2016-03-15 | 2018-11-23 | 应用材料公司 | 用于气体流量比控制的方法与组件 |
Families Citing this family (111)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10511573B2 (en) | 1998-10-30 | 2019-12-17 | Virnetx, Inc. | Agile network protocol for secure communications using secure domain names |
US7418504B2 (en) | 1998-10-30 | 2008-08-26 | Virnetx, Inc. | Agile network protocol for secure communications using secure domain names |
US6839759B2 (en) | 1998-10-30 | 2005-01-04 | Science Applications International Corp. | Method for establishing secure communication link between computers of virtual private network without user entering any cryptographic information |
CA2723504C (en) * | 1998-10-30 | 2014-04-29 | Virnetx, Inc. | An agile network protocol for secure communications with assured system availability |
US6502135B1 (en) | 1998-10-30 | 2002-12-31 | Science Applications International Corporation | Agile network protocol for secure communications with assured system availability |
WO2002061179A1 (en) * | 2001-01-19 | 2002-08-08 | Tokyo Electron Limited | Method and apparatus for gas injection system with minimum particulate contamination |
CN100403198C (zh) | 2001-05-24 | 2008-07-16 | 迅捷公司 | 流体流量控制器和定比率控制流体流量的方法和装置 |
US6766260B2 (en) * | 2002-01-04 | 2004-07-20 | Mks Instruments, Inc. | Mass flow ratio system and method |
US7039999B2 (en) * | 2002-04-25 | 2006-05-09 | Tarr Adam L | Method for installation of semiconductor fabrication tools |
US7169231B2 (en) * | 2002-12-13 | 2007-01-30 | Lam Research Corporation | Gas distribution system with tuning gas |
US7534363B2 (en) | 2002-12-13 | 2009-05-19 | Lam Research Corporation | Method for providing uniform removal of organic material |
US20040168719A1 (en) * | 2003-02-28 | 2004-09-02 | Masahiro Nambu | System for dividing gas flow |
US6796332B1 (en) * | 2003-04-04 | 2004-09-28 | Texaco Inc | Fluid balance control system for use in a fuel processor |
WO2004109420A1 (ja) * | 2003-06-09 | 2004-12-16 | Ckd Corporation | 相対的圧力制御システム及び相対的流量制御システム |
JP4454964B2 (ja) * | 2003-06-09 | 2010-04-21 | 東京エレクトロン株式会社 | 分圧制御システム及び流量制御システム |
JP4331539B2 (ja) * | 2003-07-31 | 2009-09-16 | 株式会社フジキン | チャンバへのガス供給装置及びこれを用いたチャンバの内圧制御方法 |
US7201179B2 (en) * | 2003-09-23 | 2007-04-10 | Air Liquide Industrial U.S. Lp | Modular fluid supply system |
US20050075685A1 (en) * | 2003-10-02 | 2005-04-07 | Forsberg John W. | Medical device programmer with infrared communication |
JP4399227B2 (ja) * | 2003-10-06 | 2010-01-13 | 株式会社フジキン | チャンバの内圧制御装置及び内圧被制御式チャンバ |
JP4550507B2 (ja) * | 2004-07-26 | 2010-09-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
US7461549B1 (en) * | 2007-06-27 | 2008-12-09 | Mks Instruments, Inc. | Mass flow verifiers capable of providing different volumes, and related methods |
US7673645B2 (en) * | 2005-04-21 | 2010-03-09 | Mks Instruments, Inc. | Gas delivery method and system including a flow ratio controller using a multiple antisymmetric optimal control arrangement |
US7621290B2 (en) | 2005-04-21 | 2009-11-24 | Mks Instruments, Inc. | Gas delivery method and system including a flow ratio controller using antisymmetric optimal control |
US7394639B2 (en) * | 2005-07-08 | 2008-07-01 | Advanced Energy Industries, Inc. | System and method for driving an industrial control device |
US8776717B2 (en) * | 2005-10-11 | 2014-07-15 | Intermolecular, Inc. | Systems for discretized processing of regions of a substrate |
