CN1328770C - 半导体封装件及其制备方法 - Google Patents

半导体封装件及其制备方法 Download PDF

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Publication number
CN1328770C
CN1328770C CNB038155664A CN03815566A CN1328770C CN 1328770 C CN1328770 C CN 1328770C CN B038155664 A CNB038155664 A CN B038155664A CN 03815566 A CN03815566 A CN 03815566A CN 1328770 C CN1328770 C CN 1328770C
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CN
China
Prior art keywords
silicone
semiconductor package
sio
component
cured silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038155664A
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English (en)
Chinese (zh)
Other versions
CN1666326A (zh
Inventor
S·丹特
L·拉尔森
R·尼尔森
D·索里兹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of CN1666326A publication Critical patent/CN1666326A/zh
Application granted granted Critical
Publication of CN1328770C publication Critical patent/CN1328770C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB038155664A 2002-05-16 2003-03-19 半导体封装件及其制备方法 Expired - Fee Related CN1328770C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/068,755 US6940177B2 (en) 2002-05-16 2002-05-16 Semiconductor package and method of preparing same
US10/068,755 2002-05-16

Publications (2)

Publication Number Publication Date
CN1666326A CN1666326A (zh) 2005-09-07
CN1328770C true CN1328770C (zh) 2007-07-25

Family

ID=29418266

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038155664A Expired - Fee Related CN1328770C (zh) 2002-05-16 2003-03-19 半导体封装件及其制备方法

Country Status (9)

Country Link
US (1) US6940177B2 (https=)
EP (1) EP1504469B1 (https=)
JP (1) JP4773089B2 (https=)
CN (1) CN1328770C (https=)
AT (1) ATE347737T1 (https=)
AU (1) AU2003230678A1 (https=)
DE (1) DE60310222T2 (https=)
TW (1) TWI265578B (https=)
WO (1) WO2003098682A1 (https=)

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US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6284563B1 (en) 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US20040102022A1 (en) * 2002-11-22 2004-05-27 Tongbi Jiang Methods of fabricating integrated circuitry
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
CN100481415C (zh) * 2004-03-12 2009-04-22 联华电子股份有限公司 芯片封装体及其制造方法
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
JP4741230B2 (ja) * 2004-12-28 2011-08-03 東レ・ダウコーニング株式会社 フィルム状シリコーンゴム接着剤
WO2006091793A1 (en) 2005-02-25 2006-08-31 Tessera, Inc. Microelectronic assemblies having compliancy
US7695819B2 (en) * 2005-09-30 2010-04-13 Wacker Chemical Corporation Two piece curable HCR silicone elastomers
JP4993555B2 (ja) * 2005-12-07 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物
TWI296037B (en) * 2006-04-28 2008-04-21 Delta Electronics Inc Light emitting apparatus
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
CN100580914C (zh) * 2007-02-16 2010-01-13 南茂科技股份有限公司 封装导电结构及其形成方法
US20080308932A1 (en) * 2007-06-12 2008-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structures
US7772691B2 (en) * 2007-10-12 2010-08-10 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced wafer level package
CN101945950A (zh) * 2008-01-17 2011-01-12 陶氏康宁公司 含硅氧烷的成膜组合物
EP2449031B1 (en) 2009-07-03 2014-06-04 Dow Corning Corporation Film forming, silicone containing compositions
US8421226B2 (en) * 2010-02-25 2013-04-16 Infineon Technologies Ag Device including an encapsulated semiconductor chip and manufacturing method thereof
JP5384443B2 (ja) * 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP6300218B2 (ja) 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
TWI575684B (zh) * 2011-06-13 2017-03-21 矽品精密工業股份有限公司 晶片尺寸封裝件
JP2013095809A (ja) * 2011-10-31 2013-05-20 Nitto Denko Corp シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。
JP5563695B2 (ja) * 2013-04-17 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
TW201601358A (zh) * 2014-06-19 2016-01-01 道康寧公司 用於晶圓級ｚ軸熱中介層的可光圖案化聚矽氧
JP6203986B2 (ja) * 2015-05-27 2017-09-27 京セラ株式会社 太陽電池素子およびその製造方法
US9812414B1 (en) 2016-06-17 2017-11-07 Nanya Technology Corporation Chip package and a manufacturing method thereof
US11518883B2 (en) 2016-12-30 2022-12-06 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
CN108165014A (zh) * 2017-12-23 2018-06-15 苏州赛源微电子有限公司 一种集成电路芯片的封装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0714125A2 (en) * 1994-11-24 1996-05-29 Dow Corning Toray Silicone Company Limited Semiconductor device and fabrication method
EP0802234A2 (en) * 1996-04-19 1997-10-22 Dow Corning Toray Silicone Company, Limited Silicone die attach adhesive and method for fabrication of semiconductor devices
CN1244038A (zh) * 1998-08-04 2000-02-09 长兴化学工业股份有限公司 半导体封装用树脂组合物
WO2000041231A1 (en) * 1999-01-07 2000-07-13 Alliedsignal, Inc. Dielectric films from organohydridosiloxane resins

Family Cites Families (8)

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US5171716A (en) 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US6103552A (en) 1998-08-10 2000-08-15 Lin; Mou-Shiung Wafer scale packaging scheme
US6239378B1 (en) * 1999-02-02 2001-05-29 Dow Corning Corporation Flame resistant silicone rubber wire and cable coating composition
US6197613B1 (en) 1999-03-23 2001-03-06 Industrial Technology Research Institute Wafer level packaging method and devices formed
US6369185B1 (en) * 1999-03-31 2002-04-09 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition, cured products formed therefrom and unified articles
US6277669B1 (en) 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
EP1375553A4 (en) * 2001-01-25 2009-07-29 Sanyo Chemical Ind Ltd HARDENABLE RESIN, HARD RESISTANT RESIN, HARDENABLE FILM AND ISOLATOR

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0714125A2 (en) * 1994-11-24 1996-05-29 Dow Corning Toray Silicone Company Limited Semiconductor device and fabrication method
EP0802234A2 (en) * 1996-04-19 1997-10-22 Dow Corning Toray Silicone Company, Limited Silicone die attach adhesive and method for fabrication of semiconductor devices
CN1244038A (zh) * 1998-08-04 2000-02-09 长兴化学工业股份有限公司 半导体封装用树脂组合物
WO2000041231A1 (en) * 1999-01-07 2000-07-13 Alliedsignal, Inc. Dielectric films from organohydridosiloxane resins
CN1342328A (zh) * 1999-01-07 2002-03-27 联合讯号公司 有机氢化硅氧烷树脂介电膜

Also Published As

Publication number Publication date
WO2003098682A1 (en) 2003-11-27
CN1666326A (zh) 2005-09-07
EP1504469B1 (en) 2006-12-06
EP1504469A1 (en) 2005-02-09
ATE347737T1 (de) 2006-12-15
TWI265578B (en) 2006-11-01
TW200308030A (en) 2003-12-16
DE60310222D1 (de) 2007-01-18
US20030214051A1 (en) 2003-11-20
AU2003230678A1 (en) 2003-12-02
DE60310222T2 (de) 2007-09-13
JP2005526398A (ja) 2005-09-02
US6940177B2 (en) 2005-09-06
JP4773089B2 (ja) 2011-09-14

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Granted publication date: 20070725

Termination date: 20160319