JP6584879B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6584879B2 JP6584879B2 JP2015179034A JP2015179034A JP6584879B2 JP 6584879 B2 JP6584879 B2 JP 6584879B2 JP 2015179034 A JP2015179034 A JP 2015179034A JP 2015179034 A JP2015179034 A JP 2015179034A JP 6584879 B2 JP6584879 B2 JP 6584879B2
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- 239000004065 semiconductor Substances 0.000 title claims description 68
- 239000010936 titanium Substances 0.000 claims description 81
- 229910052751 metal Inorganic materials 0.000 claims description 80
- 239000002184 metal Substances 0.000 claims description 80
- 239000012535 impurity Substances 0.000 claims description 52
- 229910052719 titanium Inorganic materials 0.000 claims description 42
- 229910052735 hafnium Inorganic materials 0.000 claims description 41
- 239000011575 calcium Substances 0.000 claims description 38
- 239000010955 niobium Substances 0.000 claims description 38
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 34
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 33
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 28
- 229910044991 metal oxide Inorganic materials 0.000 claims description 27
- 150000004706 metal oxides Chemical class 0.000 claims description 27
- 229910052715 tantalum Inorganic materials 0.000 claims description 23
- 229910052788 barium Inorganic materials 0.000 claims description 22
- 229910052791 calcium Inorganic materials 0.000 claims description 22
- 229910052712 strontium Inorganic materials 0.000 claims description 22
- 229910052758 niobium Inorganic materials 0.000 claims description 20
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
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- 239000001301 oxygen Substances 0.000 claims description 17
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 16
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 14
- 229910002113 barium titanate Inorganic materials 0.000 claims description 14
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 14
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 14
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- 230000001419 dependent effect Effects 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 101
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 91
- 239000010410 layer Substances 0.000 description 62
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
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- 229910052782 aluminium Inorganic materials 0.000 description 13
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- 238000000034 method Methods 0.000 description 13
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- 230000015556 catabolic process Effects 0.000 description 12
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 238000002425 crystallisation Methods 0.000 description 7
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- 239000007769 metal material Substances 0.000 description 7
- 238000000137 annealing Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 229910052814 silicon oxide Inorganic materials 0.000 description 4
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- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
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- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
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- 229910052693 Europium Inorganic materials 0.000 description 1
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
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- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052773 Promethium Inorganic materials 0.000 description 1
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- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
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- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
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- 238000002513 implantation Methods 0.000 description 1