JP4788920B2 (ja) * | 2006-03-20 | 2011-10-05 | 日立金属株式会社 | 質量流量制御装置、その検定方法及び半導体製造装置 |
US8997791B2 (en) * | 2006-04-14 | 2015-04-07 | Mks Instruments, Inc. | Multiple-channel flow ratio controller |
JP2008039513A (ja) * | 2006-08-03 | 2008-02-21 | Hitachi Metals Ltd | 質量流量制御装置の流量制御補正方法 |
US7637143B2 (en) * | 2006-11-10 | 2009-12-29 | Tokyo Electron Limited | Substrate processing apparatus and analysis method therefor |
US9405298B2 (en) * | 2006-11-20 | 2016-08-02 | Applied Materials, Inc. | System and method to divide fluid flow in a predetermined ratio |
US8011317B2 (en) * | 2006-12-29 | 2011-09-06 | Intermolecular, Inc. | Advanced mixing system for integrated tool having site-isolated reactors |
US7706925B2 (en) * | 2007-01-10 | 2010-04-27 | Mks Instruments, Inc. | Integrated pressure and flow ratio control system |
US8424551B2 (en) * | 2007-01-30 | 2013-04-23 | Bradley University | Heat transfer apparatus and method |
US7846497B2 (en) * | 2007-02-26 | 2010-12-07 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a processing chamber |
US8074677B2 (en) * | 2007-02-26 | 2011-12-13 | Applied Materials, Inc. | Method and apparatus for controlling gas flow to a processing chamber |
US20080254217A1 (en) * | 2007-04-16 | 2008-10-16 | Boroson Michael L | Fine control of vaporized organic material |
US8387657B2 (en) * | 2007-06-15 | 2013-03-05 | Fisher Controls International, Llc | Methods and apparatus to determine a position of a valve |
JP5001757B2 (ja) * | 2007-08-31 | 2012-08-15 | シーケーディ株式会社 | 流体混合システム及び流体混合装置 |
US7621302B2 (en) * | 2007-09-28 | 2009-11-24 | Airgas, Inc. | Coriolis dosing system for filling gas cylinders |
JP5459895B2 (ja) * | 2007-10-15 | 2014-04-02 | Ckd株式会社 | ガス分流供給ユニット |
KR100951683B1 (ko) * | 2007-12-10 | 2010-04-07 | 주식회사 테라세미콘 | 소스가스 공급방법 |
KR101548399B1 (ko) * | 2007-12-27 | 2015-08-28 | 램 리써치 코포레이션 | 복수의 가스의 가스 혼합물을 제공하는 장치, 복수의 믹싱 매니폴드 출구 밸브를 제어하는 방법 및 이를 구현하기 위한 머신 판독가능 저장 매체 |
WO2009084422A1 (ja) * | 2007-12-27 | 2009-07-09 | Horiba Stec, Co., Ltd. | 流量比率制御装置 |
US20090178714A1 (en) | 2008-01-14 | 2009-07-16 | Tokyo Electron Limited | Flow control system and method for multizone gas distribution |
US20090236447A1 (en) * | 2008-03-21 | 2009-09-24 | Applied Materials, Inc. | Method and apparatus for controlling gas injection in process chamber |
US8205629B2 (en) * | 2008-04-25 | 2012-06-26 | Applied Materials, Inc. | Real time lead-line characterization for MFC flow verification |
CN102037423B (zh) * | 2008-05-21 | 2014-02-05 | 株式会社富士金 | 使用压力流量控制装置的流体非连续式流量切换控制方法 |
PL3812870T3 (pl) * | 2008-06-26 | 2023-02-13 | Belparts Group N.V. | System sterowania przepływem |
EP2313815B1 (en) * | 2008-08-13 | 2012-02-15 | Shell Internationale Research Maatschappij B.V. | Method for controlling a gas flow between a plurality of gas streams |
US20100084023A1 (en) * | 2008-10-07 | 2010-04-08 | Chris Melcer | Flow control module for a fluid delivery system |
SG176676A1 (en) | 2009-06-10 | 2012-01-30 | Advanced Tech Materials | Fluid processing systems and methods |
WO2011021539A1 (ja) * | 2009-08-20 | 2011-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置とプラズマ処理方法 |
US9127361B2 (en) * | 2009-12-07 | 2015-09-08 | Mks Instruments, Inc. | Methods of and apparatus for controlling pressure in multiple zones of a process tool |
US8397739B2 (en) | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
