CN1216635A - 碳化硅上的锇整流肖特基和欧姆连接以及W/WC/TiC欧姆接触 - Google Patents

碳化硅上的锇整流肖特基和欧姆连接以及W/WC/TiC欧姆接触 Download PDF

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CN1216635A
CN1216635A CN97193978A CN97193978A CN1216635A CN 1216635 A CN1216635 A CN 1216635A CN 97193978 A CN97193978 A CN 97193978A CN 97193978 A CN97193978 A CN 97193978A CN 1216635 A CN1216635 A CN 1216635A
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layer
contact
type
sic
substrate
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詹姆斯·D·帕森斯
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3C Semiconductor Corp
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3C Semiconductor Corp
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    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
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CN97193978A 1996-03-07 1997-03-04 碳化硅上的锇整流肖特基和欧姆连接以及W/WC/TiC欧姆接触 Pending CN1216635A (zh)

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CN103208490A (zh) * 2012-01-11 2013-07-17 朱江 一种具有导体的半导体装置及其制备方法
CN104037075A (zh) * 2014-06-12 2014-09-10 中国电子科技集团公司第五十五研究所 耐高温处理的碳化硅背面金属加厚方法
CN104538294A (zh) * 2015-01-04 2015-04-22 中国科学院半导体研究所 一种碳化硅欧姆接触电极及其制作方法
CN104918823A (zh) * 2013-01-15 2015-09-16 康斯博格汽车股份公司 具有沿着预定路径向区间提供可变温度的电加热的加热元件的座椅组件
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CN102668040A (zh) * 2009-10-01 2012-09-12 丰田自动车株式会社 半导体装置以及半导体装置的制造方法
CN103208490A (zh) * 2012-01-11 2013-07-17 朱江 一种具有导体的半导体装置及其制备方法
CN108807168A (zh) * 2012-06-27 2018-11-13 飞兆半导体公司 功率整流器件
CN108807168B (zh) * 2012-06-27 2023-04-11 飞兆半导体公司 功率整流器件
CN104918823A (zh) * 2013-01-15 2015-09-16 康斯博格汽车股份公司 具有沿着预定路径向区间提供可变温度的电加热的加热元件的座椅组件
CN104037075A (zh) * 2014-06-12 2014-09-10 中国电子科技集团公司第五十五研究所 耐高温处理的碳化硅背面金属加厚方法
CN104037075B (zh) * 2014-06-12 2017-01-04 中国电子科技集团公司第五十五研究所 耐高温处理的碳化硅背面金属加厚方法
CN104538294A (zh) * 2015-01-04 2015-04-22 中国科学院半导体研究所 一种碳化硅欧姆接触电极及其制作方法

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US6150246A (en) 2000-11-21
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CA2248803A1 (en) 1997-09-12
US5929523A (en) 1999-07-27
JP2000507043A (ja) 2000-06-06
AU2069497A (en) 1997-09-22
EP0944917A1 (en) 1999-09-29
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