CN1294790C - 一种电子部件的生产方法及该方法生产的电子部件 - Google Patents
一种电子部件的生产方法及该方法生产的电子部件 Download PDFInfo
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Images
Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/486—Via connections through the substrate with or without pins
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Abstract
电子部件的制备方法,包括在加热情况下,经过粘合层将电子元件(A)压入电子元件(B),从而完成电子原件(A)和电子原件(B)的焊接,其中,电子原件(A)具有一用于电连接的导体部分I,其具有位于顶端表面的焊接层或焊接块,而电子原件(B)具有一用于电连接的导体部分II,其设置于与导体部分I相对的位置。焊接部位与粘合层相互接触,焊接部位加热至焊料的熔点温度或更高温度时熔化,通过挤压被熔化的焊接部位完成焊接,且粘合层被固化。按照此方法可获得一电子部件,确保完成电连接,并能得到生产效率高的高可靠性电子部件。
Description
技术领域
本发明涉及一种电子部件的生产方法及由该方法生产的电子部件。更具体而言,本发明涉及一种高可靠性多层线路板的生产方法,该多层线路板内各层之间的连接是通过高效的导电连接和同时进行的层间焊接确保其在高生产效率下成功实现,还涉及一种生产效率很高的高可靠性半导体装置的生产方法,它通过非流动欠冲(underfill)法在一个布线基片上有效地装配半导体倒装片而完成,以及涉及通过上述方法获得的多层线路板和半导体装置。
背景技术
近来电子仪器在提供更强功能的同时,其重量更轻、体积更小,电子元件集成度更高,而且在电子仪器上被更高密度地装配。半导体封装(package)变得更小,而且具有更多引脚(pins)。
在被称为印刷线路板的常规电路基片中,主要使用如下所述制备的布线基片。在附着于玻璃环氧树脂板上的铜箔上形成图案(pattern),该树脂板是用环氧树脂灌注到玻璃纤维机织布中形成的叠层板。多个这样的叠层板通过层压制成;贯穿层叠板的孔(hole)使用钻孔机钻孔形成,而通孔(via)则是在孔的孔壁上进行电镀而形成的。各层依靠通孔实现彼此间的电连接。然而,由于装配在布线基片上的电子部件变得越来越小,并且装配得更加密集,由于布线时有限的密度,将电子部件装配在上述的布线基片上时就会产生问题。
在上述情况下,最近开始使用组合式多层线路板。组合式多层线路板是将多个仅由树脂构成的绝缘层和多种导体层通过层压制成。有关通孔的工艺,各种各样的方法(如激光法、等离子法和照相法)被用来取代以往常用的钻孔方式。具有微小直径的通孔被有序排列,并可实现高密度。连接层部分使用了盲通孔(blind via)和沉通孔(buried via)(通孔内充满导电材料)。沉通孔需要引起注意,因为层叠通孔能够因此而形成,所谓层叠通孔就是一个通孔在另一个通孔的上面形成。沉通孔形成的方法包括用电镀填充通孔法和用导电膏填充通孔的方法。
日本专利申请公开号Heisei 11(1999)-204939公开了一种多层电路基片。该电路基片具有这样一种结构,一个绝缘片至少在一个表面上具有布线图(wiring pattern),还有贯穿绝缘片前后表面的导电通孔,电路基片有连接电极,这些电极部署在其前表面和后表面的适当位置,并通过通孔实现电连接,多个绝缘片和多个电路基片被交替层压。绝缘层由一种热固性粘合剂固化层构成,在100-300℃温度范围内加热可使粘度下降到100Pa.s或更小,并且保持在上述温度范围内的某一温度时,绝缘层可固化到至少70-80%。使用上述的多层电路基片可使连接层部分的密度增大。为形成连接电极,尝试使用一种导电粘合剂或一种主要成分为锡的合金,如Sn-Pb焊料在300℃或更低的温度下形成电连接。也有尝试在连接电极表面形成Au和Sn,并用Au-Sn合金形成导电连接。然而,导电粘合剂存在连接可靠性差的问题,而以Sn为主要成分的合金的连接存在金属间润湿性差的问题,这是因为Sn表面不清洁,导致不能充分形成连接。
日本专利申请公开号Heisei 8(1996)-195560描述了一种生产电路基片的方法,该方法能减小基片的大小和厚度,能减小导电层电连接部分的面积。该方法包括在压力作用下模压叠层板,其中叠层板由指定层数的在其一面或两面上具有导电线路层的绝缘材料,和没有导电线路层的绝缘材料层堆叠而成,同时,导电线路的至少两个给定堆积层彼此之间进行导电连接。在上述方法中,绝缘材料层都是被加工成薄片形且不含玻璃纤维的绝缘材料层。由导体电路电连接层的导体构成的凸起(一种金属块)被部署在导体电路层的指定位置,通过压模板挤压叠层板的力量,凸起被压裂(break)并穿透绝缘材料树脂层,致使凸起在压力作用下接触并附着到其面向的导体材料电路层。该专利同时描述了在上述方法中将熔点温度高于绝缘树脂层树脂固化温度的焊接层放置在凸起的顶端,该焊接层在热压下通过压裂并穿透绝缘树脂层与导体电路层形成连接。升高温度至焊料的熔点,焊接层随后被熔化,致使突起与导体电路层连接,然后焊接层被冷却、固化。依照该方法,形成了在另一个通孔之上形成一个通孔的层叠通孔。由于层间的连接是通过由导体组成的突起(一个金属块)导电,连接层部分的密度就能够被增大。然而,在先前方法中,电连接通过单纯的物理接触实现,可靠性差。在随后方法中,焊料不能通过润湿铺展开,而且焊接也不可能完成,除非突起顶端的焊接层表面和导体电路层表面足够清洁。
本发明人测试了用于多层线路板中层间连接的方法,并提出一种方法,该方法中的布线图上的焊盘和被连接元件的焊盘上都形成导体柱,布线图具有连接层焊盘,被连接元件具有与布线图连接的连接层焊盘。至少在导体柱的表面或与导体柱正对的焊盘上形成焊接层。导体柱和与导体柱正对的焊盘紧密接触并通过粘结层压在一起,然后将粘结部分加热到焊料的熔点温度以实现层间连接。然而,当焊料熔化前被挤压时,焊料与连接层的金属焊盘相接触而发生变形,使尖端变宽。在这种情况下,层间将出现薄粘合层。尽管粘合层具有焊接所必需的清洁表面的功能,但由于粘合层的绝对量小,使得其表面清洁功能不能充分体现。因而,就出现了一个问题,即无法获得很好的焊接效果。在没有变宽的焊接层部分,由于周围存在足够的粘合层而使其显示了较好的表面清洁功能。因此,焊料熔化时在焊料和连接层焊盘之间会表现出很好的焊接。换言之,在树脂保留的某些部分仍能获得好的焊接效果。这种情形通常认为是不能进行良好焊接的部分。
因此,对于装配半导体芯片的多层电路板而言,需要开发出一种能确保实现层间连接并能高效地生产高可靠性多层电路板的技术。
另一方面,在半导体芯片的装配领域,使用倒装片连接的半导体装置由于其良好的电子性能引起了人们的关注,并已经被批量生产。
在倒装片连接方法中,迄今为止,半导体芯片中的电极端子和线路板的连接焊盘首次使用导电块连接。一种液体树脂被浇注在半导体芯片和线路板之间的缝隙中(欠充步骤the underfill step),树脂通过加热被固化。然而,按照这种方法,对每一个端子的连接和树脂的固化,加热步骤是必须的,成本则不可避免要增加。而且浇注树脂要花费很多时间,因为半导体芯片和线路板之间的缝隙很窄。