US8807112B2 (en) * | 2010-02-03 | 2014-08-19 | Achates Power, Inc. | Rolling thrust bearing constructions |
US20110186017A1 (en) * | 2010-02-03 | 2011-08-04 | Achates Power, Inc. | Single-crankshaft, opposed-piston engine constructions |
JP5562712B2 (ja) * | 2010-04-30 | 2014-07-30 | 東京エレクトロン株式会社 | 半導体製造装置用のガス供給装置 |
JP5514310B2 (ja) * | 2010-06-28 | 2014-06-04 | 東京エレクトロン株式会社 | プラズマ処理方法 |
US8905074B2 (en) * | 2010-10-22 | 2014-12-09 | Applied Materials, Inc. | Apparatus for controlling gas distribution using orifice ratio conductance control |
JP5528374B2 (ja) * | 2011-03-03 | 2014-06-25 | 東京エレクトロン株式会社 | ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置 |
JP6068462B2 (ja) | 2011-06-30 | 2017-01-25 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 高速ガス交換、高速ガス切換、及びプログラミング可能なガス送出のための方法及び装置 |
JP5739261B2 (ja) * | 2011-07-28 | 2015-06-24 | 株式会社堀場エステック | ガス供給システム |
US9958302B2 (en) | 2011-08-20 | 2018-05-01 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
US9188989B1 (en) | 2011-08-20 | 2015-11-17 | Daniel T. Mudd | Flow node to deliver process gas using a remote pressure measurement device |
US8849466B2 (en) | 2011-10-04 | 2014-09-30 | Mks Instruments, Inc. | Method of and apparatus for multiple channel flow ratio controller system |
US20130255784A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Gas delivery systems and methods of use thereof |
CN103591458B (zh) * | 2012-08-17 | 2017-04-12 | 诺发系统公司 | 气体分配网络中的流量平衡 |
US8925588B2 (en) | 2012-08-17 | 2015-01-06 | Novellus Systems, Inc. | Flow balancing in gas distribution networks |
US9004107B2 (en) * | 2012-08-21 | 2015-04-14 | Applied Materials, Inc. | Methods and apparatus for enhanced gas flow rate control |
US9781994B2 (en) * | 2012-12-07 | 2017-10-10 | Taiwan Semiconductor Manufacturing Company Limited | Wafer cleaning |
US9090972B2 (en) * | 2012-12-31 | 2015-07-28 | Lam Research Corporation | Gas supply systems for substrate processing chambers and methods therefor |
US20140230910A1 (en) * | 2013-02-20 | 2014-08-21 | Agilent Technologies, Inc. | Split-channel gas flow control |
JP6193679B2 (ja) * | 2013-08-30 | 2017-09-06 | 株式会社フジキン | ガス分流供給装置及びガス分流供給方法 |
JP6158111B2 (ja) * | 2014-02-12 | 2017-07-05 | 東京エレクトロン株式会社 | ガス供給方法及び半導体製造装置 |
CN104514759A (zh) * | 2014-12-30 | 2015-04-15 | 天津福云天翼科技有限公司 | 一种大流量分离式蓄能器组的恒定压力调节系统 |
US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
DE102015100762A1 (de) * | 2015-01-20 | 2016-07-21 | Infineon Technologies Ag | Behälterschalteinrichtung und Verfahren zum Überwachen einer Fluidrate |
JP6599471B2 (ja) | 2015-02-12 | 2019-10-30 | インテグリス・インコーポレーテッド | スマートパッケージ |
US10146233B2 (en) * | 2015-04-06 | 2018-12-04 | Horiba Stec, Co., Ltd. | Flow rate ratio control apparatus and program for flow rate ratio control apparatus |
US10957561B2 (en) * | 2015-07-30 | 2021-03-23 | Lam Research Corporation | Gas delivery system |
US10261523B2 (en) * | 2015-08-17 | 2019-04-16 | Rainboxx, Inc. | Apparatus and method for controlling irrigation process by sending encoded acoustical messages along irrigation conduit |
US10825659B2 (en) | 2016-01-07 | 2020-11-03 | Lam Research Corporation | Substrate processing chamber including multiple gas injection points and dual injector |
US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US10699878B2 (en) | 2016-02-12 | 2020-06-30 | Lam Research Corporation | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
