CN1290194C - 电容元件、半导体存储器及其制备方法 - Google Patents

电容元件、半导体存储器及其制备方法 Download PDF

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Publication number
CN1290194C
CN1290194C CN02124394.8A CN02124394A CN1290194C CN 1290194 C CN1290194 C CN 1290194C CN 02124394 A CN02124394 A CN 02124394A CN 1290194 C CN1290194 C CN 1290194C
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China
Prior art keywords
barrier layer
film
insulating properties
lower electrode
dielectric
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Expired - Fee Related
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CN02124394.8A
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English (en)
Chinese (zh)
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CN1393931A (zh
Inventor
长野能久
藤井英治
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN1393931A publication Critical patent/CN1393931A/zh
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Publication of CN1290194C publication Critical patent/CN1290194C/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
CN02124394.8A 2001-06-25 2002-06-21 电容元件、半导体存储器及其制备方法 Expired - Fee Related CN1290194C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001191524 2001-06-25
JP2001191524 2001-06-25
JP2001-191524 2001-06-25

Publications (2)

Publication Number Publication Date
CN1393931A CN1393931A (zh) 2003-01-29
CN1290194C true CN1290194C (zh) 2006-12-13

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Family Applications (1)

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CN02124394.8A Expired - Fee Related CN1290194C (zh) 2001-06-25 2002-06-21 电容元件、半导体存储器及其制备方法

Country Status (3)

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US (1) US6730951B2 (fr)
EP (2) EP2172964A3 (fr)
CN (1) CN1290194C (fr)

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AR028948A1 (es) * 2000-06-20 2003-05-28 Astrazeneca Ab Compuestos novedosos
JP3931113B2 (ja) * 2002-06-10 2007-06-13 松下電器産業株式会社 半導体装置及びその製造方法
JP3836052B2 (ja) * 2002-06-25 2006-10-18 沖電気工業株式会社 半導体素子及びその製造方法
KR100536590B1 (ko) * 2002-09-11 2005-12-14 삼성전자주식회사 강유전체 커패시터 및 그 제조 방법
TWI229935B (en) * 2002-11-13 2005-03-21 Matsushita Electric Ind Co Ltd Semiconductor device and method for fabricating the same
US6746877B1 (en) * 2003-01-07 2004-06-08 Infineon Ag Encapsulation of ferroelectric capacitors
US7042705B2 (en) * 2003-01-30 2006-05-09 Infineon Technologies Ag Sidewall structure and method of fabrication for reducing oxygen diffusion to contact plugs during CW hole reactive ion etch processing
US6933549B2 (en) * 2003-02-28 2005-08-23 Infineon Technologies Aktiengesellschaft Barrier material
JP2004281965A (ja) * 2003-03-19 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2004281956A (ja) * 2003-03-19 2004-10-07 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US7642583B2 (en) * 2003-04-25 2010-01-05 Panasonic Corporation Ferroelectric memory device
CN100470806C (zh) * 2003-05-27 2009-03-18 松下电器产业株式会社 半导体器件的制造方法
JP2004356464A (ja) * 2003-05-30 2004-12-16 Oki Electric Ind Co Ltd 強誘電体素子の製造方法、強誘電体素子及びＦｅＲＡＭ
JP4313628B2 (ja) * 2003-08-18 2009-08-12 パナソニック株式会社 半導体レーザおよびその製造方法
CN100377357C (zh) * 2003-10-22 2008-03-26 松下电器产业株式会社 半导体装置及其制造方法
KR100818267B1 (ko) * 2003-10-27 2008-03-31 삼성전자주식회사 커패시터, 이를 구비한 반도체 소자 및 그 제조 방법
JP3810411B2 (ja) * 2004-01-23 2006-08-16 Ｎｅｃエレクトロニクス株式会社 集積回路装置
US6982448B2 (en) * 2004-03-18 2006-01-03 Texas Instruments Incorporated Ferroelectric capacitor hydrogen barriers and methods for fabricating the same
JP4800627B2 (ja) * 2004-03-24 2011-10-26 セイコーエプソン株式会社 強誘電体メモリ素子
JP4105656B2 (ja) * 2004-05-13 2008-06-25 株式会社東芝 半導体装置及びその製造方法
JP2006005234A (ja) * 2004-06-18 2006-01-05 Seiko Epson Corp 半導体装置の製造方法及び半導体装置
JP4042730B2 (ja) * 2004-09-02 2008-02-06 セイコーエプソン株式会社 強誘電体メモリおよびその製造方法
JP4375561B2 (ja) * 2004-12-28 2009-12-02 セイコーエプソン株式会社 半導体記憶装置及びその製造方法
JP2006203129A (ja) * 2005-01-24 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US7118959B2 (en) * 2005-03-10 2006-10-10 Texas Instruments Incorporated Integrated circuit capacitor having antireflective dielectric
JP4637733B2 (ja) * 2005-11-30 2011-02-23 富士通セミコンダクター株式会社 半導体装置およびその製造方法
JP2007234743A (ja) * 2006-02-28 2007-09-13 Seiko Epson Corp 半導体記憶装置および半導体記憶装置の製造方法
WO2007102483A1 (fr) * 2006-03-08 2007-09-13 Matsushita Electric Industrial Co., Ltd. Element et dispositif de stockage non volatile et leur procede de fabrication
JP4137994B2 (ja) * 2006-11-20 2008-08-20 松下電器産業株式会社 不揮発性記憶素子、不揮発性記憶素子アレイおよびその製造方法
KR102184355B1 (ko) * 2014-09-16 2020-11-30 삼성전자주식회사 반도체 소자
US10615176B2 (en) 2017-11-22 2020-04-07 International Business Machine Corporation Ferro-electric complementary FET
JP2022527654A (ja) * 2019-04-08 2022-06-02 ケプラー コンピューティング インコーポレイテッド ドープされた極性層及びそれを組み込んだ半導体デバイス

