CN1574308A - 热方面增强的部件基片 - Google Patents

热方面增强的部件基片 Download PDF

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CN1574308A
CN1574308A CNA2004100493170A CN200410049317A CN1574308A CN 1574308 A CN1574308 A CN 1574308A CN A2004100493170 A CNA2004100493170 A CN A2004100493170A CN 200410049317 A CN200410049317 A CN 200410049317A CN 1574308 A CN1574308 A CN 1574308A
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die pad
pad areas
heat
substrate
conduction
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CN100375272C (zh
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J·T·努尔米宁
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Nokia Technologies Oy
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Abstract

一种IC(集成电路)封装件,其使用导热和导电的突出部来排散热能。IC封装件包括具有管芯焊盘区域的基片材料,该管芯焊盘区域适于支撑集成电路。多个焊球焊盘设置在基片材料的第一表面上,且多个传导突出部从管芯焊盘区域向外辐射,且延伸以便覆盖相应的选定的焊球焊盘,以有助于热能从管芯焊盘区域排散到基片和/或印刷线路板。

Description

热方面增强的部件基片
技术领域
本发明总体上涉及从管芯焊盘排散热能(热量)。更具体的,本发明涉及热方面增强的基片,其降低了电路封装的热阻,且将散热和导电性集成到特殊的管脚。
背景技术
为了更加有效地使用印刷线路板(PWB)和印刷电路板(PCB)上的区域,半导体芯片制造商已经从诸如针栅阵列(“PGA”)和周边引线的方平封装(“QFP”)之类的较大的、更加麻烦的互连技术转变为更小的组件,诸如球栅阵列(“BGA”)。使用BGA技术,半导体芯片通常使用焊接连接来互连到它们的支撑基片。然而,焊接柱通常设计为相对短,以维持焊接结构的完整性,其降低了弹性特性,导致:由于芯片的热膨胀系数(“CTE”)相对于支撑基片的CTE之间的差异从而使得对焊接破裂的敏感性增加。这样,当芯片在使用期间变热时,芯片和基片都膨胀;当去除了热量时,芯片和基片都收缩。芯片CTE和基片CTE之间的差别会导致灾难性的变形。
因此,排散由集成电路(IC)的工作产生的热量的能力是电子行业的主要的设计关心点。这被强调了,因为近年来在IC器件上的电路的密度已经相当大地增加了,且这些高密度的电路的可靠性和性能受热环境的影响。此外,尺寸考虑要求增加数量的电子封装安装到很小的空间中,其也大大地增加了有效地排散来自IC封装的热量的需要。由于半导体芯片的部件继续减小尺寸,封装到给定区域中芯片的数量将更大,且由每个这些芯片排散的热量将对上述的热不匹配问题产生更大的影响。
此外,IC器件日益用于高功率应用。虽然很多早期的IC芯片在几瓦以下工作,但是IC正在被设计为大约在10瓦工作,其极大地增加了发热,以及有效地散热的需要。
在一些传统的半导体封装中,由通常安装在基片的管芯焊盘上的半导体芯片或者集成电路(IC)产生的热量通过两个途径放出。第一个途径是通过封装的外部连接端子,第二个途径是通过封装的表面。为了更加有效地散热,散热器可以接附到封装件上。在包括通过用塑料树脂模制半导体芯片形成的封装树脂的球栅阵列(BGA)封装中,散热器可以直接接附到封装的封装树脂上。这样,从芯片产生的热量经由封装件传导到散热器,且通过对流排散到外部。