为了克服以上问题,进行了各种单步骤连接方法的研究,此方法中连接和树脂的浇注是同时进行的。所研究的其中一种方法是将芯片或线路板涂上一层树脂,该树脂含有能激活金属表面的成分,芯片放置在线路板上,通过加热得到的混合物,无需进一步处理,可同时实现端子连接和欠充(underfill),此法称作非流动欠充方法。通过采用非流动欠充方法,连接步骤和树脂的浇注步骤可以在一个步骤中完成,由于生产步骤的明显简化,装置的投资和运行成本将下降。更重要的是,由于省略了花费大量时间的在一个狭窄缝隙中浇注树脂的步骤从而使产量增加。在该方法中,当导电块是焊料块时,焊接块通过加热熔化,可连接在另一个端子或焊盘上。在同一条件下继续加热,树脂的固化反应继续,整个结合面能被固定。
在线路板上按照非流动欠充方法装配半导体倒装片的半导体装置中,期望开发出与多层线路板技术类似的,能确保实现电连接并能高效率地生产高可靠性半导体装置的技术。
发明内容
在上述情况下,本发明的第一个目的是提供一种高效率地生产高可靠性多层线路板的方法,该多层线路板能够确保实现电连接。特别地,本发明的第一个目的是提供高可靠性的多层线路板的生产方法,其中层间连接是通过高效的电连接和同时进行的层间粘合而稳妥地实现,以及提供一种高效率地生产高可靠性的半导体装置的方法,该方法是按照非流动欠充方法,在一个线路板上有效地装配半导体倒装片而实现。本发明的第二个目的是提供了依照上述方法获得的电子部件。
为实现上述目的,本发明人经过了深入研究,结果发现在生产电子部件的方法包括通过在加热条件下经粘合层挤压电子原件,使具有用于电连接的导体部分I的电子原件和具有用于电连接的导体部分II的被连接电子原件焊接在一起而实现,其中导体部分I具有位于顶端表面的焊接层或焊接块。上述目的可通过至少将焊接层或焊接块与粘合层相接触;加热至焊接层或焊接块焊料的熔点温度或更高温度时,熔化焊接层或焊接块;施加一定的压力,使焊接层或焊接块的顶端部位在熔化状态下与用于导电连接的导体部分II相接触;通过采用润湿方式从接触点处延同心圆形状铺展焊料而完成焊接;固化粘合层。本发明就是基于这些方法而完成的。
本发明提供了:
1)一种电子部件的生产方法,其包括在加热情况下,经粘合层将电子元件(A)压入电子元件(B),而将电子元件(A)和被连接的电子元件(B)焊接起来,电子元件(A)具有用于电连接的导体部分I,该导体部分I的顶端表面具有焊接层或焊接块,电子元件(B)具有用于电连接的导体部分II,其排列于用于电连接的导体部分I相对位置上,该方法包括至少将焊接层或焊接块与粘合层相接触;通过加热形成焊接层或焊接块的焊料至其熔点温度或更高温度,使焊接层或焊接块熔化;通过挤压熔化的焊接层或焊接块而完成焊接;并固化粘合层;以及
2)通过上述方法获得的电子部件。
附图简述
图1是本发明第一方面涉及的多层线路板生产方法的第一种实施方式的图示;
图2是本发明第一方面涉及的多层线路板生产方法的第二种实施方式的图示;
图3是本发明第一方面涉及的多层线路板生产方法的第三种实施方式的图示;
图4是本发明第二方面涉及的半导体装置生产方法的一种实施方式;
图5是实施例1和比较实施例1中,受压条件下的加热状况图示;
图6表示了在实施例1和比较实施例1中的焊接状况;
图7表示了在实施例2和比较实施例2中,在受压下的加热状况。
在附图中,101表示金属箔,210和301表示金属板,102和202表示绝缘膜,302表示电镀保护层,103和203表示通孔,303表示开口,104、204和304表示导体柱,105、205和305表示焊接层,106、206和306表示布线图,107、207和307表示连接层焊盘,108、208和308表示粘合层,110、201和310表示连接层,120、220和320表示被连接层,130、230和330表示多层线路板,401表示布线基片,402表示端子II,403表示用于非流动欠充的树脂层,404表示半导体元件,405表示端子I,406表示焊料块。
本发明的优选实施方式
本发明电子部件的生产方法,包括在加热情况下,经粘合层将电子元件(A)压入电子元件(B),而将电子元件(A)和被连接的电子元件(B)焊接起来,其中电子元件(A)具有用于电连接的导体部分I,该导体部分I具有位于顶端表面的焊接层或焊接块;电子元件(B)具有用于电连接的导体部分II,其设置于用于电连接的导体部分I的相对位置,该方法包括至少将焊接层或焊接块与粘合层相接触,通过将在形成焊接层或焊接块的焊料加热至其熔点温度或更高温度,使焊接层或焊接块熔化,通过挤压熔化的焊接层或焊接块而进行焊接,并固化粘合层;以及
本发明电子部件的生产方法有如下所描述的两个方面:
第一个方面,本发明提供了一种多层线路板的生产方法,其中电子部件就是多层线路板,电子元件(A)是一个具有布线图的连接层,其中布线图上设有导体柱,导体柱顶端表面设置有焊接层。电子元件(B)是一个被连接层,其具有与导体柱相连接的连接层焊盘。第二个方面,本发明提供了一种半导体装置的生产方法,其中电子部件是半导体装置,电子元件(A)是半导体元件,它具有与外部相连接,且设置于一个主面(main face)上的端子I,端子I表面的顶端设置有焊接块。电子元件(B)是一个线路板,它具有与外部连接的端子II,其设置在与端子I相对的位置上。
以下结合附图对作为本发明的第一个方面的多层线路板的生产方法进行描述:
图1是作为本发明第一个方面的多层线路板生产方法的第一种实施方式的图示,图1(h)表示了所获得的多层线路板结构的剖面图。在本发明线路板的生产方法中,制备一种包括一层金属箔101和一层绝缘膜102的双层结构材料,在绝缘膜102内形成通孔103(图1(a))。此双层结构材料可通过诸如印刷、幕式涂覆、条形涂覆方法,直接在金属箔上涂覆树脂清漆而获得。其他可能采用的具有双层结构的材料,如含有一种树脂的商品铜箔(如一种含有聚酰亚胺的铜箔)。双层结构的材料也可通过蚀刻双面都涂覆有玻璃环氧薄层的铜箔而获得。
形成通孔103的方法不作特别地限制,只要该方法适合于本发明中本方面的生产方法。形成通孔的方法实例包括采用激光和等离子的干法蚀刻和化学蚀刻。可采用的激光有二氧化碳气体激光,紫外线激光或激发态原子产生的激光。当绝缘膜102包含加固纤维,如玻璃纤维时,则优选使用能穿透玻璃纤维并形成通孔103的二氧化碳气体激光。当绝缘膜102不含加固纤维,如聚酰亚胺时,优选使用能形成更小通孔103的紫外线激光。当绝缘膜102是光敏性树脂时,通过选择性地将绝缘膜曝露在光下,并进一步显影以形成孔103。
使用金属箔101作为电解引线(供电电极),由电解镀层在103通孔处形成104导体柱。然后在导体柱顶端表面形成焊接层105(图1(b))。由电解电镀形成导体柱104,可以根据需要控制导体柱顶端的形状。优选导体柱具有一个位于绝缘膜表面或从绝缘膜表平面突出来的表面。从绝缘膜的表平面突出形成的导体柱,在导体柱顶端熔化焊料进行焊接可获得加固的结构。
对导体柱104的材料并无特别限制,只要该材料能满足本方面生产方法的要求,材料可以是铜、镍、金、锡、银和钯。使用铜材料可获得稳定的导体柱104,其电阻较小。
关于焊接层105的形成方法,可采用非电解电镀方法,电解电镀法(采用金属箔101作为电解电镀的引线(供电电极)),或采用印刷含焊料的焊膏的方法。在印刷方法中,印刷掩模(MASK)必须准确地放置在与导体柱104相对的位置上。由于焊接层105只能在导体柱104顶端部位形成,非电解电镀或电解电镀方法能更精细、更密集地形成导体柱。特别地,优选电解电镀,原因在于各种类型的金属都可用于电镀,它比非电解电镀方法更容易控制化学物质。对焊接层的厚度不作严格限制,只要焊料的量足以能在被加热熔化时形成凸起形状,优选为圆顶状或液滴状。
对于焊接层104的材料,优选包含Sn、In或选自Ag、Cu、Zn、Bi、Pd、Sb、Pb、In和Au中的至少两种金属的焊料,更优选使用对环境无副面影响的无铅焊料。