US10438833B2 (en) | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US20190047840A1 (en) * | 2016-02-23 | 2019-02-14 | Electro Controles Del Noroeste S.A. De C.V. | Modular fluid-dosing system and its processes |
US10269600B2 (en) * | 2016-03-15 | 2019-04-23 | Applied Materials, Inc. | Methods and assemblies for gas flow ratio control |
US10838437B2 (en) | 2018-02-22 | 2020-11-17 | Ichor Systems, Inc. | Apparatus for splitting flow of process gas and method of operating same |
US10303189B2 (en) | 2016-06-30 | 2019-05-28 | Reno Technologies, Inc. | Flow control system, method, and apparatus |
US10679880B2 (en) | 2016-09-27 | 2020-06-09 | Ichor Systems, Inc. | Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same |
US11144075B2 (en) | 2016-06-30 | 2021-10-12 | Ichor Systems, Inc. | Flow control system, method, and apparatus |
US10410832B2 (en) | 2016-08-19 | 2019-09-10 | Lam Research Corporation | Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment |
CN106730545B (zh) * | 2016-12-26 | 2020-05-19 | 威特龙消防安全集团股份公司 | 细水雾灭火系统添加剂计量注入系统 |
US10663337B2 (en) | 2016-12-30 | 2020-05-26 | Ichor Systems, Inc. | Apparatus for controlling flow and method of calibrating same |
JP6914063B2 (ja) * | 2017-03-10 | 2021-08-04 | 株式会社堀場エステック | ガス制御システム、該ガス制御システムを備えた成膜装置、該ガス制御システムに用いるプログラム及びガス制御方法。 |
US10656662B2 (en) * | 2017-09-15 | 2020-05-19 | Kabushiki Kaisha Toshiba | Variable pressure device and actuator |
JP7027151B2 (ja) | 2017-12-13 | 2022-03-01 | 株式会社堀場エステック | 濃度制御装置、ガス制御システム、成膜装置、濃度制御方法、及び濃度制御装置用プログラム |
US10591934B2 (en) * | 2018-03-09 | 2020-03-17 | Lam Research Corporation | Mass flow controller for substrate processing |
JP7031093B2 (ja) * | 2018-03-30 | 2022-03-08 | 三機工業株式会社 | 供給システムおよび供給システムの制御方法 |
TWI821281B (zh) * | 2018-04-28 | 2023-11-11 | 美商應用材料股份有限公司 | 基於氣體脈衝的共享前驅物分佈系統及其使用方法 |
JP7024740B2 (ja) * | 2019-01-16 | 2022-02-24 | 株式会社デンソー | 半導体製造装置 |
JP7281285B2 (ja) * | 2019-01-28 | 2023-05-25 | 株式会社堀場エステック | 濃度制御装置、及び、ゼロ点調整方法、濃度制御装置用プログラム |
KR20210139347A (ko) * | 2019-04-25 | 2021-11-22 | 가부시키가이샤 후지킨 | 유량 제어 장치 |
US20220387949A1 (en) * | 2019-11-19 | 2022-12-08 | Linde Gmbh | Smart gas mixer |
JP2021179739A (ja) * | 2020-05-12 | 2021-11-18 | 株式会社堀場エステック | 流量比率制御システム、成膜システム、異常診断方法、及び異常診断プログラム |
CN111913504B (zh) * | 2020-08-17 | 2023-10-20 | 中国地质大学(北京) | 一种恒定流量分流装置 |
US12068135B2 (en) * | 2021-02-12 | 2024-08-20 | Applied Materials, Inc. | Fast gas exchange apparatus, system, and method |
WO2022186971A1 (en) | 2021-03-03 | 2022-09-09 | Ichor Systems, Inc. | Fluid flow control system comprising a manifold assembly |
US11940307B2 (en) | 2021-06-08 | 2024-03-26 | Mks Instruments, Inc. | Methods and apparatus for pressure based mass flow ratio control |
US12000723B2 (en) | 2022-02-18 | 2024-06-04 | Mks Instruments, Inc. | Method and apparatus for pressure based mass flow control |
US11940819B1 (en) * | 2023-01-20 | 2024-03-26 | Applied Materials, Inc. | Mass flow controller based fast gas exchange |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369031A (en) * | 1981-09-15 | 1983-01-18 | Thermco Products Corporation | Gas control system for chemical vapor deposition system |
US5453124A (en) * | 1992-12-30 | 1995-09-26 | Texas Instruments Incorporated | Programmable multizone gas injector for single-wafer semiconductor processing equipment |
US5865205A (en) * | 1997-04-17 | 1999-02-02 | Applied Materials, Inc. | Dynamic gas flow controller |