解决散热问题的其它方法包括在管芯区域下增加额外的热球。然而,该方法要求修改封装设计,和可能的布线改变,以及PWB或者PCB设计的可能修改。另一个方法是修改封装类型和/或减小所需的功率。由于这些方法要求改变主要的设计,所以它们是不令人满意的。
Bourdelaise等人在美国专利No.5027191中公开了一种使用具有焊盘栅格阵列的腔在下面(cavitydown)芯片的芯片座组件。在芯片座内的IC芯片靠着与芯片接附到PWB相对的表面安装,这样来自IC芯片的热量沿着较短通道出现到散热器,以允许更大的传热率。由于通常在IC芯片的顶部表面上要求的,以允许结合线从芯片延伸到围绕芯片的连接焊盘的小间隙,所以传热率的改进仍然相当有限。在IC芯片和用作散热器的平的热焊盘之间的小间隙极大地降低了传热率。
Huang等人在美国专利No.6525942中公开了一种散热球栅阵列(BGA)封装。该散热BGA封装包括多个形成在由芯片覆盖的区域中的基片的下面上的第一热球焊盘。BGA封装还包括在第一热球焊盘外部的多个第二热球焊盘或者散热环。在第二热球焊盘或者散热环外部形成多个信号球焊盘。第二热球焊盘或者散热环通过传导线连接到第一热球焊盘。多个第一热球接附到各自的第一热球焊盘,且信号球接附到各自的信号球焊盘。第一热球和信号球与印刷电路板上的相应触点接触。多个第二热球接附到各自的第二热球焊盘或者散热环的表面。Huang公开的散热是有限的,因为管芯焊盘只通过这些通路将热能传导到第一和第二热球。
Chao等人在美国专利No.6483187中公开了一种热扩散基片,其包括金属热扩散器,其具有带有适于支撑管芯的腔的表面。该表面还包括设置在腔外围的地环、围绕地环的外围的基片支撑表面、设置在基片支撑表面的外围的多个地焊盘,以及设置在基片支撑表面上且从其突出的多个地焊盘。基片还具有多个通孔、多个安装焊盘和多个球焊盘。Chao公开了在金属热扩散器的一个表面上执行厚度降低过程,以减小该表面上的该区域部分的厚度。通过冲压过程,或者通过多重光刻和半蚀刻来实现厚度减小过程。改变热扩散器的厚度来散热的一个缺点在于,其要求特殊的制造步骤来生产需要的热扩散器形状。
由于上述的限制和困难,在IC封装技术的领域中仍然需要解决这些困难和限制。尤其是,该领域中需要为高功率IC提供改进的散热,同时增加封装件的集成性。
发明内容
根据这些教示的优选实施例,克服了前述的和其它问题,且实现了其它优点。
因此,本发明的一个实施例涉及集成电路封装件及其制造方法。该封装件包括基片材料和管芯焊盘区域,该管芯焊盘区域具有适于安装集成电路的尺寸。多个导热和导电的球焊盘设置在基片材料的第一表面上位于管芯焊盘区域外部,且多个通路设置在相关的球焊盘上。这些通路提供从基片材料的第一表面到基片材料的第二表面的导热性和导电性。多个导电和导热的突出部从管芯焊盘区域向外辐射,这样每个突出部覆盖一个相关的球焊盘,且每个突出部通过一个或者多个通路使热能从基片材料的第一表面传导到基片材料的第二表面,以及还将电信号传导到相关的球焊盘。
本发明的另一个实施例涉及集成电路封装件以及上述的方法,以及还包括设置在基片材料的第二表面或者底部表面上且在管芯焊盘区域外部的多个热球。一个或者多个热球与相关的通路热接触,且热球传导电信号。
本发明还有一个实施例涉及集成电路封装件和如上述的方法,其还包括印刷线路板,基片安装在该印刷线路板上。热能通过热球从管芯焊盘区域排散到印刷线路板。
附图说明
当结合附图阅读时,这些教义的前述的和其它方面在下面的优选实施例的详细描述更加明显,其中:
图1示出了安装在印刷电路板上的IC封装;
图2从焊球侧示出了传统的基片;
图3从上部侧示出了传统的基片;
图4从焊球侧示出了根据本发明的基片;
图5从上部侧示出了根据本发明的基片;
图6示出了从管芯焊盘到PWB的传热通道的侧视图;
图7示出了本发明的热球在传热通道下面的侧视图;以及
图8-13示出了本发明的在管芯焊盘区域中的典型的传导层结构。
具体实施方式