布线图106是通过选择性地蚀刻金属箔101而形成,并得到了连接层110(图1(c))。然后,在绝缘膜102的表面形成粘合层108(图1(d))。粘合层108是由一种适合于树脂的方法形成的。该方法的实例包括依照印刷、幕式涂覆、条形涂覆方法直接施涂树脂清漆,或依照真空层压或真空加压方法对干膜型树脂进行层压。优选的粘合层108具有两个功能,即清洁金属表面的功能和粘合功能。清洁金属表面的功能对于完成焊接很重要,粘合功能对将连接层110和被连接层120粘合在一起很重要。粘合层108的厚度优选为,当焊料加热熔化成一个凸起形状时,至少凸起部分的顶端部分和相对于凸起部位的连接层焊盘互相不接触。当粘合层的厚度使得凸起部位和焊盘互相接触,就会出现一种可能,在熔化焊料形成凸起形状期间,焊接层和连接层焊盘通过粘合层而互相接触,这样就不能获得很好的焊接效果。尽管粘合层108在绝缘膜102表面上形成(图1(d)),但至少足以使焊接层与粘合层接触。当焊料接触粘合层时,在加热熔化过程中,焊料会在粘合层内部熔化,形成凸起形状。粘合层108可以在被连接层120表面形成,当然,粘合层108可以既在绝缘膜102上又在被连接层120上形成。
连接层110置于与被连接层120相对的位置上(图1(e))。至于定位,可通过图象识别装置读取在连接层和被连接层上事先形成的定位标识或使用定位针来实现。
连接层110通过粘合层108和被连接层120相互接触(图1(f))。两层相互接触的方法为,例如,利用真空加压或压力型真空层压机,通过在受压的情况下加热使粘合层108软化。在上述操作中,其优点是至少焊接层和连接层的焊盘不接触空气或粘合层,另一个优点是焊接层105和连接层的焊盘107互相不接触。
在连接层110和被连接层120被加热至形成焊接层105的焊料熔点或熔点以上的温度,且焊料熔化后,在压力的作用下,各层被压在一起(图1(f)到1(h))。在受压下的加热步骤中,当焊接层被加热至焊料熔点或以上温度时,如使用真空加压,通过使用具有清洁粘合层108表面功能的粘合剂,焊接层105上的氧化膜会被还原并熔化,并且由于熔化焊料表面张力的作用形成一个突起(图1(g))。突起的形状优选为最稳定的圆顶形或液滴状。然后,在压力作用下,焊接层105突起形状的顶端部位与连接层107的焊盘互相点接触,焊料从点接触处延同心圆润湿铺展开来,从而完成焊接。加热至焊料熔点或熔点以上温度时,粘合层108的粘度下降。通过在软化的粘合层内部熔化焊料,就会形成一个更为突起的形状,使焊接更容易进行。此时优选的粘度为50Pa.a或更小。当粘度大于50Pa.a时,粘合层105内突起形状的形成、焊接层与连接层107焊盘之间的接触、以及润湿铺展焊料都将受到负面影响,焊接可能不充分。通过加热固化粘合层108,可使连接层110和被连接层120连接在一起。
总之,用电解电镀或非电解电镀获得的焊接层105中,构成焊料的金属保持为刚刚被以晶体分离后的状态。为了使金属同焊料一样有效地工作,焊料层105可能需要涂布一种助焊剂(flux),而且焊料会被重新熔化。当焊接层105被重熔之后,优选连接层110和被连接层120被热压在一起。然而,该方法并不有利之处,因为需要增加重熔和清洁助焊剂的步骤,并且助焊剂的清洁可能不充分(残余助焊剂)。本发明中,由于在粘合层108中使用了熔化焊接层105中焊料所必须的具有清洁表面功能的粘合剂,焊接层105的焊料可在加热步骤中熔化,而不需要另加清洁步骤。
在受压状况下使焊接层105的焊料在粘合层中熔化,之后施加压力,则焊接层通过与连接层107焊盘接触而发生变形。这会在尖端处产生一个扁平形状,在焊接层105和连接层107焊盘之间产生一个薄的粘合层108。由于焊接层105的焊料具有清洁表面的功能,这对于后面所述焊料的熔化是必须的,焊接层105的焊料可在加热阶段熔化。然而,由于粘合层108的绝对量很小,在焊接层105和连接层107焊盘之间产生的薄粘合层108并不能完成充分清洁的功能。结果是,顶端扁平部分的焊料没有熔化,扁平部分的焊料和连接层107之间不能获得理想的焊接。相反,扁平部分以外的焊料(焊接层105的周围部分),由于粘合层108存在充足的量,则能充分地实现其清洁表面的功能。因此,焊料被熔化,熔化的焊料和连接层107之间可获得理想的焊接效果。换言之,结果是,粘合层108存在于顶端扁平部分的焊料和连接层107的焊盘之间,而另一方面,连接层107的焊盘在在扁平部位以外的部位,在理想的条件下被焊接。因而,焊接层105和连接层107的焊盘未能在理想的条件下被焊接在一起。
按照上述步骤,通过焊接层105,可将连接层107的焊盘和导体柱104焊接在一起,并得到了多层线路板130,其中各层之间通过粘合层108而粘合在一起。在图1(h)表示的实施方式中,一个单个的连接层110被层压至被连接层120上。具有多层结构的多层线路板可通过层压单个或多个层至图1(h)示的多层线路板130上而获得。
图2表示了本发明第一个方面涉及的多层线路板生产方法的第二种实施方式。图2(h)显示了制得的多层线路板结构的剖视图。
本发明多层线路板生产方法的第二个实施方式不同于第一个实施方式,该实施方式是按照电解电镀方法,采用金属板201作为电解引线(供电电极)形成布线图206,而不是通过选择性蚀刻金属箔101形成布线图106。这些实施方法的基本生产过程几乎是相同的。下面将特别针对与第一个实施方式不同的过程,对第二个实施方式进行详细描述。
在金属板201上形成一具有图案(PATTERNED)的电镀保护层(图中未表示出)。使用金属板201作为电解引线(供电电极),按照电解电镀方法形成布线图206后,除去电镀保护层(图2(a))。通过上面的电解电镀,布线图206在金属板201上没有电镀保护层的部位上形成。作为布线图206的材料,可以使用铜、镍、金、锡、银或钯。使用铜可获得一个稳定的导体柱104,其电阻较小。只要金属板201的材料符合本实施方式方法的要求,对其材料不进行特别限制,重要的是该材料能很好得耐受本方法使用的化学品,并在制作完成以前,能通过蚀刻的方式被完全清除。金属板206材料包括铜、铜合金、42合金和镍。作为另一种方法,电镀保护层可在金属板201上通过层压一对紫外线敏感的干膜保护层而形成,然后选择性地将叠层板暴露在光下,形成被暴露的叠层板。
在布线图206上形成绝缘膜202,在绝缘膜202上形成通孔203(图2(b))。作为构成绝缘膜202的树脂,只要树脂符合本实施方式方法的要求,可使用任何类型的树脂。例如,可按照印刷、幕式涂覆或条状涂覆的方法直接施涂树脂清漆,或按照真空层压或真空加压的方法对干膜型树脂进行层压。特别是,涂覆有树脂的商用铜箔很容易获得。当涂覆有树脂的铜箔按照真空层压方式进行层压,布线图206在布线图表面形成的不平坦的地方被树脂层完全充满,铜箔随后进行干法蚀刻,绝缘膜202的表面会非常平坦,不会受到由布线图206所引起的不平坦的影响。由于铜箔表面的细微的波动会被传递到绝缘层202表面,因此肯定能实现与粘合层208的紧密粘合(图2(d))。通孔203的形成方法与第一个实施方式完全相同。
使用金属板201作为电解引线(供电电极),按照电解电镀方法可形成导体柱204。然后,在导体柱顶端表面形成焊接层205,并得到连接层210(图2(c))。形成导体柱204和焊接层205的方法与第一个实施方式相同。
然后,在绝缘膜202表面形成粘合层208(图2(d))。形成粘合层208的方法与第一个实施方式相同。
连接层210置于与被连接层220相对的位置(图2(e))。色置方法与第一个实施方式相同。
通过粘合层208,粘合层208和被连接层220相互接触(图(2(f))。两层之间相互接触的方法与第一个实施方式相同。