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- 238000005468 ion implantation Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
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- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- VQMWBBYLQSCNPO-UHFFFAOYSA-N promethium atom Chemical compound [Pm] VQMWBBYLQSCNPO-UHFFFAOYSA-N 0.000 description 1
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- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
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- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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Description
本実施形態の半導体装置は、n型のSiC領域と、金属層と、n型のSiC領域と金属層との間に設けられ、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)から成る群から選ばれる少なくとも一つの元素を含む導電膜と、を備える。
本実施形態の半導体装置は、n型のSiC領域と、金属層と、n型のSiC領域と金属層との間に設けられ、カルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素と、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)、タンタル(Ta)、スカンジウム(Sc)、イットリウム(Y)及びランタノイドから成る群から選ばれる少なくとも一つの元素を含む導電膜と、を備える。
本実施形態の半導体装置は、MOSFETである点で第1の実施形態と異なる。導電膜の構成、作用等、第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、第1及び第2の導電膜にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、第1及び第2の導電膜に含まれ得る元素が異なる点、以外は、第3の実施形態と同様である。したがって、第3の実施形態と重複する内容については記述を省略する。また、導電膜の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、トレンチゲート構造のMOSFETである点で第3の実施形態と異なる。第3の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、第1及び第2の導電膜にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、第1及び第2の導電膜に含まれ得る元素が異なる点、以外は、第5の実施形態と同様である。したがって、第5の実施形態と重複する内容については記述を省略する。また、導電膜の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、スーパージャンクション構造のMOSFETである点で第3の実施形態と異なる。第3の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、第1及び第2の導電膜にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、第1及び第2の導電膜に含まれ得る元素が異なる点、以外は、第7の実施形態と同様である。したがって、第7の実施形態と重複する内容については記述を省略する。また、導電膜の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、スーパージャンクション構造のMOSFETである点で第5の実施形態と異なる。第5の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、第1及び第2の導電膜にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、第1及び第2の導電膜に含まれ得る元素が異なる点、以外は、第9の実施形態と同様である。したがって、第9の実施形態と重複する内容については記述を省略する。また、導電膜の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、IGBT(Inulated Gate Bipolar Transistor)である点で第3の実施形態と異なる。第3の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、導電膜にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、導電膜に含まれ得る元素が異なる点、以外は、第11の実施形態と同様である。したがって、第11の実施形態と重複する内容については記述を省略する。また、導電膜の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
16 導電膜
18 カソード領域(n型のSiC領域)
32 ソース電極(第2の金属層)
34 ドレイン電極(第1の金属層)
42 第1の導電膜
44 第2の導電膜
46 ドレイン領域(n型の第1のSiC領域)
52 ソース領域(n型の第2のSiC領域)
54 ウェルコンタクト領域(p型のSiC領域)
100 PINダイオード(半導体装置)
132 エミッタ電極(金属層)
144 導電膜
152 エミッタ領域(n型のSiC領域)
154 ベースコンタクト領域(p型のSiC領域)
200 MOSFET(半導体装置)
300 MOSFET(半導体装置)
400 MOSFET(半導体装置)
500 MOSFET(半導体装置)
600 IGBT(半導体装置)
Claims (13)
- n型のSiC領域と、
金属層と、
前記n型のSiC領域と前記金属層との間に設けられ、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)から成る群から選ばれる少なくとも一つの元素を含む導電膜と、
を備え、
前記導電膜中の前記元素の濃度が1×10 19 cm −3 以上である半導体装置。 - 前記導電膜中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が、0.5以上0.8以下である請求項1記載の半導体装置。
- 前記導電膜が金属酸化物を含む請求項1又は請求項2記載の半導体装置。
- 前記n型のSiC領域のn型不純物の濃度が1×1019cm−3以上である請求項1乃至請求項3いずれか一項記載の半導体装置。
- p型のSiC領域を更に備え、前記金属層が前記p型のSiC領域と前記導電膜とに接する請求項1乃至請求項4いずれか一項記載の半導体装置。
- n型のSiC領域と、
金属層と、
前記n型のSiC領域と前記金属層との間に設けられ、カルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素と、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)、タンタル(Ta)、スカンジウム(Sc)、イットリウム(Y)及びランタノイドから成る群から選ばれる少なくとも一つの元素を含む導電膜と、
を備え、
前記導電膜中の前記元素の濃度が1×10 19 cm −3 以上である半導体装置。 - 前記導電膜中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が、0.5以上0.8以下である請求項6記載の半導体装置。
- 前記導電膜が金属酸化物を含む請求項6又は請求項7記載の半導体装置。
- 前記導電膜がチタン酸カルシウム、チタン酸ストロンチウム又はチタン酸バリウムを含む請求項6乃至請求項8いずれか一項記載の半導体装置。
- 前記n型のSiC領域のn型不純物の濃度が1×1019cm−3以上である請求項6乃至請求項9いずれか一項記載の半導体装置。
- p型のSiC領域を更に備え、前記金属層が前記p型のSiC領域と前記導電膜とに接する請求項6乃至請求項10いずれか一項記載の半導体装置。
- 前記導電膜が鉛(Pb)を含む請求項6乃至請求項11いずれか一項記載の半導体装置。
- 前記導電膜の電気抵抗の温度依存性が150℃以上200℃以下の温度で負の依存性から正の依存性に転ずる請求項6乃至請求項12いずれか一項記載の半導体装置。
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