对于集成电路封装和MCM部件,本发明解决了以下的需要,即,通过将热和电功能集成到相同的管脚中且扩展封装的热有效区域从而使得从管芯到印刷电路板(PCB)的热阻最小化。本发明在需要从管芯到焊球的增强的热通道的应用中特别有用,尤其是在管芯(die)和焊球之间不重叠的应用中特别有用,例如,在BGA(球栅阵列)封装件中没有中心焊球的外围管脚(例如,Tessera uBGA、STLF-和TFBGA等)。
本发明将热和电功能集成到相同的管脚中。尤其是,与管芯不重叠的I/O管脚可以通过使用管脚和管芯下面之间的诸如铜之类的导热元件热连接到管芯。管脚可以在管芯下面,或者其可以是外围管脚。中心热球也可以具有电学功能。这样,本发明的一个特征在于信号通道可以用于散热,即,导热。
通过使用多个从管芯区域延伸的传导元件或者突出部,管芯的小区域可以扩展,这样,导热区域变得更宽,且降低了封装件的整体热阻。传导元件的形状和尺寸是设计选择的因素。传导元件或者突出部的特殊尺寸是具体应用的函数,且受诸如电路参数、部件材料和环境之类的因素的影响。
本发明的一些优点包括:封装件具有更好的热性能;更便宜和更小的封装尺寸,由于不需要额外的热球;更容易布线和在PWB(印刷线路板)中更宽的线/空间,其降低了PWB的成本;没有增加制造工作或者材料的成本;降低了管芯收缩的热效果;封装件的热阻减小;增加的封装件功率;增加的封装件可靠性;当管芯收缩时,不需要改变封装件;不需要PWB重新设计;较小的热敏感性;牢固的组装;以及较低的总体成本。
在本发明中,当形成基片的铜表面时,导热元件集成在部件中。通过使管芯区域下面的信号焊盘/布线延伸到焊球焊盘来产生热通道。热通路将热量直接传导到焊球和PWB。本发明可以与单层和/或多层基片一起使用。
环氧涂层/阻焊涂层可以用来隔离管芯和信号之间的电接触。
图1示出了IC(集成电路)封装件10,其包括基片102和IC芯片106。IC封装件10通常通过互连件118(a)...(n)从而安装在PCB或者PWB120上,其中n是与IC封装件10的设计相称的任何合适的数字。
IC芯片106通常通过适于将IC芯片106粘附到基片102的管芯焊盘区域的环氧树脂或者树脂从而安装在基片102上。优选的是,用于将芯片106粘附到基片102的材料具有可接受的导热特性。导线108(a)...(n)(其中n是任何合适的数字)将IC芯片106的部分电连接到选定的一个焊球焊盘114(a)...(n)上,其中n是任何合适的数字。焊球可以安装在相应的焊球焊盘上,以将导线108电连接到另一个位置。基片102具有第一表面102(a)(面向芯片的表面)和第二表面102(b)(面向PWB的表面)。
图2从焊球侧或者面向PWB的表面102(b)示出了传统的基片的视图20。基片102具有安装在表面102(b)上的管芯焊盘区域123。焊球焊盘114(a)...(n),总体为114,支撑相关的导热焊球142(a),该焊球排散热能。相应的通路、通孔或者孔126(a)通过为热能提供穿过基片材料102的通道来促进热能(热量)的排散。该发明的一个实施例为,每个焊球焊盘114可以具有相应的焊球和通路,或者焊球焊盘在其上可以没有焊球。如图2所示,管芯焊盘123通过热绝缘材料146与焊球焊盘114热绝缘,从而与焊球142热绝缘。这种设计降低了去除由安装在管芯焊盘区域123上的IC芯片产生的热能(热量)的效率。
图3从面向芯片侧示出了传统的基片102的视图30。基片102具有上表面102(a),其上安装有管芯焊盘区域122。其中还示出了焊球焊盘115和电路线144。通路、通孔或者孔126使得热能可以传导通过基片102。
图4从焊球侧示出了根据本发明的基片的视图40。基片102具有面向PWB的表面102(b),其具有第一区域133和第二区域135。第一区域133包括管芯焊盘区域123和第一组导热元件111(a)...(n),其中n是任何数字。管芯焊盘区域123适于在其上支撑IC芯片。第一组导热元件(总体为111)可以是例如焊球焊盘或者金属表面区域。导热元件111适于连接到焊球,用于散热或者信号传送。可以作为焊球焊盘或者金属表面区域的第一焊球焊盘111和第二导热元件113(a)...(n)可以设置在面向PWB的表面102(b)上,其中n是任何合适的数字。
