JP6584881B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6584881B2 JP6584881B2 JP2015179036A JP2015179036A JP6584881B2 JP 6584881 B2 JP6584881 B2 JP 6584881B2 JP 2015179036 A JP2015179036 A JP 2015179036A JP 2015179036 A JP2015179036 A JP 2015179036A JP 6584881 B2 JP6584881 B2 JP 6584881B2
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- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
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- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
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- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41775—Source or drain electrodes for field effect devices characterised by the proximity or the relative position of the source or drain electrode and the gate electrode, e.g. the source or drain electrode separated from the gate electrode by side-walls or spreading around or above the gate electrode
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
Description
本実施形態の半導体装置は、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)から成る群から選ばれる少なくとも一つの元素を含む導電領域と、n型の第1のSiC領域と、導電領域とn型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、ゲート電極と、導電領域、p型の第2のSiC領域、及び、n型の第1のSiC領域と、ゲート電極との間に設けられたゲート絶縁膜と、を備える。
本実施形態の半導体装置は、カルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素と、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)、タンタル(Ta)、スカンジウム(Sc)、イットリウム(Y)及びランタノイドから成る群から選ばれる少なくとも一つの元素を含む導電領域と、n型の第1のSiC領域と、導電領域とn型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、ゲート電極と、導電領域、p型の第2のSiC領域、及び、n型の第1のSiC領域と、ゲート電極との間に設けられたゲート絶縁膜と、を備える。
本実施形態の半導体装置は、ソース電極とSiC層との間に金属シリサイド膜が設けられる点で、第1の実施形態と異なっている。以下、第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、ソース領域にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、ソース領域に含まれ得る元素が異なる点、以外は、第3の実施形態と同様である。したがって、第3の実施形態と重複する内容については記述を省略する。また、ソース領域の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、トレンチゲート構造のMOSFETである点で第1の実施形態と異なる。以下、第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、ソース領域にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、ソース領域に含まれ得る元素が異なる点、以外は、第5の実施形態と同様である。したがって、第5の実施形態と重複する内容については記述を省略する。また、ソース領域の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、IGBT(Inulated Gate Bipolar Transistor)である点で第1の実施形態と異なる。第1の実施形態と重複する内容については記述を省略する。
本実施形態の半導体装置は、エミッタ領域にカルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素が含まれる点、エミッタ領域に含まれ得る不純物元素が異なる点、以外は、第7の実施形態と同様である。したがって、第7の実施形態と重複する内容については記述を省略する。また、エミッタ領域の構成、作用等で、第1又は第2の実施形態と重複する内容については記述を省略する。
18 ゲート電極
24 ドリフト領域(n型の第1のSiC領域)
26 ウェル領域(p型の第2のSiC領域)
30 ソース領域(導電領域)
32 ウェルコンタクト領域(p型の第3のSiC領域)
100 MOSFET(半導体装置)
116 ゲート絶縁膜
118 ゲート電極
124 ドリフト領域(n型の第1のSiC領域)
126 ベース領域(p型の第2のSiC領域)
130 エミッタ領域(導電領域)
132 ベースコンタクト領域(p型の第3のSiC領域)
200 MOSFET(半導体装置)
300 MOSFET(半導体装置)
400 IGBT(半導体装置)
Claims (15)
- チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)から成る群から選ばれる少なくとも一つの元素を含む導電領域と、
n型の第1のSiC領域と、
前記導電領域と前記n型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、
ゲート電極と、
前記導電領域、前記p型の第2のSiC領域、及び、前記n型の第1のSiC領域と、前記ゲート電極との間に設けられたゲート絶縁膜と、
を備え、
前記導電領域中の前記元素の濃度が1×10 19 cm −3 以上である半導体装置。 - チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)及びタンタル(Ta)から成る群から選ばれる少なくとも一つの元素を含む導電領域と、
n型の第1のSiC領域と、
前記導電領域と前記n型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、
ゲート電極と、
前記導電領域、前記p型の第2のSiC領域、及び、前記n型の第1のSiC領域と、前記ゲート電極との間に設けられたゲート絶縁膜と、
を備え、
前記導電領域中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が0.8以下である半導体装置。 - 前記導電領域中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が0.5以上である請求項2記載の半導体装置。
- 前記導電領域が金属酸化物を含む請求項1乃至請求項3いずれか一項記載の半導体装置。
- 前記p型の第2のSiC領域のp型不純物の濃度が1×1017cm−3以下である請求項1乃至請求項4いずれか一項記載の半導体装置。
- 前記p型の第2のSiC領域内に、前記導電領域の側方に設けられ、前記p型の第2のSiC領域のp型不純物の濃度よりも高いp型不純物の濃度を有し、前記導電領域よりも深いp型の第3のSiC領域と、を更に備える請求項1乃至請求項5いずれか一項記載の半導体装置。
- カルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素と、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)、タンタル(Ta)、スカンジウム(Sc)、イットリウム(Y)及びランタノイドから成る群から選ばれる少なくとも一つの元素を含む導電領域と、
n型の第1のSiC領域と、
前記導電領域と前記n型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、
ゲート電極と、
前記導電領域、前記p型の第2のSiC領域、及び、前記n型の第1のSiC領域と、前記ゲート電極との間に設けられたゲート絶縁膜と、
を備え、
前記導電領域中の前記元素の濃度が1×10 19 cm −3 以上である半導体装置。 - カルシウム(Ca)、ストロンチウム(Sr)及びバリウム(Ba)から成る群から選ばれる少なくとも一つの金属元素と、チタン(Ti)と、酸素(O)と、ジルコニウム(Zr)又はハフニウム(Hf)と、を含み、バナジウム(V)、ニオブ(Nb)、タンタル(Ta)、スカンジウム(Sc)、イットリウム(Y)及びランタノイドから成る群から選ばれる少なくとも一つの元素を含む導電領域と、
n型の第1のSiC領域と、
前記導電領域と前記n型の第1のSiC領域との間に設けられたp型の第2のSiC領域と、
ゲート電極と、
前記導電領域、前記p型の第2のSiC領域、及び、前記n型の第1のSiC領域と、前記ゲート電極との間に設けられたゲート絶縁膜と、
を備え、
前記導電領域中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が0.8以下である半導体装置。 - 前記導電領域中のチタンとジルコニウムとハフニウムに対するチタンの原子比(Ti/(Ti+Zr+Hf))が0.5以上である請求項8記載の半導体装置。
- 前記導電領域が金属酸化物を含む請求項7乃至請求項9いずれか一項記載の半導体装置。
- 前記導電領域がチタン酸カルシウム、チタン酸ストロンチウム又はチタン酸バリウムを含む請求項7乃至請求項10いずれか一項記載の半導体装置。
- 前記p型の第2のSiC領域のp型不純物の濃度が1×1017cm−3以下である請求項7乃至請求項11いずれか一項記載の半導体装置。
- 前記導電領域が鉛(Pb)を含む請求項7乃至請求項12いずれか一項記載の半導体装置。
- 前記導電領域の電気抵抗の温度依存性が150℃以上200℃以下の温度で負の依存性から正の依存性に転ずる請求項7乃至請求項13いずれか一項記載の半導体装置。
- 前記p型の第2のSiC領域内に、前記導電領域の側方に設けられ、前記p型の第2のSiC領域のp型不純物の濃度よりも高いp型不純物の濃度を有し、前記導電領域よりも深いp型の第3のSiC領域と、を更に備える請求項7乃至請求項14いずれか一項記載の半導体装置。
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