在最后的步骤中,连接层210和被连接层220在压力的作用下被结合在一起,金属板210通过腐蚀方法被除去(图(2(h))。受压下的粘合方法与第一个实施方式相同。当金属板201的材料不同于布线图206的材料时,可通过使用一种不侵蚀布线图206的化学物质将金属板201腐蚀去除。当金属板201的材料与布线图206的材料相同时,由于在腐蚀金属板201时,布线图206也会受到侵蚀,因此最好在金属板201和布线图206之间提前设置一保护层,其可以抵抗为腐蚀金属板201而使用的化学物质的侵蚀(该保护层未在图中标示出来)。由于存在这样的保护层,通过这一步骤可防止腐蚀金属板201时对布线图206造成侵蚀。其后再使用不侵蚀布线图206的化学物质腐蚀除去该金属保护层。(当然,该金属防护层可被保留而不被除去)。
下面将对以上的步骤进行更具体的描述。当金属板201的材料为铜,金属保护层材料为镍、锡或一种焊料时,可使用一种商用的含氨腐蚀液除去金属板201。当金属板201材料为铜,金属保护层的材料为金时,可使用几乎所有的腐蚀液,包括氯化铁和氯化铜等腐蚀除去金属板201。当布线图206材料为铜,金属保护层的材料为镍、锡或一种焊料时,金属保护层可使用一种商用镍焊料去除剂腐蚀除去(如,MITSUBISHI GAS KAGAKU Co Ltd生产的PEWTAX)。当布线图206材料为铜,金属保护层的材料为金时,在不侵蚀布线图206的情况下,很难腐蚀除去金属保护层。在这种情况下,可以保留金属保护层而不进行除去。
按照上述步骤,连接层207的焊盘和导体柱204通过焊接层205被焊接在一起,通过粘合层208将各层粘合在一起,从而得到多层线路板230。在图2(h)表示的实施方案中,连接层210的一个单层与被连接层220被层压在一起。通过在多层线路板230上层压一个或更多的层,获得了具有多层结构的多层线路板(图2(h))。
图3展示了本发明第一个方面生产多层线路板方法的第三种实施方式。
图3(h)显示了所获得的多层线路板结构的剖面图。
作为本发明第一个方面涉及的多层线路板的生产方法,其第三种实施方式与第二种实施方式不同,其是通过形成一个可去除的电镀保护层而形成导电柱304,而不是通过在绝缘膜202形成通孔203而形成导体柱204,这些实施方式的基本生产步骤基本相同。在第三个实施方式中,以下将就与第二个实施方案中不同的步骤进行具体的描述。
在金属板301上形成布线图306后,形成具有开口303的电镀保护层302(图3a),形成布线图306的方法与第二个实施方式相同。形成电镀保护层302的方法与布线图206形成所使用的形成电镀保护层(未在附图中显示)的方法相同(如第二个实施方式所描述)。
然后形成导体柱304和焊接层305(图3(3b))。形成导体柱304和焊接层305的方法与第二个实施方式相同。
电镀保护层302随后被除去,即得到连接层310(图3(c))。
粘合层308是以其覆盖在焊接层305上的方式形成(图3(d))。粘合层的形成方法与第二种实施方式中相同。
连接层310置于被连接层320的相对位置上(图3(e))。设置方法与第二种实施方式中相同。
连接层310和被连接层320随后经粘合层308相互连接在一起(图3(f)),层间的连接方法与第二种实施方式中相同。
最后的步骤是连接层310和连接层320在压力作用下被粘合在一起。金属板301通过腐蚀被除去(图3(h))。受压下的粘合方法和腐蚀方法与第一种实施方式中相同。
按照上述方法,连接层307的焊盘和导体柱304通过焊接层305相焊接,各层与粘合层308相粘合,即获得多层线路板。在图3(h)实施方式中,连接层310的一个单层与被连接层320层压在一起。通过在多层线路板330上层压一个或更多的层而获得具有多层结构的多层线路板(图3(h))。
本发明第二个方面所涉及的半导体装置的生产方法将在下面结合附图进行描述。
本发明第二个方面涉及的半导体装置的生产方法是按照非流动欠充方法,将半导体倒装晶片装配在线路基片上。图4为本发明半导体装置生产方法的一个实施方式的图示。图4(d)表示了获得的半导体线路板结构的剖面图。
本发明半导体装置的生产方法中,作为粘合层并用作非流动欠充的树脂层403在线路基片401上形成,基片具有与外部连接的端子II 402(图4(a))。具有焊料块406的半导体元件404(优选为半导体倒装晶片)附着在用作非流动欠充的树脂层403上,焊料块406在端子I 405顶端的表面形成,端子I 405设置于主面上并与外部连接(图4(b))。
将得到的结合体(combination)加热至形成焊接块406的焊料的熔点或更高温下,焊接块406被熔化。此时,优选为焊接块与线路基片401上的与外部连接的端子II保持相互不接触。通过使用有清洁非流动欠充树脂层403表面功能的树脂,焊接块406表面的氧化膜被还原,焊接块406被熔化。按照这种方式,焊接块406被熔化后,其顶端部分和与外部连接的端子II在压力的作用下相互接触(图4(c))。此后,通过采用润湿方式从接触点处沿同心圆形状铺展焊料,完成焊接。此时,优选的非流动欠充树脂层粘度为50Pa.a或更小。用作非流动欠充的树脂层403经进一步加热固化,半导体装置404和线路基片401被粘合在一起(图4(d))。
如上所述,可获得高可靠性的半导体装置,其中按照非流动欠充方法,可将半导体元件(优选为半导体倒装片)装配在线路基片上。
本发明方法中使用的粘合层,优选为具有清洁表面功能具有可靠绝缘性的粘合剂。清洁表面的功能为,如去除焊料或被连接金属表面的氧化膜的功能,以及还原氧化膜的功能。由于粘合层具有清洁表面的功能,使焊料和连接表面的润湿效果得到加强。为了达到此目的,粘合层与带有焊料的被结合面的接触很重要,这样表面才能被清洁。通过清洁两个表面,在被结合表面焊料的润湿铺展力发挥作用,被结合部分的粘合层通过焊料在其表面的润湿铺展力被去除。因此,抑制了残留树脂的形成,通过使用用于焊接的粘合层可获得高可靠性的电连接。
粘合层采用的第一优选粘合剂包括,(A)含至少一个酚羟基的化合物,以及作为基本组分的化合物(A)的固化剂树脂(B)。化合物(A)中的酚羟基可除去杂质,如焊料和金属表面的氧化物,并且由于其具有清洁表面的功能可还原氧化物,因此被作为焊接中的一种助焊剂。而且,用树脂(B)作为固化剂,可得到优良的固化产品,在焊接后无需洗涤除去杂质,在高温和高湿的空气中仍保持电绝缘性,并且实现了高可靠性的,高强度连接的焊接。
用于本发明优选粘合剂中具有至少一个酚羟基的化合物(A),优选为选自可溶可熔的酚醛树脂、可溶可熔的烷基苯酚树脂、可溶可熔的多功能酚醛树脂、苯酚芳烷基树脂、可溶性酚醛树脂、聚乙烯酚醛树脂、酚酞和二羟基苯甲酸。可选择单一化合物,或两个或多个化合物的混合物。
在上述化合物中,由于多功能的酚醛树脂的一个苯环中具有两个或多个酚羟基,多功能的酚醛树脂与单一功能的酚醛树脂相比,在作为助焊剂方面表现出了明显的改进性能。
酚醛树脂、烷基酚醛树脂和多功能的酚醛树脂可在酸性催化剂存在的条件下,通过苯酚、烷基苯酚和多功能苯酚分别与甲醛缩合而制得。
用于制备可溶可熔性烷基酚醛树脂的烷基苯酚的实例包括被烷基取代的苯酚,如甲酚、二甲苯酚和具有结合在亚烷基或亚环烷基的羟基的化合物,如4,4’-异亚丙基二苯酚(双酚A)和4,4’-亚环己基二苯酚。
用于制备多功能酚醛树脂的多功能苯酚包括儿茶酚、间苯二酚、对苯二酚、羟基对苯二酚、焦酚。在这些化合物中,优选儿茶酚和间苯二酚。
本发明中使用的苯酚烷基树脂可通过如在酸性催化剂存在的条件下,α,α’-二甲氧基-对-二甲苯和苯酚之间脱甲醇反应而获得。
本发明中使用的可溶性酚醛树脂可通过苯酚和甲醛在碱性催化剂存在的条件下反应而获得。