WO2000031602A1 (de) * | 1998-11-20 | 2000-06-02 | Sepiatec Gmbh | Verfahren und vorrichtung zur regelung einzelner teilströme eines fördersystems für fluide medien |
CN1275217A (zh) * | 1998-08-24 | 2000-11-29 | 株式会社富士金 | 流体可变式流量控制装置 |
US6210482B1 (en) * | 1999-04-22 | 2001-04-03 | Fujikin Incorporated | Apparatus for feeding gases for use in semiconductor manufacturing |
Family Cites Families (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2676603A (en) * | 1946-04-12 | 1954-04-27 | Kollsman Paul | Fluid flow divider |
DE2517957C2 (de) * | 1975-04-23 | 1977-05-12 | Norddeutsche Affinerie | Verfahren zur unabhaengigen gemisch- und leistungseinstellung bei vielbrenner-schachtoefen zum schmelzen von metallen |
DE2915983C2 (de) * | 1979-04-20 | 1983-03-31 | Klöckner Ionon GmbH, 5000 Köln | Verfahren zum Erzeugen eines Gasgemisches |
US4396031A (en) * | 1981-01-07 | 1983-08-02 | Conoco Inc. | Method for restricting uncontrolled fluid flow through a pipe |
JPS58151614A (ja) * | 1982-03-04 | 1983-09-08 | Mitsubishi Electric Corp | 流量制御装置 |
US4949670A (en) | 1988-11-04 | 1990-08-21 | Tegal Corporation | Method and apparatus for low pressure plasma |
US5031674A (en) | 1989-03-03 | 1991-07-16 | Eaton Corporation | Fluid flow control method and apparatus for minimizing particle contamination |
US5240046A (en) | 1989-03-03 | 1993-08-31 | Eaton Corporation | Fluid flow control method and apparatus for minimizing particle contamination |
US5134965A (en) | 1989-06-16 | 1992-08-04 | Hitachi, Ltd. | Processing apparatus and method for plasma processing |
US5013398A (en) | 1990-05-29 | 1991-05-07 | Micron Technology, Inc. | Anisotropic etch method for a sandwich structure |
US5062446A (en) * | 1991-01-07 | 1991-11-05 | Sematech, Inc. | Intelligent mass flow controller |
US5165450A (en) | 1991-12-23 | 1992-11-24 | Texaco Inc. | Means for separating a fluid stream into two separate streams |
JP2894658B2 (ja) | 1992-01-17 | 1999-05-24 | 株式会社東芝 | ドライエッチング方法およびその装置 |
US5307833A (en) | 1992-10-26 | 1994-05-03 | Texaco Inc. | Method and apparatus for automatically transferring and measuring wet steam between priority and secondary users |
US5997950A (en) | 1992-12-22 | 1999-12-07 | Applied Materials, Inc. | Substrate having uniform tungsten silicide film and method of manufacture |
JPH06205935A (ja) | 1992-12-25 | 1994-07-26 | Toshiba Corp | 脱硝制御装置 |
US5916369A (en) | 1995-06-07 | 1999-06-29 | Applied Materials, Inc. | Gas inlets for wafer processing chamber |
US5647945A (en) | 1993-08-25 | 1997-07-15 | Tokyo Electron Limited | Vacuum processing apparatus |
US5614055A (en) | 1993-08-27 | 1997-03-25 | Applied Materials, Inc. | High density plasma CVD and etching reactor |
US5522934A (en) | 1994-04-26 | 1996-06-04 | Tokyo Electron Limited | Plasma processing apparatus using vertical gas inlets one on top of another |
US5736457A (en) | 1994-12-09 | 1998-04-07 | Sematech | Method of making a damascene metallization |
JP2837112B2 (ja) | 1995-06-09 | 1998-12-14 | 株式会社平井 | 音速ノズルを用いた質量流量制御方法および装置 |
US5702530A (en) | 1995-06-23 | 1997-12-30 | Applied Materials, Inc. | Distributed microwave plasma reactor for semiconductor processing |
IT1275825B1 (it) | 1995-10-30 | 1997-10-17 | Nuovo Pignone Spa | Sistema perfezionato per la misura e la regolazione della portata massica di gas |
US5772771A (en) | 1995-12-13 | 1998-06-30 | Applied Materials, Inc. | Deposition chamber for improved deposition thickness uniformity |
