CN1170963C - 一价铜无氰电镀液及使用该电镀液镀铜的方法 - Google Patents

一价铜无氰电镀液及使用该电镀液镀铜的方法 Download PDF

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Publication number
CN1170963C
CN1170963C CNB988051672A CN98805167A CN1170963C CN 1170963 C CN1170963 C CN 1170963C CN B988051672 A CNB988051672 A CN B988051672A CN 98805167 A CN98805167 A CN 98805167A CN 1170963 C CN1170963 C CN 1170963C
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CN
China
Prior art keywords
copper
electroplate liquid
prussiate
solution
succinimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB988051672A
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English (en)
Chinese (zh)
Other versions
CN1256722A (zh
Inventor
Wr
W·R·布拉斯奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
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Publication date
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Publication of CN1256722A publication Critical patent/CN1256722A/zh
Application granted granted Critical
Publication of CN1170963C publication Critical patent/CN1170963C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CNB988051672A 1997-03-18 1998-03-17 一价铜无氰电镀液及使用该电镀液镀铜的方法 Expired - Fee Related CN1170963C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/819,061 US5750018A (en) 1997-03-18 1997-03-18 Cyanide-free monovalent copper electroplating solutions
US08/819061 1997-03-18

Publications (2)

Publication Number Publication Date
CN1256722A CN1256722A (zh) 2000-06-14
CN1170963C true CN1170963C (zh) 2004-10-13

Family

ID=25227108

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988051672A Expired - Fee Related CN1170963C (zh) 1997-03-18 1998-03-17 一价铜无氰电镀液及使用该电镀液镀铜的方法

Country Status (7)

Country Link
US (1) US5750018A (https=)
EP (1) EP1009869B1 (https=)
JP (1) JP2001516400A (https=)
KR (1) KR100484965B1 (https=)
CN (1) CN1170963C (https=)
DE (1) DE69808497T2 (https=)
WO (1) WO1998041675A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103898489A (zh) * 2012-12-26 2014-07-02 罗门哈斯电子材料有限公司 无甲醛化学镀铜组合物及方法
CN104120468A (zh) * 2014-06-25 2014-10-29 济南大学 一种无氰亚铜电镀铜锌合金溶液
CN104120463A (zh) * 2014-06-25 2014-10-29 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6180524B1 (en) * 1999-08-09 2001-01-30 Gary W. Ferrell Metal deposit process
RU2179203C2 (ru) * 1999-11-16 2002-02-10 Калининградский государственный университет Электролит блестящего меднения
US6660154B2 (en) 2000-10-25 2003-12-09 Shipley Company, L.L.C. Seed layer
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20050183961A1 (en) * 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
CN1932084B (zh) * 2006-08-25 2010-05-12 卢月红 无氰电镀液添加剂及其溶液的制备方法
DE102008033174B3 (de) 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
RU2385366C1 (ru) * 2008-12-15 2010-03-27 Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта Электролит меднения стальных подложек
CN101665962B (zh) * 2009-09-04 2012-06-27 厦门大学 一种钢铁基底上碱性无氰镀铜电镀液及其制备方法
CN101922027B (zh) * 2010-08-19 2011-10-26 武汉风帆电镀技术有限公司 无氰碱性镀铜液及其制备方法
JP5996244B2 (ja) * 2011-04-19 2016-09-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 半導体上の銅のめっき
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
US20140008234A1 (en) * 2012-07-09 2014-01-09 Rohm And Haas Electronic Materials Llc Method of metal plating semiconductors
ES2685317T3 (es) * 2012-11-13 2018-10-08 Coventya Sas Solución alcalina, sin cianuro, para electrochapado de aleaciones de oro, un método para electrochapado y un sustrato que comprende un depósito brillante, sin corrosión, de una aleación de oro
CN103014787B (zh) * 2012-12-28 2016-04-20 广东达志环保科技股份有限公司 一种铜电镀液及其电镀工艺
JP6517501B2 (ja) * 2013-12-17 2019-05-22 Ykk株式会社 ストライク銅めっき液およびストライク銅めっき方法
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
CN103789801B (zh) * 2014-01-13 2017-03-15 浙江洽福科技有限公司 一种无氰预镀铜电镀液及其制备方法
CN103762009A (zh) * 2014-02-15 2014-04-30 芜湖鑫力管道技术有限公司 一种铜包黄铜复合线材及其生产方法
CN104131320A (zh) * 2014-06-25 2014-11-05 济南大学 一种含硫羰基络合剂的无氰亚铜电镀铜溶液及其稳定化方法
CN104141120B (zh) * 2014-07-01 2017-04-19 济南大学 一价铜化学镀铜液
KR102603763B1 (ko) * 2016-06-03 2023-11-16 에스케이온 주식회사 리튬 이차전지용 전극 집전체 및 그 제조방법
CN106011954B (zh) * 2016-07-25 2018-07-10 贵州大学 无氰电镀铜溶液及其制备方法及使用方法
WO2018110198A1 (ja) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 透明導電膜の形成方法及び電解メッキ用メッキ液
CN108149285A (zh) * 2017-12-28 2018-06-12 广东达志环保科技股份有限公司 无氰镀铜电镀液和电镀方法
CN110760904A (zh) * 2019-10-31 2020-02-07 武汉奥邦表面技术有限公司 一种无氰碱性亚铜镀铜添加剂
CN113549961B (zh) * 2021-07-26 2022-11-15 广州鸿葳科技股份有限公司 一种无氰无磷无氮一价铜镀铜溶液及其制备方法与应用
US12448695B2 (en) * 2022-06-23 2025-10-21 City University Of Hong Kong Method for recovering metal from waste printed circuit board and a cell thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
SU1294877A1 (ru) * 1983-12-05 1987-03-07 Предприятие П/Я М-5841 Электролит меднени и способ его приготовлени
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
JPS63303091A (ja) * 1987-06-03 1988-12-09 Toyobo Co Ltd Ｃｕ−Ｓメッキの方法
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103898489A (zh) * 2012-12-26 2014-07-02 罗门哈斯电子材料有限公司 无甲醛化学镀铜组合物及方法
CN103898489B (zh) * 2012-12-26 2016-08-24 罗门哈斯电子材料有限公司 无甲醛化学镀铜组合物及方法
CN104120468A (zh) * 2014-06-25 2014-10-29 济南大学 一种无氰亚铜电镀铜锌合金溶液
CN104120463A (zh) * 2014-06-25 2014-10-29 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104120468B (zh) * 2014-06-25 2016-08-03 济南大学 一种无氰亚铜电镀铜锌合金溶液

Also Published As

Publication number Publication date
US5750018A (en) 1998-05-12
EP1009869A1 (en) 2000-06-21
EP1009869B1 (en) 2002-10-02
DE69808497T2 (de) 2003-04-03
KR20000076336A (ko) 2000-12-26
WO1998041675A1 (en) 1998-09-24
KR100484965B1 (ko) 2005-04-25
CN1256722A (zh) 2000-06-14
JP2001516400A (ja) 2001-09-25
DE69808497D1 (de) 2002-11-07

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