本发明使用的具有酚羟基基团的化合物(A)的软化点温度优选为大于等于30℃而小于等于150℃,更优选为大于等于40℃而小于等于110℃。软化点温度低于上述范围的树脂的分子量小,由于在焊接前或焊接过程中发生汽化而导致助焊剂功能的丧失,或形成缝隙而致使结合不好,使焊接效果受到负面影响。而且,低分子量的树脂不能提供作为加固焊接部分的固化树脂的足够物理特性。当软化点温高于上述范围时,在压力作用下加热的焊接过程中,树脂层的流动性降低,由于焊料和与其相对的金属电极之间的接触和焊接过程中焊料在金属表面润湿铺展都受到负面影响,使得焊接效果变差。当软化点温度处于上述范围内,在焊接的温度下,可获得充分的粘合层流动性,从而确保实现稳固的焊接。
本发明中具有酚羟基的化合物(A)优选重均分子量为20000或更低,更优选为10000或更低,最优选为5000或更低。当重均分子量超过20000时,焊接过程中粘合层的流动性会下降,焊接就可能受到负面影响。只要软化点温度在上述温度范围内,并且粘合剂的特性没有受到负面影响,则对其重均分子量的下限不做特别限制。
用于本发明第一优选的粘合剂中的树脂(B),其作为具有酚羟基的化合物(A)的固化剂,可采用环氧树脂和异氰酸酯树脂。树脂(B)的实例包括以苯酚为基本组成的树脂,如双苯酚树脂、可溶可熔性酚醛树脂、可溶可熔性烷基苯酚树脂、二苯酚树脂、萘酚树脂和间苯二酚树脂;环氧化合物和异氰酸酯化合物,其是在基于脂肪族化合物、脂环族化合物或不饱和脂肪族化合物的结构骨架下改造而得。
用于本发明第一优选粘合剂中,具有酚羟基的化合物(A),在粘合剂中的重量比优选为大于等于5%且小于等于80%,更优选为大于等于20%且小于等于80%。当其重量比小于上述范围时,清洁金属表面的功能则降低,不能完成焊接。当其重量比超过上述范围时,则可能无法获得理想的固化产品,粘合强度和可靠性就会降低。树脂(B)的用量优选为,其中环氧基团或异氰酸酯基团的当量数与羟基基团的当量数的比值为大于等于0.5且小于等于1.5。然而,树脂(B)的量不受限于以上范围。
用于本发明的第二种优选粘合剂包括环氧树脂(A’)和含咪唑环的化合物(B’),化合物(B’)为环氧树脂(A’)必需的固化剂。由于叔胺包含未成对电子,化合物(B’)中的咪唑环能除去如焊料或金属表面的氧化物杂质或通过表面清洁的功能还原氧化膜,并可作为焊接过程中的助焊剂。而且,咪唑环作为环氧树脂(A’)阴离子聚合的固化剂。因此,可以得到固化良好的产品,而且焊接后无需再清洗除去杂质。在高温和高湿的空气中可保持优秀的电绝缘性,而且实现了高可靠性的焊接,结合强度高。
本发明第二种优选粘合剂中的化合物(B’),其在粘合剂中的重量比优选为大于等于1%且小于等于10%。当化合物(B’)重量小于上述范围时,清洁金属表面的功能则降低,环氧树脂(A’)得不到充分的固化。当化合物(B’)重量超过上述范围时,就会导致固化反应进行得太快,焊接过程中粘合层流动性下降而使焊接受到负面影响。而且,固化产品可能会变得易碎,焊接部分的结合力不强。化合物(B’)的重量比更优选为大于等于1%且小于等于5%。
本发明第二种优选粘合剂中,环氧树脂(A’)与化合物(B’)结合的实例包括基于苯酚的环氧树脂,如双苯酚树脂、可溶可熔性酚醛树脂、可溶可熔性烷基酚树脂、二苯酚树脂、萘酚树脂和间苯二酚树脂;以及环氧化合物,其是在基于脂肪族化合物、脂环族化合物或不饱和脂肪族化合物的结构骨架下改造而得。
本发明中第二优选粘合剂中的化合物(B’)的实例包括咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-苄基-2-甲基咪唑、2-十一烷基咪唑、2-苯基-4-甲基咪唑、双-(2-乙基-4-甲基咪唑)、2-苯基-4-甲基-5-羟基甲基咪唑、2-苯基-4,5-二羟基甲基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-苯基咪唑和三嗪加成型的咪唑。也可采用基于这些化合物的环氧加合物和含这些化合物的微胶囊。上述化合物可以单独使用,也可以两个或多个联合使用。
用于本发明第二种优选粘合剂中的环氧树脂(A’),其在粘合剂中的重量比优选为大于等于30%且小于等于99%。当其重量比低于上述范围时,就可能得不到理想的固化产品。
本发明第一种优选粘合剂和第二种优选粘合剂,根据需要,可进一步包括一种热塑性树脂(C)。
热塑性树脂(C)在粘合剂没有固化时有助于形成一个薄层,使固化后的粘合剂具有粘性和弹性。热塑性树脂(C)的实例包括苯氧树脂、聚乙烯醇缩丁醛树脂、聚酯树脂、聚氨酯树脂、聚酰亚胺硅氧烷树脂、聚丙烯、苯乙烯-丁二烯-苯乙烯共聚物、聚缩醛树脂、聚酰胺树脂、丙烯腈-丁二烯树脂、丙烯腈-丁二烯-甲基丙烯酸共聚物、丙烯腈-丁二烯-苯乙烯共聚物、聚醋酸乙烯酯树脂、尼龙、苯乙烯-异戊二烯共聚物、苯乙烯-丁烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物和聚甲基丙烯酸甲酯树脂。优选苯氧树脂、聚乙烯醇缩丁醛树脂,其在加热下具有良好成膜性和流动性。热塑性树脂(C)可单独使用或两个或多个联合使用。
本发明中使用的热塑性树脂(C)在整个粘合剂中的重量比优选为大于等于5%且小于等于50%。当其重量比低于上述范围时,在粘合剂尚未被固化时,成膜性能差;而在粘合剂被固化后,其粘性和柔韧性差。当其重量比高于上述范围时,焊接可能会受到负面影响。本发明中使用的热塑性树脂(C)优选的玻璃转化温度为大于等于40℃且小于等于150℃,更优选为大于等于50℃且小于等于120℃。当玻璃转化温度低于上述范围时,在室温下树脂可能具有粘性。当玻璃转化温度超过上述范围时,在一定压力作用下加热至焊接的温度时,粘合剂的流动性可能不够,焊接效果受到负面影响。
本发明中使用的热塑性树脂(C)优选的重均分子量为大于等于10000且小于等于100000,更优选为大于等于12000且小于等于70000。当重均分子量小于上述范围时,在未固化情况下,成膜特性差。当重均分子量大于上述范围时,焊接会受到负面影响。
本发明使用的粘合剂可进一步包括一种可固化的抗氧化剂。可固化的抗氧化剂是一种抗氧化的化合物,其通过与固化剂(B)或固化剂(B’)的反应而被固化。本发明使用的可固化的抗氧化剂无特别的限制。优选为具有苯亚甲基结构的化合物,3-羟基-2-萘甲酸、pamoic acid、2,4-二羟基苯甲酸和2,5-二羟基苯甲酸。具有苯亚甲基结构的化合物,更优选为通式(I)表示的化合物。
在上述通式(I)中,R1、R3、R5独立地代表氢原子、羟基或羧基,R2、R4独立地代表氢原子或烷基,R6、R7独立地代表氢原子、甲基、羟苯基或羧苯基。
通式(I)代表的化合物的实例包括亚乙基二苯酚、2,2’-亚乙基双(4,6-二-t-丁基苯酚)、酚酞和这些化合物衍生的聚合物。上述化合物可单独使用或两个或多个联合使用。在这些化合物中,优选亚乙基二苯酚和酚酞。
本发明的粘合剂中,可固化的抗氧化剂(D)在整个粘合剂中的重量比优选为大于等于0.5%且小于等于30%,更优选为大于等于1%且小于等于20%。当可固化的抗氧化剂含量低于上述范围时,除去如焊料和金属表面氧化物等杂质的能力会降低,焊接性能则得不到充分改善。当可固化的抗氧化剂含量超过上述范围时,绝缘性和可靠性会降低。
苯亚甲基结构能通过清除氧化反应形成的自由基,终止氧化反应中的链反应,因此是一种有效的抗氧化剂。在焊接温度范围内,苯亚甲基结构通过释放氢自由基而作为还原剂,除去焊料和金属表面的杂质如氧化物。
本发明第一优选的粘合剂可包括一种固化催化剂以加速固化。固化催化剂的实例包括2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、双-(2-乙基-4-甲基咪唑)、2-苯基-4-甲基-5-羟基甲基咪唑、2-苯基-4,5-二羟基甲基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氨乙基-2-甲基咪唑、1-氰乙基氨乙基-2-甲基咪唑、1-氰乙基-2-苯基4,5-双(氰乙氧甲基咪唑)和三嗪加合型的咪唑。也可采用基于上述化合物的环氧加合物和这些化合物的微胶囊。上述化合物可单独使用或两个或多个联合使用。
