CN117957645A - 片粘贴装置以及片粘贴方法 - Google Patents
片粘贴装置以及片粘贴方法 Download PDFInfo
- Publication number
- CN117957645A CN117957645A CN202280061383.6A CN202280061383A CN117957645A CN 117957645 A CN117957645 A CN 117957645A CN 202280061383 A CN202280061383 A CN 202280061383A CN 117957645 A CN117957645 A CN 117957645A
- Authority
- CN
- China
- Prior art keywords
- pressing
- sheet
- adherend
- adhesive sheet
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 9
- 238000003825 pressing Methods 0.000 claims abstract description 145
- 239000000853 adhesive Substances 0.000 claims abstract description 103
- 230000001070 adhesive effect Effects 0.000 claims abstract description 103
- 238000003708 edge detection Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 238000012840 feeding operation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006837 decompression Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
- B65H35/002—Hand-held or table apparatus
- B65H35/0026—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape
- B65H35/0033—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape and affixing it to a surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2553/00—Sensing or detecting means
- B65H2553/80—Arangement of the sensing means
- B65H2553/81—Arangement of the sensing means on a movable element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Labeling Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-183935 | 2021-11-11 | ||
JP2021183935A JP2023071273A (ja) | 2021-11-11 | 2021-11-11 | シート貼付装置およびシート貼付方法 |
PCT/JP2022/039631 WO2023085074A1 (ja) | 2021-11-11 | 2022-10-25 | シート貼付装置およびシート貼付方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117957645A true CN117957645A (zh) | 2024-04-30 |
Family
ID=86335729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202280061383.6A Pending CN117957645A (zh) | 2021-11-11 | 2022-10-25 | 片粘贴装置以及片粘贴方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2023071273A (ko) |
KR (1) | KR20240101540A (ko) |
CN (1) | CN117957645A (ko) |
TW (1) | TW202335158A (ko) |
WO (1) | WO2023085074A1 (ko) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5112682B2 (ja) | 2006-12-18 | 2013-01-09 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP5043446B2 (ja) * | 2007-01-16 | 2012-10-10 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP2009220856A (ja) * | 2008-03-17 | 2009-10-01 | Sato Knowledge & Intellectual Property Institute | ハンドラベラ |
JP2010278272A (ja) * | 2009-05-29 | 2010-12-09 | Panasonic Corp | 固体撮像素子および固体撮像素子の製造方法 |
JP5384229B2 (ja) * | 2009-07-03 | 2014-01-08 | リンテック株式会社 | シート供給装置および供給方法、並びにシート貼付装置および貼付方法 |
JP5827023B2 (ja) * | 2011-03-29 | 2015-12-02 | リンテック株式会社 | シート貼付装置および貼付方法 |
JP5269229B2 (ja) * | 2012-04-06 | 2013-08-21 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP6177622B2 (ja) * | 2013-08-07 | 2017-08-09 | リンテック株式会社 | シート貼付装置及びシート貼付方法 |
JP6539523B2 (ja) * | 2015-07-07 | 2019-07-03 | リンテック株式会社 | シート供給装置および供給方法 |
JP2018047943A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社フェニックス | ラベル貼付装置および制御方法 |
JP7064868B2 (ja) * | 2017-12-26 | 2022-05-11 | リンテック株式会社 | シート供給装置およびシート供給方法、並びに、シート貼付装置およびシート貼付方法 |
JP2019127283A (ja) * | 2018-01-24 | 2019-08-01 | リンテック株式会社 | シート供給装置およびシート供給方法、並びに、シート貼付装置およびシート貼付方法 |
JP7067951B2 (ja) * | 2018-02-16 | 2022-05-16 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP7067963B2 (ja) * | 2018-03-01 | 2022-05-16 | リンテック株式会社 | シート供給装置およびシート供給方法、並びに、シート貼付装置およびシート貼付方法 |
JP2019153641A (ja) * | 2018-03-01 | 2019-09-12 | リンテック株式会社 | シート供給装置およびシート供給方法、並びに、シート貼付装置およびシート貼付方法 |
JP7390124B2 (ja) * | 2019-07-22 | 2023-12-01 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP7446071B2 (ja) * | 2019-09-20 | 2024-03-08 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
-
2021
- 2021-11-11 JP JP2021183935A patent/JP2023071273A/ja active Pending
-
2022
- 2022-10-25 WO PCT/JP2022/039631 patent/WO2023085074A1/ja active Application Filing
- 2022-10-25 CN CN202280061383.6A patent/CN117957645A/zh active Pending
- 2022-10-25 KR KR1020247007459A patent/KR20240101540A/ko unknown
- 2022-11-02 TW TW111141708A patent/TW202335158A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2023071273A (ja) | 2023-05-23 |
WO2023085074A1 (ja) | 2023-05-19 |
KR20240101540A (ko) | 2024-07-02 |
TW202335158A (zh) | 2023-09-01 |
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Legal Events
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---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |