CN1574308A - 热方面增强的部件基片 - Google Patents
热方面增强的部件基片 Download PDFInfo
- Publication number
- CN1574308A CN1574308A CNA2004100493170A CN200410049317A CN1574308A CN 1574308 A CN1574308 A CN 1574308A CN A2004100493170 A CNA2004100493170 A CN A2004100493170A CN 200410049317 A CN200410049317 A CN 200410049317A CN 1574308 A CN1574308 A CN 1574308A
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- China
- Prior art keywords
- die pad
- pad areas
- heat
- substrate
- conduction
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/459,140 US7109573B2 (en) | 2003-06-10 | 2003-06-10 | Thermally enhanced component substrate |
US10/459140 | 2003-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574308A true CN1574308A (zh) | 2005-02-02 |
CN100375272C CN100375272C (zh) | 2008-03-12 |
Family
ID=33299663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100493170A Expired - Fee Related CN100375272C (zh) | 2003-06-10 | 2004-06-10 | 热方面增强的部件基片 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7109573B2 (zh) |
EP (1) | EP1487017A3 (zh) |
CN (1) | CN100375272C (zh) |
HK (1) | HK1073926A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011103731A1 (zh) * | 2010-02-25 | 2011-09-01 | 中兴通讯股份有限公司 | 一种无线通讯模块和一种封装方法 |
TWI419272B (zh) * | 2009-12-19 | 2013-12-11 | Bridge Semiconductor Corp | 具有凸柱/基座之散熱座及訊號凸柱之半導體晶片組體 |
CN109075133A (zh) * | 2016-04-25 | 2018-12-21 | 京瓷株式会社 | 电子部件搭载用基板、电子装置以及电子模块 |
Families Citing this family (14)
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JP2004071670A (ja) * | 2002-08-02 | 2004-03-04 | Fuji Photo Film Co Ltd | Icパッケージ、接続構造、および電子機器 |
WO2006132151A1 (ja) * | 2005-06-06 | 2006-12-14 | Rohm Co., Ltd. | インタポーザおよび半導体装置 |
US7679201B2 (en) * | 2005-12-20 | 2010-03-16 | Intel Corporation | Device package |
JP5096683B2 (ja) * | 2006-03-03 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7479692B2 (en) * | 2006-11-09 | 2009-01-20 | Stats Chippac Ltd. | Integrated circuit package system with heat sink |
KR101340512B1 (ko) * | 2006-12-01 | 2013-12-12 | 삼성디스플레이 주식회사 | 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리 |
US20080142956A1 (en) * | 2006-12-19 | 2008-06-19 | Cambou Bertrand F | Stress management in BGA packaging |
KR100798895B1 (ko) * | 2006-12-21 | 2008-01-29 | 주식회사 실리콘웍스 | 방열패턴을 구비하는 반도체 집적회로 |
US8269336B2 (en) * | 2008-03-25 | 2012-09-18 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and signal post |
US7787252B2 (en) * | 2008-12-04 | 2010-08-31 | Lsi Corporation | Preferentially cooled electronic device |
KR101665556B1 (ko) * | 2009-11-19 | 2016-10-13 | 삼성전자 주식회사 | 멀티 피치 볼 랜드를 갖는 반도체 패키지 |
US8963320B2 (en) | 2011-10-07 | 2015-02-24 | Stats Chippac Ltd. | Integrated circuit packaging system with thermal structures and method of manufacture thereof |
US9554453B2 (en) * | 2013-02-26 | 2017-01-24 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
JP2015211204A (ja) * | 2014-04-30 | 2015-11-24 | イビデン株式会社 | 回路基板及びその製造方法 |
Family Cites Families (15)
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US5097593A (en) * | 1988-12-16 | 1992-03-24 | International Business Machines Corporation | Method of forming a hybrid printed circuit board |
US5027191A (en) | 1989-05-11 | 1991-06-25 | Westinghouse Electric Corp. | Cavity-down chip carrier with pad grid array |
EP0405330A3 (en) * | 1989-06-29 | 1992-05-06 | Motorola, Inc. | Flagless leadframe, package and method |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US6347037B2 (en) * | 1994-04-28 | 2002-02-12 | Fujitsu Limited | Semiconductor device and method of forming the same |
JP3034180B2 (ja) * | 1994-04-28 | 2000-04-17 | 富士通株式会社 | 半導体装置及びその製造方法及び基板 |
JPH1154658A (ja) * | 1997-07-30 | 1999-02-26 | Hitachi Ltd | 半導体装置及びその製造方法並びにフレーム構造体 |
KR100244965B1 (ko) * | 1997-08-12 | 2000-02-15 | 윤종용 | 인쇄회로기판과 볼 그리드 어레이 패키지의 제조 방법 |
JP3063846B2 (ja) * | 1998-04-28 | 2000-07-12 | 日本電気株式会社 | 半導体装置 |
JP2000243876A (ja) * | 1999-02-23 | 2000-09-08 | Fujitsu Ltd | 半導体装置とその製造方法 |
TW456013B (en) | 2000-07-04 | 2001-09-21 | Advanced Semiconductor Eng | Heat spreader substrate structure and the process thereof |
TW462121B (en) * | 2000-09-19 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Heat sink type ball grid array package |
US6867493B2 (en) * | 2000-11-15 | 2005-03-15 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
KR20020074073A (ko) * | 2001-03-16 | 2002-09-28 | 엘지전자 주식회사 | 아이씨 방열구조 |
JP2003051511A (ja) * | 2001-08-03 | 2003-02-21 | Hitachi Ltd | 半導体装置及びその製造方法 |
-
2003
- 2003-06-10 US US10/459,140 patent/US7109573B2/en not_active Expired - Lifetime
-
2004
- 2004-06-04 EP EP20040102546 patent/EP1487017A3/en not_active Withdrawn
- 2004-06-10 CN CNB2004100493170A patent/CN100375272C/zh not_active Expired - Fee Related
-
2005
- 2005-07-25 HK HK05106334A patent/HK1073926A1/xx not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI419272B (zh) * | 2009-12-19 | 2013-12-11 | Bridge Semiconductor Corp | 具有凸柱/基座之散熱座及訊號凸柱之半導體晶片組體 |
WO2011103731A1 (zh) * | 2010-02-25 | 2011-09-01 | 中兴通讯股份有限公司 | 一种无线通讯模块和一种封装方法 |
CN109075133A (zh) * | 2016-04-25 | 2018-12-21 | 京瓷株式会社 | 电子部件搭载用基板、电子装置以及电子模块 |
CN109075133B (zh) * | 2016-04-25 | 2022-08-09 | 京瓷株式会社 | 电子部件搭载用基板、电子装置以及电子模块 |
Also Published As
Publication number | Publication date |
---|---|
EP1487017A3 (en) | 2009-07-08 |
US20040253767A1 (en) | 2004-12-16 |
CN100375272C (zh) | 2008-03-12 |
HK1073926A1 (en) | 2005-10-21 |
EP1487017A2 (en) | 2004-12-15 |
US7109573B2 (en) | 2006-09-19 |
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