可以使用焊接掩模来使得焊球焊盘表面暴露,或者焊球焊盘111、113可以通过化学沉积、蚀刻、冲压或者其它技术来沉积在表面102(b)上。第一焊球焊盘111位于管芯焊盘区域123附近,其表示为区域133,且第二焊球焊盘113(a)...(n)(总体为113)位于进一步远离管芯焊盘区域处,在由135表示的区域中。通常,没有示出的焊球安装在球焊盘111、113的表面上。
管芯焊盘安装区域123设置在表面102(b)的第一区域133中。诸如铜之类的导热和导电材料设置在基片上。导热和导电材料包括导体或者指状部或花瓣状部125(a)...(n),其中n是任何合适的数字,其从管芯焊盘区域延伸或者辐射,以包括选定的导热元件或者焊球焊盘。选定的导热元件通常是第一导热元件111。每个导热和导电材料的花瓣状部或者指状部通常与第一组导热元件中的特定一个相关联(即,花瓣状部125(a)接触导热元件111(a),花瓣状部125(b)接触导热元件111(b)等)。
导热和导电材料125通常通过蚀刻、冲压、光致抗蚀剂、化学汽相沉积或者其它技术形成。通常,多个第一焊球焊盘111与导体125接触,这里将导体125描述为指状部、花瓣状部和延伸部。这样,导热花瓣状部125为热能提供通道,以便热量从管芯焊盘区域123排散到焊球焊盘111。虽然传导指状部125(a)接触相应的导热元件111(a),传导指状部125(b)接触导热元件111(b)是本发明的一个实施例,但是对于花瓣状部125,使用其它设计和形状以便经过基片102排散热量也在本发明的范围内。本发明的优点在于,电信号通道也用作导热通道,以便将热能从管芯焊盘区域排散或者传送到基片和/或PWB。
导热花瓣状部125的尺寸通常是封装件结构的函数,且可以具有多种形状。导热花瓣状部125可以向外扩开,并且在焊球焊盘111附近比在管芯焊盘区域的中心处更宽。
焊球可以用于与印刷电路板上的触点连接,从而形成电连接或者导热接点。焊球通常由包括铅-锡合金或者铜或者基于铜的合金的材料制成。第一热球可以接附到相应的第一热球焊盘上,这里也称为导热元件或者球焊盘111,并接附到印刷电路板上的相应的触点上。除了将由管芯焊盘区域123上的芯片产生的热量传递离开管芯焊盘区域到达印刷电路板之外,焊球还形成印刷电路板和IC芯片之间的电连接,其用作接地连接或者功率点连接。信号球也可以接附到球焊盘111上和印刷电路板上的相应的触点上,从而形成用于信号传送的电连接,该信号诸如输入/输出信号。
通路或者通孔128(a)...(n)设置在导体或者花瓣状部125上,且提供通道,以便热能和电流通过基片102,其中n是任何合适的数字。通常,每个通路128与相应的花瓣状部相关联(即,花瓣状部125(a)具有通路128(a)等)。表示为130(a)...(n)的另外的或者第二通路或者通孔设置在基片102的第二区域135上。通常,每个第二通路130与第二组导热元件或者球焊盘113中的相应的一个相关联(即,传导元件113(a)具有通路130(a)等)。球焊盘113与球焊盘111相区别,这是因为球焊盘111与传导突出部相关联,而球焊盘113不与传导突出部相关联。
绝缘部件141(a)...(n)使花瓣状部125相互电绝缘和热绝缘,其中n是任何合适的数字。绝缘材料141可以通过掩模层诸如光致抗蚀剂或者将绝缘材料沉积在基片材料的期望的区域上的其它沉积技术来施加。中心设置的热球138可以定位在管芯焊盘区域123上,以分别为热能(热量)和电流提供热通道和传导通道。
图5从顶部侧示出了根据本发明的基片102的视图50。表面102(a)具有管芯焊盘区域122,其具有指状部或者花瓣状部或者导体124(a)...(n)(总体为124)从管芯焊盘区域122辐射开,以便每个指状部或者花瓣状部124接触第一组导热元件110(a)...(n)中的相应的一个,(这里也称为焊球焊盘、热球焊盘或者热焊盘)。(在图5中显示的管芯焊盘区域122是在表面102(a)上的管芯焊盘,且尺寸上类似于如图4所示的表面102(b)的管芯焊盘区域123。此外,在图5中显示的花瓣状部124可以具有类似于在图4中显示的花瓣状部125的尺寸。)花瓣状部124强化了从管芯焊盘区域122到焊球焊盘110的散热。