本发明的粘合剂可进一步包括添加剂,如用于改善粘性和防潮的硅烷偶联剂,用于防止形成空隙的消泡剂和液体或粉末状的阻燃剂。
本发明的粘合剂可将上述成分以所需要用量混合制得。所获得的粘合剂可以与一种溶剂相混合,并作为粘合清漆使用。
本发明中用于粘合剂的溶剂的实例包括丙酮、甲乙酮、甲基异丁酮、环己酮、甲苯、1,3,5-三甲基苯、二甲苯、己烷、异丁醇、正丁醇、1-甲氧基-2-丙醇乙酸酯、丁基溶纤剂、乙基溶纤剂、甲基溶纤剂、溶纤剂乙酸酯、乳酸乙酯、醋酸乙酯、邻苯二甲酸二甲酯、邻苯二甲酸二乙酯、邻苯二甲酸二丁酯、二乙二醇、苯甲酸正丁酯、N-甲基吡咯烷酮、N,N-二甲基甲酰胺、四氢呋喃、γ-丁内酯和茴香醚。溶剂的熔点优选为200℃或更低。
本发明优选的粘合剂的熔点温度为100℃或更低。当粘合剂包含一个大分子量的树脂,且其熔点高于100℃时,在压力作用下的加热焊接过程中,焊接层的流动性可能会降低,焊接受到负面影响。
本发明的粘合剂在焊料熔点温度时,优选的凝胶时间为1分钟或更长,更优选为2分钟或更长,最优选为5分钟或更长。当在熔点温度的凝胶时间短于上述范围时,在焊接过程中由于固化反应还在进行,在焊料和被连接金属焊接在一起之前,粘合剂可能已被固化,焊接受到负面影响。当在焊料熔点的凝胶时间为5分钟或更长时,通过在压力作用下加热,在焊接温度下粘合层表现出流动状态,则获得稳固的焊接。在焊料熔点时,优选的凝胶时间为小于等于60分钟,更优选的凝胶时间为小于等于30分钟,最优选的凝固时间为小于等于20分钟。当焊料熔点时的凝胶时间超过上述范围,焊接完成后的加热固化可能进行得不很充分,尽管可能实现稳固的焊接,但被焊接部位不能得到充分、强有力的焊接。当固化在高温下完成时,固化反应进行得很充分,就可能出现由于粘合剂的氧化使得被固化产品抗破裂的韧性降低,装配后在加热情况下可能出现抗冲击性能降低。
当焊接层或焊接块加热至焊料熔点或更高温度时,焊接层或焊接块熔化,并在压力作用下完成焊接。本发明的粘合剂在焊接温度时的粘度为50Pa.s或更小。当粘度高于50Pa.s时,由于粘合层流动性降低,被熔化的焊接层或焊接块与被焊接面的接触受到抑制,焊接可能不会充分地完成。即使当焊料与被连接的表面接触,由于粘合剂不能通过焊接表面焊料的润湿铺展被清除,因此不能获得足够的焊接强度。为了更好地完成焊接,粘合剂更优选的粘度为10Pa.s或更小,最优选的粘度为1Pa.s或更小。
本发明也提供了按照上述方法获得的电子部件,这些电子部件特别是多层线路板和半导体装置。
以下参照具体实施方式对本发明进行更详细的描述,本发明并不限于这些
实施例。
实施例1和比较实施例1
(1)粘合剂清漆1的制备
在104g甲乙酮中加入106g可溶可熔性甲酚树脂[SUMITOMO DUREZCo.Ltd.制造;PR-HF-3;羟基当量为106],35g二烯丙基双苯酚A型环氧树脂[NIPPON KAYAKU Co,Ltd.制造;RE-810NM;环氧当量为225],和210g二环戊二烯型环氧树脂[NIPPON KAYAKU Co,Ltd.制造;XD-1000L;环氧当量为248],使其溶解,制成用于金属粘合的粘合剂清漆1。
(2)多层线路板的制备
一种韧性的印刷线路板(SUMITOMO BAKELITE Co.,Ltd.;A1FLEC制造)上的聚酰亚胺树脂绝缘膜包括一铜箔(金属箔101;厚度:18μm)和一聚酰亚胺树脂绝缘膜(绝缘膜102;厚度:25μm),其上形成300个通孔(通孔103),通孔均采用UV-YAG激光形成,其顶部直径为45μm,底部直径为25μm。在通孔的内部和外围部分用含高锰酸的树脂侵蚀液清洗后,采用铜箔的背面作为电解电镀的引线(供电电极),以电解电镀法用铜填充孔,即形成铜柱(导体柱104)。通过调整电解电镀铜的时间,使铜柱的直径为45μm。在形成的铜柱的表面,以电解电镀法形成厚度为4μm的Sn-Pb共结晶焊接层(焊接层105)。从绝缘膜表面至焊接层顶端表面的凸起高度为10μm。然后,通过选择性蚀刻铜箔形成布线图(布线图106)。按照上述步骤得到连接层(连接层110)。
采用条状涂覆法将上述(1)中获得的粘合剂清漆1涂布于所得到的连接层上,使得绝缘膜的表面,即其上形成Sn-Pb共结晶焊接层的表面涂布了粘合剂清漆。涂膜在80℃干燥20分钟后,即形成厚度为20μm的粘合层(粘合层108)。
另外,使用一种在其两面均覆盖铜膜的玻璃环氧层(SUMITOMOBAKELITE Co.,Ltd.制造;ELC),其两面的铜箔厚度为12μm,对应于FR-5,通过选择性蚀刻铜箔形成布线图(未在图中标示出)和连接层焊盘(连接层焊盘107),由此得到被连接层(被连接层120)。考虑到设置位置的允许误差,将连接层焊盘的直径调整为300μm。
按照上述步骤获得的连接层和被连接层上预先形成的位置标示可通过一种图像识别仪器来读取,将两层相对放置,并在压力作用下于100℃的温度下暂时地结合起来。观察暂时结合的样品截面,发现焊接层和连接层的焊盘之间没有相互接触,存在一个大约5μm的缝隙(粘合层)。
在图5所示的两种条件(条件①和条件②)下,暂时结合的样品被永久地粘合在一起。
条件①:加热至焊料熔点或更高温度(183℃),随后施加压力(例1)
条件②:加热至焊料熔点或更低温度下,随后施加压力。
(3)观察被焊接部分
为观察所得样品的被焊接部分,将连接层和被连接层在其层间界面,即在粘合层处分开,检查焊料润湿连接层焊盘的情况。在条件①和条件②中,在压力作用下永久粘合的连接层焊盘被分开的表面图如图6所示。
如图6所示,在条件①(实施例1)中,在压力作用下通过润湿永久粘合的样品中的连接层焊盘,使焊接层大范围铺展开来。相反,在条件②(比较实施例1)中,在压力作用下永久粘合的样品,其中心周围有一部分没被焊接,连接层焊盘的铜曝露在外(粘合层存在于两层之间)。因此表明加热至焊料熔点或更高温度后,施加压力的方法是有效的。
实施例2
(1)粘合剂清漆2的制备
在165g甲乙酮加入106g可溶可熔性甲酚树脂[由SUMITOMO DUREZCo.Ltd.制造;,PR-HF-3],105g酚酞[由TOKYO KASEI Co.,Ltd.制造],以及405g二烯丙基双苯酚A型环氧树脂[由NIPPON KAYAKU Co,Ltd.制造;RE-810NM],使其溶解,制成用于金属粘合的粘合剂清漆2。
(2)多层线路板的制备
一种韧性的印刷线路板(SUMITOMO BAKELITE Co.,Ltd.;A1FLEC制造)上的聚酰亚胺树脂绝缘膜包含一铜箔(金属箔101;厚度:18μm)和一聚酰亚胺树脂绝缘膜(绝缘膜102;厚度:25μm),其上形成300个通孔(通孔103),通孔均采用UV-YAG激光形成,其顶部直径为45μm,底部直径为25μm。在孔的内部和外围部分用含高锰酸的树脂侵蚀液清洗后,采用铜箔的背面作为电解电镀的引线(供电电极),以电解电镀法用铜填充孔,即形成铜柱(导体柱104)。通过调整电解电镀铜的时间,使铜柱的直径为45μm。在形成的铜柱的表面,以电解电镀法形成厚度为4μm的Sn-Pb共结晶焊接层(焊接层105)。从绝缘膜表面至焊接层顶端表面的凸起高度为10μm。然后,通过选择性蚀刻铜箔形成布线图(布线图106)。按照上述步骤得到连接层(连接层110)。
采用条状涂覆法将上述(1)中获得的粘合剂清漆涂布于得到的连接层上,使得绝缘膜的表面,即其上形成Sn-Pb共结晶焊接层的表面涂布了粘合剂清漆。涂膜在80℃干燥20分钟后,即形成厚度为20μm的粘合层(粘合层108)。
