CN1711639A - 折叠的柔性无接合引线的多芯片功率封装 - Google Patents
折叠的柔性无接合引线的多芯片功率封装 Download PDFInfo
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- CN1711639A CN1711639A CNA2003801030201A CN200380103020A CN1711639A CN 1711639 A CN1711639 A CN 1711639A CN A2003801030201 A CNA2003801030201 A CN A2003801030201A CN 200380103020 A CN200380103020 A CN 200380103020A CN 1711639 A CN1711639 A CN 1711639A
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- 230000000712 assembly Effects 0.000 claims description 17
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- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
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- 239000002356 single layer Substances 0.000 abstract description 2
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- 241001133184 Colletotrichum agaves Species 0.000 description 4
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- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
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- 229910052737 gold Inorganic materials 0.000 description 1
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- 238000001746 injection moulding Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00015—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/294,011 | 2002-11-12 | ||
US10/294,011 US6731000B1 (en) | 2002-11-12 | 2002-11-12 | Folded-flex bondwire-less multichip power package |
PCT/IB2003/004950 WO2004044985A2 (en) | 2002-11-12 | 2003-11-03 | Folded-flex bondwire-less multichip power package |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1711639A true CN1711639A (zh) | 2005-12-21 |
CN1711639B CN1711639B (zh) | 2010-10-13 |
Family
ID=32176188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2003801030201A Expired - Lifetime CN1711639B (zh) | 2002-11-12 | 2003-11-03 | 折叠的柔性无接合引线的多芯片功率封装 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6731000B1 (zh) |
EP (1) | EP1563540A2 (zh) |
JP (1) | JP2006505945A (zh) |
CN (1) | CN1711639B (zh) |
AU (1) | AU2003274583A1 (zh) |
WO (1) | WO2004044985A2 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101919033B (zh) * | 2008-01-22 | 2011-11-23 | Nxp股份有限公司 | 制造包括至少一个微电子器件在内的微电子封装的方法 |
CN101582403B (zh) * | 2008-05-15 | 2012-04-04 | 捷敏服务公司 | 以夹在金属层之间的倒装管芯为特征的半导体封装 |
CN102448277A (zh) * | 2011-10-13 | 2012-05-09 | 烽火通信科技股份有限公司 | 通信设备单板上多个xfp光模块的散热装置 |
CN113299564A (zh) * | 2021-05-21 | 2021-08-24 | 广东佛智芯微电子技术研究有限公司 | 一种板级扇出柔性封装基板的封装结构及其制备方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005235825A (ja) * | 2004-02-17 | 2005-09-02 | Renesas Technology Corp | 電子回路モジュール |
US7868468B2 (en) | 2004-11-12 | 2011-01-11 | Stats Chippac Ltd. | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates |
US7675166B2 (en) * | 2005-05-11 | 2010-03-09 | Maxim Integrated Products, Inc. | Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection |
US7768075B2 (en) * | 2006-04-06 | 2010-08-03 | Fairchild Semiconductor Corporation | Semiconductor die packages using thin dies and metal substrates |
JP5165214B2 (ja) * | 2006-06-26 | 2013-03-21 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
US7816778B2 (en) * | 2007-02-20 | 2010-10-19 | Micron Technology, Inc. | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same |
US9093360B2 (en) | 2013-01-11 | 2015-07-28 | Analog Devices, Inc. | Compact device package |
US9363071B2 (en) | 2013-03-07 | 2016-06-07 | Qualcomm Incorporated | Circuit to recover a clock signal from multiple wire data signals that changes state every state cycle and is immune to data inter-lane skew as well as data state transition glitches |
US9374216B2 (en) | 2013-03-20 | 2016-06-21 | Qualcomm Incorporated | Multi-wire open-drain link with data symbol transition based clocking |
US9755818B2 (en) | 2013-10-03 | 2017-09-05 | Qualcomm Incorporated | Method to enhance MIPI D-PHY link rate with minimal PHY changes and no protocol changes |
US9203599B2 (en) | 2014-04-10 | 2015-12-01 | Qualcomm Incorporated | Multi-lane N-factorial (N!) and other multi-wire communication systems |
US9735948B2 (en) | 2013-10-03 | 2017-08-15 | Qualcomm Incorporated | Multi-lane N-factorial (N!) and other multi-wire communication systems |
EP3114792B1 (en) * | 2014-03-06 | 2021-06-09 | Qualcomm Incorporated | Clock recovery circuit for multiple wire data signals |
US9332940B1 (en) | 2015-01-05 | 2016-05-10 | Analog Devices, Inc. | Compact wearable biological sensor modules |
WO2018164628A1 (en) * | 2017-03-10 | 2018-09-13 | Fingerprint Cards Ab | Fingerprint sensor module comprising a fingerprint sensor device and a substrate connected to the sensor device |
EP4063878A1 (en) | 2021-03-25 | 2022-09-28 | Nxp B.V. | Integrated circuit and associated method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3105089B2 (ja) * | 1992-09-11 | 2000-10-30 | 株式会社東芝 | 半導体装置 |
US5637922A (en) * | 1994-02-07 | 1997-06-10 | General Electric Company | Wireless radio frequency power semiconductor devices using high density interconnect |
US6121676A (en) * | 1996-12-13 | 2000-09-19 | Tessera, Inc. | Stacked microelectronic assembly and method therefor |
JPH10189855A (ja) * | 1996-12-17 | 1998-07-21 | Samsung Aerospace Ind Ltd | マルチチップパッケージ用のリードフレーム及びその製造方法 |
US6208521B1 (en) * | 1997-05-19 | 2001-03-27 | Nitto Denko Corporation | Film carrier and laminate type mounting structure using same |
US6300679B1 (en) * | 1998-06-01 | 2001-10-09 | Semiconductor Components Industries, Llc | Flexible substrate for packaging a semiconductor component |
JP3186700B2 (ja) * | 1998-06-24 | 2001-07-11 | 日本電気株式会社 | 半導体装置及びその製造方法 |
US6486544B1 (en) * | 1998-09-09 | 2002-11-26 | Seiko Epson Corporation | Semiconductor device and method manufacturing the same, circuit board, and electronic instrument |
US6111761A (en) * | 1999-08-23 | 2000-08-29 | Motorola, Inc. | Electronic assembly |
CN1297252A (zh) * | 1999-11-22 | 2001-05-30 | 沈明东 | 多芯片模组装置及其制造方法 |
JP2001308260A (ja) * | 2000-04-25 | 2001-11-02 | Seiko Epson Corp | 半導体装置 |
US6590282B1 (en) * | 2002-04-12 | 2003-07-08 | Industrial Technology Research Institute | Stacked semiconductor package formed on a substrate and method for fabrication |
-
2002
- 2002-11-12 US US10/294,011 patent/US6731000B1/en not_active Expired - Lifetime
-
2003
- 2003-11-03 AU AU2003274583A patent/AU2003274583A1/en not_active Abandoned
- 2003-11-03 JP JP2004550895A patent/JP2006505945A/ja active Pending
- 2003-11-03 CN CN2003801030201A patent/CN1711639B/zh not_active Expired - Lifetime
- 2003-11-03 EP EP03758558A patent/EP1563540A2/en not_active Withdrawn
- 2003-11-03 WO PCT/IB2003/004950 patent/WO2004044985A2/en active Application Filing
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101919033B (zh) * | 2008-01-22 | 2011-11-23 | Nxp股份有限公司 | 制造包括至少一个微电子器件在内的微电子封装的方法 |
CN101582403B (zh) * | 2008-05-15 | 2012-04-04 | 捷敏服务公司 | 以夹在金属层之间的倒装管芯为特征的半导体封装 |
CN102448277A (zh) * | 2011-10-13 | 2012-05-09 | 烽火通信科技股份有限公司 | 通信设备单板上多个xfp光模块的散热装置 |
CN113299564A (zh) * | 2021-05-21 | 2021-08-24 | 广东佛智芯微电子技术研究有限公司 | 一种板级扇出柔性封装基板的封装结构及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2004044985A3 (en) | 2004-07-22 |
US6731000B1 (en) | 2004-05-04 |
WO2004044985A2 (en) | 2004-05-27 |
AU2003274583A1 (en) | 2004-06-03 |
EP1563540A2 (en) | 2005-08-17 |
CN1711639B (zh) | 2010-10-13 |
US20040089933A1 (en) | 2004-05-13 |
JP2006505945A (ja) | 2006-02-16 |
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