第二组导热元件(这里也称为焊球焊盘、球焊盘、热球焊盘或者热球)112(a)...(n)位于第二区域134中,其在第一区域132外部。导热元件112可以用来支撑用于导热或者导电的焊球。其中也示出了用于传导电流的电路线或者图案线144。基片102通常具有层压的绝缘层。绝缘层可以由玻璃环氧树脂(FR-4、FR-5)、双马来酰亚胺-三嗪(BT)或者环氧树脂形成。图案线层可以通过沉积诸如铜、镍、银、镍钯合金或者它们的合金之类的传导材料来形成。或者,图案线层可以根据设计因素来通过诸如光刻、蚀刻、镀或者其它化学工艺之类的技术来形成。
绝缘材料形成花瓣状部或者指状部124之间的绝缘区域140(a)...(n),从而使得花瓣状部124相互热绝缘和电绝缘。尤其是,如图5所示,绝缘指状部140(a)使导体124(a)与导体124(b)隔离,绝缘指状部140(b)使导体124(b)与导体124(c)隔离等。
通路或者通孔130(a)...(n)也在图5中显示。这些通路130从表面102(a)延伸到表面102(b),如图4所示。
图6示出了从管芯焊盘到PWB的传热通道的侧视图60。基片602具有下部表面或者第二表面602(b)。芯片606通过粘合剂603安装在管芯焊盘区域623上。粘合剂603可以是例如胶、环氧树脂、树脂或者任何合适的粘合材料,其将芯片606粘合到管芯焊盘区域623上。互连件608(a)和608(b)显示为导线,然而,可以使用其它连接装置来将芯片606的区域分别连接到热焊盘上或者焊球焊盘611(a)和611(b)上。通路626(a)...(n)提供从相关的焊盘611到通常设置在下部表面602(b)上的热球643(a)...(n)之一的热和电通道,其中n是任何合适的数字。焊球643(a)...(n)通过使用相关的粘合部位或者焊盘631(a)...(n)来安装在PWB629上。通常显示为625的导热突出部提供从管芯焊盘区域623到焊盘611的热和电路径。
图7示出了从管芯焊盘区域623到PWB629的传热通道的侧视图70。图7类似于图6,然而,图7示出了位于管芯焊盘区域623下面的额外的热球653(a)和653(b)。相关的通路627(a)和627(b)提供从管芯焊盘区域623到热球653的热传递通道。尽管只显示了两个热球653(a)和653(b)及其相关的通路627(a)和627(b),但是可以使用任何合适的数量的热球。在图7中显示的其它元件已经参考图6描述。图7示出了基片上的在管芯焊盘区域下面的区域。
图8-13以在管芯焊盘区域中的典型的传导层结构来示出了本发明。这些传导层结构是本发明的替代的实施例。传导材料和绝缘材料之间的关系是设计和应用要求的函数。
图8示出了视图80,其包括具有管芯焊盘区域833和第二区域835的基片802,该第二区域835在管芯焊盘区域833之外。第一热焊盘,或者焊球焊盘,或者传导元件,总体为811,与花瓣状部或者突出部或者指状部825(a)...(n)热和电接触。花瓣状部或者指状部,总体为825,由绝缘材料841(a)...(n)相互分开。绝缘隔离物842使传导材料826的内部部分与外部部分指状部或者花瓣状部825隔离。第二热焊盘通常显示为813。这些热焊盘在第二区域835中,且不与花瓣状部825接触。
图9示出了本发明的视图90。图9示出了传导突出部或者花瓣状部825,其包括部分825(a)...(n)。还有位于管芯焊盘区域中的传导部分826。传导部分826由绝缘材料842分离。绝缘材料841和842产生传导材料825和826的部分的期望的结构。还示出了热焊盘811和813,以及分别示出了第一和第二区域833和835。
图10-13分别示出了传导花瓣状部或者指状部825和内部部分826以及绝缘材料841和842的替代的结构1000、1100、1200和1300。其它元件已经参考图8和9描述。
