CN1311548C - 具有改进的散热能力的半导体器件封装 - Google Patents

具有改进的散热能力的半导体器件封装 Download PDF

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Publication number
CN1311548C
CN1311548C CNB028201590A CN02820159A CN1311548C CN 1311548 C CN1311548 C CN 1311548C CN B028201590 A CNB028201590 A CN B028201590A CN 02820159 A CN02820159 A CN 02820159A CN 1311548 C CN1311548 C CN 1311548C
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CN
China
Prior art keywords
connecting plate
semiconductor device
plate part
main surface
chip
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Expired - Fee Related
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CNB028201590A
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English (en)
Chinese (zh)
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CN1568541A (zh
Inventor
查尔斯S·卡特韦尔
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Infineon Science And Technology Americas
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International Rectifier Corp USA
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    • H10W70/20—
    • H10W40/22—
    • H10W40/778—
    • H10W72/30—
    • H10W74/129—
    • H10W40/257—
    • H10W72/20—
    • H10W72/29—
    • H10W72/325—
    • H10W72/352—
    • H10W72/856—
    • H10W72/877—
    • H10W72/90—
    • H10W72/926—
    • H10W72/952—
    • H10W74/00—
    • H10W74/141—
    • H10W76/17—
    • H10W90/736—

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB028201590A 2001-10-10 2002-10-09 具有改进的散热能力的半导体器件封装 Expired - Fee Related CN1311548C (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US32836201P 2001-10-10 2001-10-10
US60/328,362 2001-10-10
US10/267,142 US6784540B2 (en) 2001-10-10 2002-10-08 Semiconductor device package with improved cooling
US10/267,142 2002-10-08
PCT/US2002/032678 WO2003032388A1 (en) 2001-10-10 2002-10-09 Semiconductor device package with improved cooling

Publications (2)

Publication Number Publication Date
CN1568541A CN1568541A (zh) 2005-01-19
CN1311548C true CN1311548C (zh) 2007-04-18

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Family Applications (1)

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CNB028201590A Expired - Fee Related CN1311548C (zh) 2001-10-10 2002-10-09 具有改进的散热能力的半导体器件封装

Country Status (5)

Country Link
US (2) US6784540B2 (OSRAM)
JP (1) JP4195380B2 (OSRAM)
CN (1) CN1311548C (OSRAM)
TW (1) TW574749B (OSRAM)
WO (1) WO2003032388A1 (OSRAM)

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US7014093B2 (en) * 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US7527090B2 (en) * 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
US7098082B2 (en) * 2004-04-13 2006-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectronics package assembly tool and method of manufacture therewith
US7678680B2 (en) * 2004-06-03 2010-03-16 International Rectifier Corporation Semiconductor device with reduced contact resistance
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US8421214B2 (en) 2007-10-10 2013-04-16 Vishay General Semiconductor Llc Semiconductor device and method for manufacturing a semiconductor device
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JP5343574B2 (ja) * 2009-01-20 2013-11-13 トヨタ自動車株式会社 ヒートシンクのろう付け方法
US8222078B2 (en) * 2009-07-22 2012-07-17 Alpha And Omega Semiconductor Incorporated Chip scale surface mounted semiconductor device package and process of manufacture
US8213180B2 (en) * 2010-01-21 2012-07-03 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
US8362606B2 (en) 2010-07-29 2013-01-29 Alpha & Omega Semiconductor, Inc. Wafer level chip scale package
JP5511621B2 (ja) * 2010-10-13 2014-06-04 三菱電機株式会社 半導体装置
US20120175688A1 (en) * 2011-01-10 2012-07-12 International Rectifier Corporation Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging
US8536697B2 (en) * 2011-11-30 2013-09-17 Freescale Semiconductor, Inc. Packaged die for heat dissipation and method therefor
EP2894954B1 (en) * 2013-12-06 2021-08-11 Marchesi Metal Technology (Suzhou) Co., Ltd Heat dissipation housing structure connected to heat dissipation fin
US9536800B2 (en) 2013-12-07 2017-01-03 Fairchild Semiconductor Corporation Packaged semiconductor devices and methods of manufacturing
CN107346348A (zh) * 2016-05-06 2017-11-14 上海海拉电子有限公司 一种电子助力转向系统的散热效率计算方法
DE102018201326B4 (de) * 2018-01-29 2022-06-15 Vitesco Technologies Germany Gmbh Kontaktanordnung, elektronisches Leistungsmodul und Verfahren zur Herstellung eines elektronischen Leistungsmoduls

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Also Published As

Publication number Publication date
US20030067071A1 (en) 2003-04-10
JP2005506691A (ja) 2005-03-03
CN1568541A (zh) 2005-01-19
US6784540B2 (en) 2004-08-31
USRE41559E1 (en) 2010-08-24
TW574749B (en) 2004-02-01
WO2003032388A1 (en) 2003-04-17
JP4195380B2 (ja) 2008-12-10

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