US5761606A (en) * | 1996-02-08 | 1998-06-02 | Wolzien; Thomas R. | Media online services access via address embedded in video or audio program |
US5774664A (en) * | 1996-03-08 | 1998-06-30 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
US6018768A (en) * | 1996-03-08 | 2000-01-25 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
US5778181A (en) * | 1996-03-08 | 1998-07-07 | Actv, Inc. | Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments |
US5662143A (en) | 1996-05-16 | 1997-09-02 | Gasonics International | Modular gas box system |
US6013155A (en) | 1996-06-28 | 2000-01-11 | Lam Research Corporation | Gas injection system for plasma processing |
US6083569A (en) | 1996-10-25 | 2000-07-04 | Applied Materials, Inc. | Discharging a wafer after a plasma process for dielectric deposition |
US5911834A (en) | 1996-11-18 | 1999-06-15 | Applied Materials, Inc. | Gas delivery system |
US6294026B1 (en) | 1996-11-26 | 2001-09-25 | Siemens Aktiengesellschaft | Distribution plate for a reaction chamber with multiple gas inlets and separate mass flow control loops |
US6321782B1 (en) * | 1997-01-08 | 2001-11-27 | Ronald Hollister | Apparatus for controlling the flow of fluids |
US6190233B1 (en) | 1997-02-20 | 2001-02-20 | Applied Materials, Inc. | Method and apparatus for improving gap-fill capability using chemical and physical etchbacks |
US5843239A (en) | 1997-03-03 | 1998-12-01 | Applied Materials, Inc. | Two-step process for cleaning a substrate processing chamber |
US6125859A (en) | 1997-03-05 | 2000-10-03 | Applied Materials, Inc. | Method for improved cleaning of substrate processing systems |
US6042687A (en) | 1997-06-30 | 2000-03-28 | Lam Research Corporation | Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing |
JP3317209B2 (ja) | 1997-08-12 | 2002-08-26 | 東京エレクトロンエイ・ティー株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JPH11303758A (ja) | 1998-04-17 | 1999-11-02 | Nissan Motor Co Ltd | 電動ポンプの制御装置 |
US6217937B1 (en) | 1998-07-15 | 2001-04-17 | Cornell Research Foundation, Inc. | High throughput OMVPE apparatus |
US6217659B1 (en) | 1998-10-16 | 2001-04-17 | Air Products And Chemical, Inc. | Dynamic blending gas delivery system and method |
EP2028577A2 (en) * | 1999-04-16 | 2009-02-25 | Fujikin Incorporated | Parallel bypass type fluid feeding device, and method and device for controlling fluid variable type pressure system flow rate used for the device |
JP2000306884A (ja) | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | プラズマ処理装置およびプラズマ処理方法 |
US6343617B1 (en) * | 1999-07-09 | 2002-02-05 | Millipore Corporation | System and method of operation of a digital mass flow controller |
US6389364B1 (en) * | 1999-07-10 | 2002-05-14 | Mykrolis Corporation | System and method for a digital mass flow controller |
US6581623B1 (en) * | 1999-07-16 | 2003-06-24 | Advanced Technology Materials, Inc. | Auto-switching gas delivery system utilizing sub-atmospheric pressure gas supply vessels |
JP2002110570A (ja) | 2000-10-04 | 2002-04-12 | Asm Japan Kk | 半導体製造装置用ガスラインシステム |
US6333272B1 (en) | 2000-10-06 | 2001-12-25 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
US6631334B2 (en) * | 2000-12-26 | 2003-10-07 | Mks Instruments, Inc. | Pressure-based mass flow controller system |
US6418954B1 (en) * | 2001-04-17 | 2002-07-16 | Mks Instruments, Inc. | System and method for dividing flow |
CN100403198C (zh) * | 2001-05-24 | 2008-07-16 | 迅捷公司 | 流体流量控制器和定比率控制流体流量的方法和装置 |
US6766260B2 (en) | 2002-01-04 | 2004-07-20 | Mks Instruments, Inc. | Mass flow ratio system and method |
US6913652B2 (en) * | 2002-06-17 | 2005-07-05 | Applied Materials, Inc. | Gas flow division in a wafer processing system having multiple chambers |
US7169231B2 (en) * | 2002-12-13 | 2007-01-30 | Lam Research Corporation | Gas distribution system with tuning gas |
-
2002
- 2002-05-23 CN CNB028104846A patent/CN100403198C/zh not_active Expired - Fee Related
- 2002-05-23 WO PCT/US2002/016289 patent/WO2002095519A1/en active Application Filing
- 2002-05-23 US US10/154,433 patent/US6752166B2/en not_active Expired - Lifetime
- 2002-05-23 JP JP2002591927A patent/JP4209688B2/ja not_active Expired - Fee Related
- 2002-05-23 EP EP02739349A patent/EP1399789A1/en not_active Withdrawn
- 2002-05-23 KR KR10-2003-7014994A patent/KR20040019293A/ko not_active Application Discontinuation
- 2002-05-24 TW TW91111088A patent/TW573240B/zh not_active IP Right Cessation
-
2004
- 2004-04-27 US US10/832,949 patent/US6941965B2/en not_active Expired - Lifetime
-
2005
- 2005-07-05 US US11/174,753 patent/US7143774B2/en not_active Expired - Lifetime
-
2006
- 2006-08-15 US US11/504,175 patent/US7424894B2/en not_active Expired - Lifetime
-
2007
- 2007-01-09 US US11/651,231 patent/US7360551B2/en not_active Expired - Fee Related
-
2008
- 2008-02-07 JP JP2008027627A patent/JP2008198203A/ja active Pending
- 2008-02-07 JP JP2008027621A patent/JP2008217779A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369031A (en) * | 1981-09-15 | 1983-01-18 | Thermco Products Corporation | Gas control system for chemical vapor deposition system |
US5453124A (en) * | 1992-12-30 | 1995-09-26 | Texas Instruments Incorporated | Programmable multizone gas injector for single-wafer semiconductor processing equipment |
US5865205A (en) * | 1997-04-17 | 1999-02-02 | Applied Materials, Inc. | Dynamic gas flow controller |
CN1275217A (zh) * | 1998-08-24 | 2000-11-29 | 株式会社富士金 | 流体可变式流量控制装置 |
WO2000031602A1 (de) * | 1998-11-20 | 2000-06-02 | Sepiatec Gmbh | Verfahren und vorrichtung zur regelung einzelner teilströme eines fördersystems für fluide medien |
US6210482B1 (en) * | 1999-04-22 | 2001-04-03 | Fujikin Incorporated | Apparatus for feeding gases for use in semiconductor manufacturing |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104460706A (zh) * | 2013-09-12 | 2015-03-25 | 朗姆研究公司 | 群集的质量流装置和包含该装置的多管线质量流装置 |
CN104460706B (zh) * | 2013-09-12 | 2020-01-07 | 朗姆研究公司 | 群集的质量流装置和包含该装置的多管线质量流装置 |
CN108886001A (zh) * | 2016-03-15 | 2018-11-23 | 应用材料公司 | 用于气体流量比控制的方法与组件 |
CN108886001B (zh) * | 2016-03-15 | 2022-05-31 | 应用材料公司 | 用于气体流量比控制的方法与组件 |
Also Published As
Publication number | Publication date |
---|---|
US20060272703A1 (en) | 2006-12-07 |
US20050241698A1 (en) | 2005-11-03 |
JP2008198203A (ja) | 2008-08-28 |
WO2002095519A1 (en) | 2002-11-28 |
EP1399789A1 (en) | 2004-03-24 |
CN1533523A (zh) | 2004-09-29 |
US7424894B2 (en) | 2008-09-16 |
JP4209688B2 (ja) | 2009-01-14 |
US6752166B2 (en) | 2004-06-22 |
US7360551B2 (en) | 2008-04-22 |
KR20040019293A (ko) | 2004-03-05 |
JP2008217779A (ja) | 2008-09-18 |
US7143774B2 (en) | 2006-12-05 |
US20040200529A1 (en) | 2004-10-14 |
TW573240B (en) | 2004-01-21 |
US20020179148A1 (en) | 2002-12-05 |
JP2004527856A (ja) | 2004-09-09 |
US6941965B2 (en) | 2005-09-13 |
US20070107783A1 (en) | 2007-05-17 |
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