TWI265578B - Semiconductor package and method of preparing same - Google Patents

Semiconductor package and method of preparing same

Info

Publication number
TWI265578B
TWI265578B TW092107882A TW92107882A TWI265578B TW I265578 B TWI265578 B TW I265578B TW 092107882 A TW092107882 A TW 092107882A TW 92107882 A TW92107882 A TW 92107882A TW I265578 B TWI265578 B TW I265578B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
silicone member
preparing same
integrated circuit
active surface
Prior art date
Application number
TW092107882A
Other languages
English (en)
Chinese (zh)
Other versions
TW200308030A (en
Inventor
Stanton Dent
Lyndon Larson
Robert Nelson
Debra Soliz
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Publication of TW200308030A publication Critical patent/TW200308030A/zh
Application granted granted Critical
Publication of TWI265578B publication Critical patent/TWI265578B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW092107882A 2002-05-16 2003-04-07 Semiconductor package and method of preparing same TWI265578B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/068,755 US6940177B2 (en) 2002-05-16 2002-05-16 Semiconductor package and method of preparing same

Publications (2)

Publication Number Publication Date
TW200308030A TW200308030A (en) 2003-12-16
TWI265578B true TWI265578B (en) 2006-11-01

Family

ID=29418266

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092107882A TWI265578B (en) 2002-05-16 2003-04-07 Semiconductor package and method of preparing same

Country Status (9)

Country Link
US (1) US6940177B2 (https=)
EP (1) EP1504469B1 (https=)
JP (1) JP4773089B2 (https=)
CN (1) CN1328770C (https=)
AT (1) ATE347737T1 (https=)
AU (1) AU2003230678A1 (https=)
DE (1) DE60310222T2 (https=)
TW (1) TWI265578B (https=)
WO (1) WO2003098682A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293387B2 (en) 2010-07-28 2016-03-22 Nitto Denko Corporation Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

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US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6284563B1 (en) 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US20040102022A1 (en) * 2002-11-22 2004-05-27 Tongbi Jiang Methods of fabricating integrated circuitry
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
CN100481415C (zh) * 2004-03-12 2009-04-22 联华电子股份有限公司 芯片封装体及其制造方法
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
JP4741230B2 (ja) * 2004-12-28 2011-08-03 東レ・ダウコーニング株式会社 フィルム状シリコーンゴム接着剤
WO2006091793A1 (en) 2005-02-25 2006-08-31 Tessera, Inc. Microelectronic assemblies having compliancy
US7695819B2 (en) * 2005-09-30 2010-04-13 Wacker Chemical Corporation Two piece curable HCR silicone elastomers
JP4993555B2 (ja) * 2005-12-07 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物
TWI296037B (en) * 2006-04-28 2008-04-21 Delta Electronics Inc Light emitting apparatus
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
CN100580914C (zh) * 2007-02-16 2010-01-13 南茂科技股份有限公司 封装导电结构及其形成方法
US20080308932A1 (en) * 2007-06-12 2008-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structures
US7772691B2 (en) * 2007-10-12 2010-08-10 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced wafer level package
CN101945950A (zh) * 2008-01-17 2011-01-12 陶氏康宁公司 含硅氧烷的成膜组合物
EP2449031B1 (en) 2009-07-03 2014-06-04 Dow Corning Corporation Film forming, silicone containing compositions
US8421226B2 (en) * 2010-02-25 2013-04-16 Infineon Technologies Ag Device including an encapsulated semiconductor chip and manufacturing method thereof
JP6300218B2 (ja) 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
TWI575684B (zh) * 2011-06-13 2017-03-21 矽品精密工業股份有限公司 晶片尺寸封裝件
JP2013095809A (ja) * 2011-10-31 2013-05-20 Nitto Denko Corp シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。
JP5563695B2 (ja) * 2013-04-17 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
TW201601358A (zh) * 2014-06-19 2016-01-01 道康寧公司 用於晶圓級ｚ軸熱中介層的可光圖案化聚矽氧
JP6203986B2 (ja) * 2015-05-27 2017-09-27 京セラ株式会社 太陽電池素子およびその製造方法
US9812414B1 (en) 2016-06-17 2017-11-07 Nanya Technology Corporation Chip package and a manufacturing method thereof
US11518883B2 (en) 2016-12-30 2022-12-06 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
CN108165014A (zh) * 2017-12-23 2018-06-15 苏州赛源微电子有限公司 一种集成电路芯片的封装方法

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US5171716A (en) 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
US5907190A (en) * 1994-11-24 1999-05-25 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having a cured silicone coating with non uniformly dispersed filler
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
JPH09286971A (ja) * 1996-04-19 1997-11-04 Toray Dow Corning Silicone Co Ltd シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置
CN1244038A (zh) * 1998-08-04 2000-02-09 长兴化学工业股份有限公司 半导体封装用树脂组合物
US6103552A (en) 1998-08-10 2000-08-15 Lin; Mou-Shiung Wafer scale packaging scheme
AU2497600A (en) * 1999-01-07 2000-07-24 Allied-Signal Inc. Dielectric films from organohydridosiloxane resins
US6239378B1 (en) * 1999-02-02 2001-05-29 Dow Corning Corporation Flame resistant silicone rubber wire and cable coating composition
US6197613B1 (en) 1999-03-23 2001-03-06 Industrial Technology Research Institute Wafer level packaging method and devices formed
US6369185B1 (en) * 1999-03-31 2002-04-09 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition, cured products formed therefrom and unified articles
US6277669B1 (en) 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
EP1375553A4 (en) * 2001-01-25 2009-07-29 Sanyo Chemical Ind Ltd HARDENABLE RESIN, HARD RESISTANT RESIN, HARDENABLE FILM AND ISOLATOR

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293387B2 (en) 2010-07-28 2016-03-22 Nitto Denko Corporation Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Also Published As

Publication number Publication date
WO2003098682A1 (en) 2003-11-27
CN1666326A (zh) 2005-09-07
EP1504469B1 (en) 2006-12-06
EP1504469A1 (en) 2005-02-09
ATE347737T1 (de) 2006-12-15
TW200308030A (en) 2003-12-16
DE60310222D1 (de) 2007-01-18
US20030214051A1 (en) 2003-11-20
AU2003230678A1 (en) 2003-12-02
DE60310222T2 (de) 2007-09-13
JP2005526398A (ja) 2005-09-02
CN1328770C (zh) 2007-07-25
US6940177B2 (en) 2005-09-06
JP4773089B2 (ja) 2011-09-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees