CN1161842C - 带有微波双极晶体管的半导体器件 - Google Patents
带有微波双极晶体管的半导体器件 Download PDFInfo
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- CN1161842C CN1161842C CNB981025625A CN98102562A CN1161842C CN 1161842 C CN1161842 C CN 1161842C CN B981025625 A CNB981025625 A CN B981025625A CN 98102562 A CN98102562 A CN 98102562A CN 1161842 C CN1161842 C CN 1161842C
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- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 230000003071 parasitic effect Effects 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 claims abstract description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 30
- 229920005591 polysilicon Polymers 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 14
- 229910021332 silicide Inorganic materials 0.000 claims description 14
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 3
- 229910004205 SiNX Inorganic materials 0.000 claims 2
- 229910000629 Rh alloy Inorganic materials 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 156
- 229910004298 SiO 2 Inorganic materials 0.000 description 25
- 238000005516 engineering process Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 8
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 8
- 238000002955 isolation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052785 arsenic Inorganic materials 0.000 description 6
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17238697A JP3366919B2 (ja) | 1997-06-27 | 1997-06-27 | 半導体装置 |
JP172386/97 | 1997-06-27 | ||
JP172386/1997 | 1997-06-27 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004100012397A Division CN1516285A (zh) | 1997-06-27 | 1998-06-29 | 带有微波双极晶体管的半导体器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1204155A CN1204155A (zh) | 1999-01-06 |
CN1161842C true CN1161842C (zh) | 2004-08-11 |
Family
ID=15940969
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004100012397A Pending CN1516285A (zh) | 1997-06-27 | 1998-06-29 | 带有微波双极晶体管的半导体器件 |
CNB981025625A Expired - Fee Related CN1161842C (zh) | 1997-06-27 | 1998-06-29 | 带有微波双极晶体管的半导体器件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004100012397A Pending CN1516285A (zh) | 1997-06-27 | 1998-06-29 | 带有微波双极晶体管的半导体器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5986326A (zh) |
JP (1) | JP3366919B2 (zh) |
CN (2) | CN1516285A (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE511891C2 (sv) * | 1997-08-29 | 1999-12-13 | Ericsson Telefon Ab L M | Bipolär effekttransistor och framställningsförfarande |
US6417527B1 (en) | 1999-10-12 | 2002-07-09 | Matsushita Electric Industrial Co., Ltd. | Diode, method for fabricating the diode, and coplanar waveguide |
DE10134089A1 (de) * | 2001-07-13 | 2003-01-30 | Infineon Technologies Ag | Verfahren zur Herstellung eines Bipolartransistors mit Polysiliziumemitter |
US6541336B1 (en) * | 2002-05-15 | 2003-04-01 | International Business Machines Corporation | Method of fabricating a bipolar transistor having a realigned emitter |
US7229874B2 (en) * | 2003-08-08 | 2007-06-12 | Hrl Laboratories, Llc | Method and apparatus for allowing formation of self-aligned base contacts |
JP4029802B2 (ja) * | 2003-08-28 | 2008-01-09 | セイコーエプソン株式会社 | 電気光学装置の駆動回路、電気光学装置及び電子機器 |
FI117257B (fi) * | 2003-12-15 | 2006-08-15 | Nokia Corp | Menetelmä ja järjestely komponentin suojaamiseksi sähköstaattisilta häiriöiltä |
US6965133B2 (en) * | 2004-03-13 | 2005-11-15 | International Business Machines Corporation | Method of base formation in a BiCMOS process |
US6911681B1 (en) * | 2004-04-14 | 2005-06-28 | International Business Machines Corporation | Method of base formation in a BiCMOS process |
WO2010047280A1 (ja) * | 2008-10-21 | 2010-04-29 | 日本電気株式会社 | バイポーラトランジスタ |
JP2011119344A (ja) * | 2009-12-01 | 2011-06-16 | Panasonic Corp | 半導体装置及びその製造方法 |
WO2011077181A1 (en) | 2009-12-21 | 2011-06-30 | Nxp B.V. | Semiconductor device with multilayer contact and method of manufacturing the same |
CN103000680B (zh) * | 2012-12-18 | 2015-06-17 | 清华大学 | 具有电极屏蔽结构的异质结双极晶体管及其制备方法 |
CN103035687A (zh) * | 2012-12-20 | 2013-04-10 | 清华大学 | 外基区下具有低电阻屏蔽层的双极晶体管及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2720475B2 (ja) * | 1988-10-04 | 1998-03-04 | 日本電気株式会社 | 品質管理システム |
JPH02246223A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | 半導体装置の製造方法 |
KR920007211A (ko) * | 1990-09-06 | 1992-04-28 | 김광호 | 고속 바이폴라 트랜지스터 및 그의 제조방법 |
JP3186099B2 (ja) * | 1991-08-07 | 2001-07-11 | 日本電気株式会社 | バイポーラ論理回路 |
JP2723724B2 (ja) * | 1991-11-12 | 1998-03-09 | 日本電気アイシーマイコンシステム株式会社 | 半導体装置 |
JP2626535B2 (ja) * | 1993-12-28 | 1997-07-02 | 日本電気株式会社 | 半導体装置 |
KR0161415B1 (ko) * | 1995-06-29 | 1998-12-01 | 김광호 | BiCMOS 반도체장치 및 그 제조방법 |
-
1997
- 1997-06-27 JP JP17238697A patent/JP3366919B2/ja not_active Expired - Fee Related
-
1998
- 1998-06-26 US US09/105,409 patent/US5986326A/en not_active Expired - Fee Related
- 1998-06-29 CN CNA2004100012397A patent/CN1516285A/zh active Pending
- 1998-06-29 CN CNB981025625A patent/CN1161842C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH1116921A (ja) | 1999-01-22 |
CN1516285A (zh) | 2004-07-28 |
US5986326A (en) | 1999-11-16 |
CN1204155A (zh) | 1999-01-06 |
JP3366919B2 (ja) | 2003-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NEC COMPUND SEMICONDUCTOR DEVICES CO LTD Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20021228 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20021228 Address after: Kanagawa, Japan Applicant after: NEC Compund semiconductor Devices Co., Ltd. Address before: Tokyo, Japan Applicant before: NEC Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NEC COMPUND SEMICONDUCTOR DEVICES CO LTD Effective date: 20060519 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20060519 Address after: Kanagawa, Japan Patentee after: NEC Corp. Address before: Kanagawa, Japan Patentee before: NEC Compund semiconductor Devices Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040811 |