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118355A (ja) 1997-06-16 1999-01-12 Nec Corp 強誘電体メモリ
KR100269306B1 (ko) * 1997-07-31 2000-10-16 윤종용 저온처리로안정화되는금속산화막으로구성된완충막을구비하는집적회로장치및그제조방법
JP3090198B2 (ja) * 1997-08-21 2000-09-18 日本電気株式会社 半導体装置の構造およびその製造方法
JPH11126881A (ja) 1997-10-23 1999-05-11 Hitachi Ltd 高強誘電体薄膜コンデンサを有する半導体装置及びその製造方法
JP3542704B2 (ja) * 1997-10-24 2004-07-14 シャープ株式会社 半導体メモリ素子
JP3212930B2 (ja) * 1997-11-26 2001-09-25 日本電気株式会社 容量及びその製造方法
KR100436058B1 (ko) 1997-12-27 2004-12-17 주식회사 하이닉스반도체 강유전체 캐패시터 형성 방법
KR100292819B1 (ko) * 1998-07-07 2001-09-17 윤종용 커패시터및그의제조방법
US6509601B1 (en) * 1998-07-31 2003-01-21 Samsung Electronics Co., Ltd. Semiconductor memory device having capacitor protection layer and method for manufacturing the same
US6249014B1 (en) * 1998-10-01 2001-06-19 Ramtron International Corporation Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices
US6225656B1 (en) * 1998-12-01 2001-05-01 Symetrix Corporation Ferroelectric integrated circuit with protective layer incorporating oxygen and method for fabricating same
JP3495955B2 (ja) * 1999-03-26 2004-02-09 シャープ株式会社 半導体メモリ装置及びその製造方法
TW454330B (en) 1999-05-26 2001-09-11 Matsushita Electronics Corp Semiconductor apparatus and its manufacturing method
DE10000005C1 (de) * 2000-01-03 2001-09-13 Infineon Technologies Ag Verfahren zur Herstellung eines ferroelektrischen Halbleiterspeichers
KR100500938B1 (ko) * 2000-12-30 2005-07-14 주식회사 하이닉스반도체 캐패시터 제조 방법
KR100406536B1 (ko) * 2001-03-28 2003-11-20 주식회사 하이닉스반도체 산소확산방지막으로서 알루미늄 산화막을 구비하는강유전체 메모리 소자 및 그 제조 방법

Also Published As

Publication number Publication date
CN1393931A (zh) 2003-01-29
EP1271624A2 (fr) 2003-01-02
US20020195633A1 (en) 2002-12-26
US6730951B2 (en) 2004-05-04
EP2172964A3 (fr) 2010-05-19
EP2172964A2 (fr) 2010-04-07
EP1271624A3 (fr) 2007-09-05

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Granted publication date: 20061213

Termination date: 20110621