虽然已经根据“芯片在上面”的结构描述了本发明,但是在“倒装芯片”或者芯片在下面的结构中利用散热技术也是本发明的实施例。此外,该芯片可以由环氧树脂或者树脂封装。
虽然本文中描述了IC封装,但是应该理解,这些教义在需要散热的其它类型的封装中也具有适用性。此外,应该认识到,上述的教示是典型的,且不应该解释为对本发明的实行的限制。

Claims (18)

1.一种集成电路封装件,其包括:
具有第一表面和第二表面的基片材料;
管芯焊盘区域,其具有适于在其上安装集成电路的尺寸;
设置在基片材料的第一表面上位于管芯焊盘区域外部的多个导热和导电的信号元件,
多个通路,一个或者多个该通路连接到相关的信号元件上,该一个或者多个通路提供从该基片材料的该第一表面到该基片材料的该第二表面的导热性和导电性;以及
多个导电和导热的突出部,其从该管芯焊盘区域向外辐射,每个突出部连接到相关的信号元件上,
其中,多个该突出部中的每一个将热能从该管芯焊盘区域传导到多个信号元件中的至少一个。
2.如权利要求1所述的设备,其特征在于,其还包括:
设置在该基片材料的第二表面上且在该管芯焊盘区域外部的多个信号球,一个或者多个信号球与多个通路中的相关一个通路热接触,且一个或者多个信号球适于传导热能。
3.如权利要求2所述的设备,其特征在于:多个通路中的选定的通路位于该管芯焊盘区域的外部。
4.如权利要求2所述的设备,其特征在于,其还包括:
印刷线路板,
其中,该基片安装在该印刷线路板上,热能通过信号球从管芯焊盘区域排散到印刷线路板。
5.如权利要求1所述的设备,其特征在于,其还包括设置在管芯焊盘区域上的集成电路。
6.如权利要求1所述的设备,其特征在于,其还包括:
设置在管芯焊盘区域上位于一位置处的中心导热元件。
7.如权利要求6所述的设备,其特征在于:该中心导热元件适于传导电流。
8.如权利要求1所述的设备,其特征在于:多个所述突出部相互电绝缘。
9.如权利要求1所述的设备,其特征在于:多个所述突出部包括导热和导电材料。
10.一种用于从管芯焊盘排散热能的方法,其包括的步骤为:
提供具有第一表面和第二表面的基片材料;
提供管芯焊盘区域,其具有适于在其上安装集成电路的尺寸;
提供设置在该基片材料的该第一表面上位于该管芯焊盘区域外部的多个导热和导电的信号元件,
提供多个通路,一个或者多个通路设置在相关的信号元件上,该一个或者多个通路提供从该基片材料的该第一表面到该基片材料的该第二表面的导热性和导电性;
提供多个导电和导热的突出部,其从该管芯焊盘区域向外辐射,每个突出部覆盖相关的信号元件;
使用传导突出部从管芯焊盘区域将热能转移到多个信号元件的至少一个;以及
通过多个所述传导突出部中的至少一些将电流传送到相关的信号元件。
11.如权利要求10所述的方法,其特征在于,其还包括:
提供设置在该基片材料的第二表面上且在该管芯焊盘区域外部的多个信号球,一个或者多个信号球与多个通路中的相关一个热接触,且一个或者多个信号球适于传导热能。
12.如权利要求11所述的方法,其特征在于:选定的通路位于管芯焊盘区域的外部。
13.如权利要求11所述的方法,其特征在于,其还包括:
提供印刷线路板,
将该基片安装在该印刷线路板上,以便热能通过信号球从该管芯焊盘区域排散到该印刷线路板。
14.如权利要求10所述的方法,其特征在于,其还包括将集成电路安装在管芯焊盘区域上。
15.如权利要求10所述的方法,其特征在于,其还包括:
在管芯焊盘区域上位于一位置处提供导热元件。
16.如权利要求15所述的方法,其特征在于,其还包括:
通过该导热元件传送电流。
17.如权利要求10所述的方法,其特征在于,其还包括:
使多个所述突出部相互电绝缘。
18.如权利要求10所述的方法,其特征在于,其还包括:
由导热和导电的材料制造多个所述突出部。
CNB2004100493170A 2003-06-10 2004-06-10 热方面增强的部件基片 Expired - Fee Related CN100375272C (zh)

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