另外,使用一种两面均覆盖铜膜的玻璃环氧层(SUMITOMO BAKELITECo.,Ltd.制造;ELC),其两面的铜箔厚度为12μm,并与FR-5相对应,通过选择性电解电镀金形成布线图(未在图中表示处)和连接层焊盘(连接层焊盘107),得到被连接层(被连接层120)。考虑到设置位置的允许误差,将连接层焊盘的直径调整为300μm。
按照上述步骤获得的连接层和被连接层,其预先形成的位置标示可通过一种图像识别仪器来读取,将两层相对放置,并在压力作用下,于100℃的温度下暂时地结合起来,使连接层表面和被连接层表面对接。观察暂时结合的样品的截面,发现焊接层和连接层焊盘之间没有相互接触,存在一个大约30μm的缝隙(粘合层)。
将暂时粘合的样品加热至焊料熔点温度或更高温度(183℃)后,。施加一定压力(条件③),即可获得一多层线路板。上述步骤中的温度和压力曲线如图7所示。
<观察加热步骤的焊接层>
在本实施例中,当暂时粘合的样品在条件③下被永久粘合,在样品被加热至焊料熔点或更高温度(183℃)后,在未加压的情况下取出,并将连接层和被连接层在层间界面处分开,即在粘合层处分开。检查在粘合前,是否由于粘合层清洁金属表面的功能而使焊接层被快速形成一个圆顶状。结果发现焊接层形成了一个圆顶状,并且其表面有一个平滑的不粗糙的曲线形状。
另外,按照与上述相同的步骤得到另一个多层线路板,不同之处是用粘合剂清漆3代替上述的粘合剂清漆2。粘合剂清漆3是通过在100g甲乙酮中的溶解200g二烯丙基二苯酚A型环氧树脂(NIPPON KAYAKU Co.,Lt制造;RE-810NM)和200g可溶可熔性甲酚型环氧树脂(NIPPON KAYAKU Co.,Ltd制造;EOCN-1020-65),然后加入0.1g的2-苯基-4,5-二羟基甲基咪唑(SHIKOKU KASEI KOGYO Co.,Ltd制造;2PHZ-PW)制备而得。
在加热步骤中观察所获得多层线路板的焊接层。结果发现焊接层的形状几乎没有发生变化,也没有观察到圆顶形状。
当粘合层采用的粘合剂清漆3不具有清洁表面功能时,在条件③下的加热步骤中,焊接层表面的氧化膜没有被彻底地清除,焊接层表面状况几乎与电解电镀形成的焊接层的表面一样。相反,当具有清洁表面功能的粘合剂清漆2用于粘合层时,由于在条件③下的加热步骤中,焊接层表面的氧化膜得到彻底清除,当焊接层被熔化时,粘合层发生了变形,并形成了最稳定的圆顶形状。对该截面的观察同样也证实了,各层之间在没有粘合层存在的情况下也可实现粘合。因此建议,在加压步骤中,形成圆顶状的焊接层与被连接面在其顶端部位连接,焊料在焊接层表面以同心圆形状从接触点处润湿铺展开来,而粘合剂则被清除。
<焊接部位焊接强度的测定>
在压力作用下被永久粘合的多层线路板的连接层一侧的布线图被蚀刻至电路的厚度,从连接层和被连接层的层间界面,即粘合层处将其分开时,导体柱和绝缘层在界面处与连接层分开,导体柱仍保留在被连接层上。焊接在被连接层的连接层焊盘上的导体柱的排列形状是从连接层导体柱排列形状转变而来。被连接层上导体柱的剪切力通过使用一种通用的粘合测试仪测得(DEIZI公司生产;2400PC)。当使用粘合剂清漆2时,每个凸块的平均剪切力为402mN,当使用粘合剂清漆3时,其平均剪切力为206mN。
<金属连接部位的截面观察>
用电子显微镜(SEM)观察由上述方法获得的多层线路板与金属连接部位(被焊接部位)的一部分,检查焊接情况。当使用粘合剂清漆2时,金属的焊接状况很好;而使用粘合剂清漆3时,出现了部分焊接的现象。
比较实施例2
本实施例中的暂时粘合步骤与实施例2中的暂时粘合步骤相同。在对暂时粘合样品施加压力的同时,加热该样品。继续在压力作用下加热以实现持久的粘合(条件④),从而获得一多层线路板。温度和压力曲线见表7。
依照与实施例2相同的方法测试被焊接部位的粘合强度,每个凸块的平均剪切力为275mN。按照与实施例2相同的方法观察被焊接金属部位的截面,发现有部分焊接的现象。
在比较实施例2中,导体柱每个凸块的剪切力为275mN,而实施例2中为402mN。实施例2中的剪切力值大约是比较实施例2中值的1.5倍。暂时连接步骤得到的焊接层加热至焊料的熔点或更高温度,导致焊料熔化并形成凸起形状(圆顶状),在此后的施加压力步骤的重要性就明显地显示出来。这也在观察结果中被清楚地显示出来。
工业实用性
按照本发明,通过导电连接和层间粘合的同时进行,确保了层间的连接,并且高效率地生产出高可靠性的多层线路板。按照非流动欠充方法,将半导体倒装片有效地装配在线路基片上,可以高效率地生产出高可靠性的半导体装置。
Claims (48)
1、一种电子部件的生产方法,包括在加热情况下经粘合层将电子元件A压入电子元件B,从而将具有在顶端表面设置焊接层或焊接块的导体部分I的电子元件A和具有设置在与用于电连接的导体部分I相对位置处用于电连接的导体部分II的被连接电子元件B焊接起来,所述的电子部件包括多层线路板;所述的电子元件A包括连接层,其具有布线图、形成于所述布线图上的导体柱和形成于所述导体柱顶端表面的焊接层;而所述的电子元件B包括被连接层,其具有与导体柱连接的连接层焊盘,该方法包括:
将所述的焊接层或所述的焊接块中的至少一个与所述的粘合层相接触,
通过加热形成所述焊接层或所述焊接块的焊料至熔点温度或更高温度下,使所述焊接层或所述焊接块熔化,
通过挤压熔化的焊接层或熔化的焊接块而进行焊接,并
固化所述的粘合层。
2、根据权利要求1所述的电子部件的生产方法,其特征在于,所述的导体柱包括通过电解电镀形成的铜。
3、根据权利要求1-2中任意一项所述的电子部件的生产方法,其特征在于,所述的焊接层是通过电解电镀形成的。
4、根据权利要求1-2中任意一项所述的电子部件的生产方法,其特征在于,所述熔化的焊接层具有凸起形状。
5、根据权利要求3所述的电子部件的生产方法,其特征在于,所述熔化的焊接层具有凸起形状。
6、根据权利要求1或2所述的电子部件的生产方法,其特征在于,所述粘合层的厚度大于加热熔化的焊接层或焊接块的高度。
7、根据权利要求3所述的电子部件的生产方法,其特征在于,所述粘合层的厚度大于加热熔化的焊接层或焊接块的高度。
8、根据权利要求4所述的电子部件的生产方法,其特征在于,所述粘合层的厚度大于加热熔化的焊接层或焊接块的高度。
9、根据权利要求5所述的电子部件的生产方法,其特征在于,所述粘合层的厚度大于加热熔化的焊接层或焊接块的高度。
10、根据权利要求1或2所述的电子部件的生产方法,其特征在于,通过将焊料加热至其熔点或更高温度下,使所述的焊接层或焊接块在软化的粘合层内部被熔化。
11、根据权利要求6所述的电子部件的生产方法,其特征在于,通过将焊料加热至其熔点或更高温度下,使所述的焊接层或焊接块在软化的粘合层内部被熔化。
12、根据权利要求5所述的电子部件的生产方法,其特征在于,在焊接之前,所述熔化的、具有凸起形状的焊接层或焊接块与用于电连接的导体部分II相互不接触。
13、根据权利要求6所述的电子部件的生产方法,其特征在于,在焊接之前,所述熔化的、具有凸起形状的焊接层或焊接块与用于电连接的导体部分II相互不接触。
14、根据权利要求10所述的电子部件的生产方法,其特征在于,在焊接之前,所述熔化的、具有凸起形状的焊接层或焊接块与用于电连接的导体部分II相互不接触。
15、根据权利要求11所述的电子部件的生产方法,其特征在于,在焊接之前,所述熔化的、具有凸起形状的焊接层或焊接块与用于电连接的导体部分II相互不接触。
16、根据权利要求5所述的电子部件的生产方法,其特征在于,所述熔化的、具有凸起形状的焊接层或焊接块被焊接到用于电连接的导体部分II上,焊接的方式为,焊料在压力作用下,从熔化状态的焊接层或焊接块的顶端部位,通过润湿用于电连接的导体部分II的表面铺展开来。
17、根据权利要求6所述的电子部件的生产方法,其特征在于,所述熔化的、具有凸起形状的焊接层或焊接块被焊接到用于电连接的导体部分II上,焊接的方式为,焊料在压力作用下,从熔化状态的焊接层或焊接块的顶端部位,通过润湿用于电连接的导体部分II的表面铺展开来。
18、根据权利要求10所述的电子部件的生产方法,其特征在于,所述熔化的、具有凸起形状的焊接层或焊接块被焊接到用于电连接的导体部分II上,焊接的方式为,焊料在压力作用下,从熔化状态的焊接层或焊接块的顶端部位,通过润湿用于电连接的导体部分II的表面铺展开来。
19、根据权利要求13所述的电子部件的生产方法,其特征在于,所述熔化的、具有凸起形状的焊接层或焊接块被焊接到用于电连接的导体部分II上,焊接的方式为,焊料在压力作用下,从熔化状态的焊接层或焊接块的顶端部位,通过润湿用于电连接的导体部分II的表面铺展开来。
20、根据权利要求1或2所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
21、根据权利要求6所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
22、根据权利要求10所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
23、根据权利要求11所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
24、根据权利要求13所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
25、根据权利要求17所述的电子部件的生产方法,其特征在于,用于所述粘合层的粘合剂具有清洁焊接表面的功能,并在加热的过程中清洁焊接层或焊接凸起的表面。
26、根据权利要求20所述的电子部件的生产方法,其特征在于,当加热形成焊接层或焊接块的焊料至其熔点温度或更高温度,使焊接层或焊接块熔化,并通过挤压熔化的焊接层或焊接块完成焊接时,在焊接温度下,用于粘合层的粘合剂的粘度为50Pa.s或更小。
27、根据权利要求21所述的电子部件的生产方法,其特征在于,当加热形成焊接层或焊接块的焊料至其熔点温度或更高温度,使焊接层或焊接块熔化,并通过挤压熔化的焊接层或焊接块完成焊接时,在焊接温度下,用于粘合层的粘合剂的粘度为50Pa.s或更小。
28、根据权利要求20所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括一种含至少一个酚羟基的化合物A和作为必要成分化合物A的固化剂的树脂B。
29、根据权利要求21所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括一种含至少一个酚羟基的化合物A和作为必要成分化合物A的固化剂的树脂B。
30、根据权利要求26所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括一种含至少一个酚羟基的化合物A和作为必要成分化合物A的固化剂的树脂B。
31、根据权利要求27所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括一种含至少一个酚羟基的化合物A和作为必要成分化合物A的固化剂的树脂B。
32、根据权利要求28所述的电子部件的生产方法,其特征在于,所述具有至少一个酚羟基的化合物A选自可溶可熔性酚醛树脂、可溶可熔性烷基苯酚树脂、可溶可熔性多功能酚醛树脂、苯酚芳烷基树脂、可溶性酚醛树脂、聚乙烯苯酚树脂、酚酞和二羟基苯甲酸。
33、根据权利要求29所述的电子部件的生产方法,其特征在于,所述具有至少一个酚羟基的化合物A选自可溶可熔性酚醛树脂、可溶可熔性烷基苯酚树脂、可溶可熔性多功能酚醛树脂、苯酚芳烷基树脂、可溶性酚醛树脂、聚乙烯苯酚树脂、酚酞和二羟基苯甲酸。
34、根据权利要求30所述的电子部件的生产方法,其特征在于,所述具有至少一个酚羟基的化合物A选自可溶可熔性酚醛树脂、可溶可熔性烷基苯酚树脂、可溶可熔性多功能酚醛树脂、苯酚芳烷基树脂、可溶性酚醛树脂、聚乙烯苯酚树脂、酚酞和二羟基苯甲酸。
35、根据权利要求31所述的电子部件的生产方法,其特征在于,所述具有至少一个酚羟基的化合物A选自可溶可熔性酚醛树脂、可溶可熔性烷基苯酚树脂、可溶可熔性多功能酚醛树脂、苯酚芳烷基树脂、可溶性酚醛树脂、聚乙烯苯酚树脂、酚酞和二羟基苯甲酸。
36、根据权利要求27所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括含至少一个酚羟基的化合物A,其含量范围在大于等于5%且小于等于80%的范围内。
37、根据权利要求29所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括含至少一个酚羟基的化合物A,其含量范围在大于等于5%且小于等于80%的范围内。
38、根据权利要求32所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括含至少一个酚羟基的化合物A,其含量范围在大于等于5%且小于等于80%的范围内。
39、根据权利要求33所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括含至少一个酚羟基的化合物A,其含量范围在大于等于5%且小于等于80%的范围内。
40、根据权利要求20所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括环氧树脂A’和化合物B’,化合物B’含有咪唑环,并作为必要成分环氧树脂A’的固化剂。
41、根据权利要求21所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括环氧树脂A’和化合物B’,化合物B’含有咪唑环,并作为必要成分环氧树脂A’的固化剂。
42、根据权利要求26所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括环氧树脂A’和化合物B’,化合物B’含有咪唑环,并作为必要成分环氧树脂A’的固化剂。
43、根据权利要求27所述的电子部件的生产方法,其特征在于,所述用于粘合层的粘合剂包括环氧树脂A’和化合物B’,化合物B’含有咪唑环,并作为必要成分环氧树脂A’的固化剂。
44、根据权利要求40所述的电子部件的生产方法,其特征在于,所述用作粘合层的粘合剂包括作为固化剂的化合物B’,其重量含量范围在大于等于1%且小于等于10%的范围内。
45、根据权利要求41所述的电子部件的生产方法,其特征在于,所述用作粘合层的粘合剂包括作为固化剂的化合物B’,其重量含量范围在大于等于1%且小于等于10%的范围内。
46、根据权利要求42所述的电子部件的生产方法,其特征在于,所述用作粘合层的粘合剂包括作为固化剂的化合物B’,其重量含量范围在大于等于1%且小于等于10%的范围内。
47、根据权利要求43所述的电子部件的生产方法,其特征在于,所述用作粘合层的粘合剂包括作为固化剂的化合物B’,其重量含量范围在大于等于1%且小于等于10%的范围内。
48、一种按照权利要求1-47中任意一项所述的方法生产得到的电子部件。
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EP1395101A4 (en) | 2006-12-06 |
US20040105223A1 (en) | 2004-06-03 |
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